Flex pcb winding with thermal cooling

Patent metadata

Field	Value
Publication number	US-2025118476-A1
Application number	US-202418897388-A
Country	US
Kind code	A1
Filing date	Sep 26, 2024
Priority date	Oct 5, 2023
Publication date	Apr 10, 2025
Grant date	—

Abstract

The present disclosure provides a wireless power transfer system and a wireless power transfer assembly. In one aspect, a wireless power transfer assembly includes a flexible printed circuit board, which is also referred to as a flexible printed circuit board structure. The flexible printed circuit board includes a litz winding. The litz winding has multiple layers of electrically insulated strands. The wireless power transfer assembly also includes a ceramic heat sink. The ceramic heat sink is arranged relative to the flexible printed circuit board in a manner that dissipates heat away from the litz winding. In another aspect, a wireless power transfer system includes a transmit unit or receive unit having an input stage, a resonator, and the wireless power transfer assembly.

First claim

1 . A wireless power transfer assembly, comprising:
a flexible printed circuit board comprising a litz winding, the litz winding having multiple layers of electrically insulated strands; and a ceramic heat sink arranged relative to the flexible printed circuit board in a manner that dissipates heat away from the litz winding.

2 . The wireless power transfer assembly of claim 1 , wherein the flexible printed circuit board comprises a flexible insulating material, wherein at least two layers of the multiple layers are separated by the flexible insulating material, the flexible insulating material disposed between the at least two layers comprising a minimum thickness within a range of approximately 1 mil to 10 mil.

3 . The wireless power transfer assembly of claim 2 , wherein the flexible insulating material is comprised of one of polyester, an adhesive polyamide, or an adhesiveless polyamide.

4 . The wireless power transfer assembly of claim 1 , wherein the litz winding is comprised of a bendable, electrically conductive material.

5 . The wireless power transfer assembly of claim 4 , wherein the litz winding is comprised of an annealed copper.

6 . The wireless power transfer assembly of claim 1 , wherein the litz winding is comprised of the electrically insulated strands that are connected in a spiral or helical manner.

7 . The wireless power transfer assembly of claim 1 , wherein a first layer and a second layer of the multiple layers of the electrically insulated strands are connected using vias.

8 . The wireless power transfer assembly of claim 1 , wherein the ceramic heat sink comprises one or more fluid-carrying channels.

9 . The wireless power transfer assembly of claim 1 , wherein the ceramic heat sink is in contact with the flexible printed circuit board, the ceramic heat sink arranged adjacent to the flexible printed circuit board.

10 . The wireless power transfer assembly of claim 1 , further comprising an additional ceramic heat sink, wherein the certain heat sink and the additional ceramic heat sink are in contact with the flexible printed circuit board, the ceramic heat sink arranged adjacent to one side of the flexible printed circuit board and the additional ceramic heat sink arranged adjacent to another side of the flexible printed circuit board.

11 . A wireless power transfer system, comprising:
a transmit unit or receive unit having an input stage, a resonator, and an assembly, the assembly comprising: a flexible printed circuit board having a litz winding, the litz winding having multiple layers of electrically insulated strands; and a ceramic heat sink arranged relative to the flexible printed circuit board in a manner that dissipates heat away from the litz winding.

12 . The wireless power transfer system of claim 11 , wherein the flexible printed circuit board comprises a flexible insulating material, wherein at least two layers of the multiple layers are separated by the flexible insulating material, the flexible insulating material disposed between the at least two layers comprising a minimum thickness within a range of approximately 1 mil to 10 mil.

13 . The wireless power transfer system of claim 12 , wherein the flexible insulating material is comprised of one of polyester, an adhesive polyamide, or an adhesiveless polyamide.

14 . The wireless power transfer system of claim 11 , wherein the litz winding is comprised of a bendable, electrically conductive material.

15 . The wireless power transfer system of claim 11 , wherein the assembly operates in a range of approximately 90 KHz to 200 KHz.

16 . The wireless power transfer system of claim 11 , wherein the litz winding is comprised of the electrically insulated strands that are connected in a spiral or helical manner.

17 . The wireless power transfer system of claim 11 , wherein a first layer and a second layer of the multiple layers of the electrically insulated strands are connected using vias.

18 . The wireless power transfer system of claim 11 , wherein the ceramic heat sink comprises one or more fluid-carrying channels.

19 . The wireless power transfer system of claim 11 , wherein the ceramic heat sink is in contact with the flexible printed circuit board, the ceramic heat sink arranged adjacent to the flexible printed circuit board.

20 . The wireless power transfer system of claim 11 , further comprising an additional ceramic heat sink, wherein the certain heat sink and the additional ceramic heat sink are in contact with the flexible printed circuit board, the ceramic heat sink arranged adjacent to one side of the flexible printed circuit board and the additional ceramic heat sink arranged adjacent to another side of the flexible printed circuit board.

Assignees

• Delta Electronics Inc

Inventors

• Anurag Anup
• Zhang Chi
• Wang Ruxi
• Barbosa Peter Mantovanelli

Classifications

• H01F27/323

  Insulation between winding turns, between winding layers · CPC title

• H02J50/12

  of the resonant type · CPC title

• H05K1/0201

  Thermal arrangements, e.g. for cooling, heating or preventing overheating · CPC title

• H05K1/165

  incorporating printed inductors · CPC title

• H01F27/22 Primary

  Cooling by heat conduction through solid or powdered fillings · CPC title