Multiple zone heated enclosure for optimized sublimation of solid-phase precursors

Patent metadata

Field	Value
Publication number	US-2025106944-A1
Application number	US-202218293543-A
Country	US
Kind code	A1
Filing date	Jul 26, 2022
Priority date	Jul 30, 2021
Publication date	Mar 27, 2025
Grant date	—

Abstract

A heated enclosure for optimized sublimation of solid-phase semiconductor process materials and subsequent delivery of the resultant vapor. The enclosure has a hollow housing which is insulated to retain heat within the enclosure. The enclosure further has at least two independent heated zones with independent temperature controls and dedicated overtemperature protection defining an upper heated zone and a lower heated zone and being located in the housing. The lower heated zone is configured to accept a container storing a solid-phase semiconductor process material. The enclosure still further has a removable and height-adjustable divider plate being made of an insulation material, separating the upper heated zone and the lower heated zone, and minimizing heat transfer between the upper heated zone and the lower heated zone.

First claim

1 . A heated enclosure for optimized sublimation of solid-phase semiconductor process materials and subsequent delivery of the resultant vapor, the enclosure comprising:
a hollow housing which is insulated to retain heat within the housing and has a top and a bottom; at least two independent heated zones with independent temperature controls and dedicated overtemperature protection defining an upper heated zone and a lower heated zone and being located in the housing, the lower heated zone configured to accept a container storing a solid-phase semiconductor process material; and a removable and height-adjustable divider plate being made of an insulation material, separating the upper heated zone and the lower heated zone, and minimizing heat transfer between the upper heated zone and the lower heated zone; and a heat shield affixed between a source of heating and the container.

2 . The heated enclosure according to claim 1 , further comprising guide rails located in the housing and along which the divider plate is inserted into and removed from the housing.

3 . The heated enclosure according to claim 1 , further comprising the source of heating comprising a first heater providing heat to the upper heated zone and a second heater providing heat to the lower heated zone.

4 . The heated enclosure according to claim 3 , wherein the first heater is affixed to the housing in the upper heated zone and the second heater is affixed to the housing in the lower heated zone.

5 . The heated enclosure according to claim 1 , further comprising an attachment mechanism configured to retain the container within the housing.

6 . The heated enclosure according to claim 1 , further comprising a scale chamber located proximate the bottom of the housing and a weighing scale located within the scale chamber, the weighing scale supporting and measuring the weight of the container and, therefore, allowing determination of the amount of the process material remaining in the container.

7 . The heated enclosure according to claim 6 , wherein the oven has a footprint and the weighing scale has an insulated scale platform on which the container directly sits, the scale platform being sized to accommodate almost the entire footprint of the oven to substantially insulate the scale chamber from the upper heated zone and the lower heated zone located above the scale chamber.

8 . The heated enclosure according to claim 6 , wherein the scale chamber is ventilated.

9 . The heated enclosure according to claim 6 , wherein a multiplicity of elevation rails has been affixed to the scale platform.

10 . The heated enclosure according to claim 1 , further comprising a circulation fan located, and facilitating ventilation and air circulation, in the lower heated zone.

11 . The heated enclosure according to claim 1 , further comprising an exhaust inlet and a fresh air inlet that, in combination, provide ventilation and fresh air to the upper heated zone.

12 . The heated enclosure according to claim 1 , further comprising a pressure relief flap valve that provides overpressure protection.

13 . The heated enclosure according to ex claim 1 , further comprising at least one access port configured to accommodate process piping, thermocouples, and other external structures.

14 . The heated enclosure according to claim 1 , further comprising process piping disposed in an interconnect passthrough formed in an opening in the housing, the process piping being in fluid communication between the container when located in the housing and an external delivery system to deliver process material from the container to the external delivery system.

15 . A chemical delivery system comprising the heated enclosure according to claim 1 .

Assignees

• Versum Mat Us Llc

Inventors

• Piltz Thomas W
• Seidel Mason
• Eschbach Robert
• Bailey Iii Wade Hampton
• Ebeling David B
• Fatima Syedah Yusra
• Rider David M
• Cable Shawn S

Classifications

• C23C16/52

  Controlling or regulating the coating process {(C23C16/45557, C23C16/279 take precedence)} · CPC title

• C23C16/448

  characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials · CPC title

• C23C16/45561

  Gas plumbing upstream of the reaction chamber · CPC title

• B01D1/0011

  Heating features · CPC title

• H05B1/0233 Primary

  for semiconductors manufacturing · CPC title