Hybrid printed circuit board

Patent metadata

Field	Value
Publication number	US-2025089166-A1
Application number	US-202418774603-A
Country	US
Kind code	A1
Filing date	Jul 16, 2024
Priority date	Sep 11, 2023
Publication date	Mar 13, 2025
Grant date	—

Abstract

A hybrid printed circuit board includes: an insulating substrate; a printed circuit board disposed on an upper surface of the insulating substrate and including at least one through hole configured to accommodate a surface mount device; and an adhesive member comprising an adhesive material provided between the insulating substrate and the printed circuit board.

First claim

What is claimed is:

1 . A hybrid printed circuit board comprising:
an insulating substrate; a printed circuit board disposed on an upper surface of the insulating substrate and including at least one through hole configured to accommodate a surface mount device; and an adhesive member comprising an adhesive material provided between the insulating substrate and the printed circuit board.

2 . The hybrid printed circuit board of claim 1 , wherein the adhesive member includes no-flow prepreg or bonding sheet.

3 . The hybrid printed circuit board of claim 1 , wherein the insulating substrate includes any one of FR-1, FR-3, FR-4, CEM-1, and CEM-3.

4 . The hybrid printed circuit board of claim 1 , wherein a thickness of the insulating substrate is at least 0.4 mm.

5 . The hybrid printed circuit board of claim 1 , wherein the printed circuit board comprises:
a base plate; and a copper foil layer formed on at least one of upper and lower surfaces of the base plate.

6 . The hybrid printed circuit board of claim 5 , wherein the base plate of the printed circuit board includes any one of FR-1, FR-3, FR-4, CEM-1, and CEM-3.

7 . The hybrid printed circuit board of claim 1 , wherein the printed circuit board comprises a base plate and a copper foil layer provided on one surface of the base plate, and
wherein the insulating substrate is formed of a same insulating material as the base plate.

8 . The hybrid printed circuit board of claim 1 , wherein the printed circuit board comprises a base plate and a copper foil layer provided on one surface of the base plate, and
wherein the insulating substrate is formed of an insulating material different from the base plate.

9 . The hybrid printed circuit board of claim 1 , wherein the printed circuit board comprises a base plate and an upper copper foil layer and a lower copper foil layer provided on upper and lower surfaces of the base plate, respectively, and
wherein the insulating substrate is formed of a same insulating material as the base plate.

10 . The hybrid printed circuit board of claim 1 , wherein the printed circuit board comprises a base plate and an upper copper foil layer and a lower copper foil layer provided on upper and lower surfaces of the base plate, respectively, and
wherein the insulating substrate is formed of an insulating material different from the base plate.

11 . The hybrid printed circuit board of claim 1 , wherein the printed circuit board includes a first printed circuit board and a second printed circuit board that are electrically connected to each other.

12 . The hybrid printed circuit board of claim 11 , wherein the first printed circuit board includes a first terminal pattern formed on an upper surface of the first printed circuit board,
wherein the second printed circuit board includes a second terminal pattern formed on an upper surface of the second printed circuit board corresponding to the first terminal pattern, and wherein the printed circuit board further includes a connection board disposed on upper surfaces of the first terminal pattern and the second terminal pattern and configured to electrically connect the first terminal pattern and the second terminal pattern.

13 . The hybrid printed circuit board of claim 12 , wherein the connection board includes a connection pattern configured to connect the first terminal pattern and the second terminal pattern.

14 . The hybrid printed circuit board of claim 11 , wherein the first printed circuit board comprises a double-sided printed circuit board, and the second printed circuit board comprises a single-sided printed circuit board.

15 . The hybrid printed circuit board of claim 1 , further comprising:
a bending prevention reinforcement member disposed on the upper surface of the printed circuit board.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Kim Keonwoo
• Kim Moonyoung
• Lee Jinhyung
• Ko Junyoung
• Seo Kangmoon

Classifications

• H05K1/141

  One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters (H05K1/142 and H05K1/147 take precedence) · CPC title

• H05K1/115 Primary

  Via connections; Lands around holes or via connections (H05K1/112 takes precedence) · CPC title

• H05K1/09 Primary

  Use of materials for the {conductive, e.g. } metallic pattern · CPC title