Resin composition

Patent metadata

Field	Value
Publication number	US-2025084205-A1
Application number	US-202418789287-A
Country	US
Kind code	A1
Filing date	Jul 30, 2024
Priority date	Aug 8, 2023
Publication date	Mar 13, 2025
Grant date	—

Abstract

Provided is a resin composition containing:
(A) a first cyclic imide compound of the following formula (1):

wherein A independently represents a tetravalent organic group having a cyclic structure, Q independently represents an alicyclic hydrocarbon group of the formula (2):

wherein R 1 , R 2 , R 3 , and R 4 independently represent a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, and x1 and x2 are each 0 to 4,

wherein B independently represents a divalent hydrocarbon group (excluding the group represented by the formula (2)),
wherein X represents a hydrogen atom or a methyl group, and
wherein n is 1 to 200;

(B) a second cyclic imide compound of the formula (3):

wherein A, B, and X are defined as above in the formula (1), and s is 0 to 200;

(C) an epoxy compound; and
(D) a curing catalyst.

First claim

What is claimed is:

1 . A resin composition comprising the following components (A) to (D):
(A) a first cyclic imide compound represented by:

wherein A independently represents a tetravalent organic group having a cyclic structure, Q independently represents an alicyclic hydrocarbon group represented by:

wherein R 1 , R 2 , R 3 , and R 4 independently represent a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, and x1 and x2 are each 0 to 4,

wherein B independently represents any one of divalent hydrocarbon groups represented by the following formulae:

wherein bonds that are yet unbonded to substituent groups are to be bonded to nitrogen atoms forming cyclic imide structures in the formula (1), each R 1 independently represents a hydrogen atom or a linear or branched alkyl group having 1 to 20 carbon atoms, p 1 and p 2 are each a number of 5 or more and may be identical to or different from each other, and p 3 and p 4 are each a number of 0 or more and may be identical to or different from each other,

wherein X represents a hydrogen atom or a methyl group, and
wherein n is 1 to 200, m is 0 to 200, provided that when m is 1 or more, n:m=1:1 to 4:1, and repeating units identified by n and m may be present in any order;

(B) a second cyclic imide compound represented by:

wherein A independently represents a tetravalent organic group having a cyclic structure,
wherein B independently represents any one of divalent hydrocarbon groups represented by the following formulae:

wherein bonds that are yet unbonded to substituent groups are to be bonded to nitrogen atoms forming cyclic imide structures in the formula (3), each R 1 independently represents a hydrogen atom or a linear or branched alkyl group having 1 to 20 carbon atoms, p 1 and p 2 are each a number of 5 or more and may be identical to or different from each other, and p 3 and p 4 are each a number of 0 or more and may be identical to or different from each other,

wherein X represents a hydrogen atom or a methyl group, and
wherein s is 0 to 200;

(C) an epoxy compound; and
(D) a curing catalyst,
wherein the first cyclic imide compound (A) is contained in an amount of 60 to 90 parts by mass and the second cyclic imide compound (B) is contained in an amount of 10 to 40 parts by mass per 100 parts by mass of a total of the first and second cyclic imide compounds (A) and (B).

2 . The resin composition according to claim 1 , wherein the organic group represented by A in the formula (1) is any one of tetravalent organic groups represented by the following structural formulae:

wherein bonds that are yet unbonded to substituent groups are to be bonded to carbonyl carbons forming the cyclic imide structures in the formula (1).

3 . A prepreg comprising the resin composition according to claim 1 .

4 . A copper-clad laminate comprising the prepreg according to claim 3 .

5 . A printed-wiring board comprising the copper-clad laminate according to claim 4 .

Assignees

• Shinetsu Chemical Co

Inventors

• Iguchi Hiroyuki
• Tsuura Atsushi
• Kudo Yuki
• Tsutsumi Yoshihiro

Classifications

• C08L63/00

  Compositions of epoxy resins; Compositions of derivatives of epoxy resins · CPC title

• C08J5/244

  using glass fibres · CPC title

• H05K1/0366

  reinforced, e.g. by fibres, fabrics (H05K1/036 takes precedence) · CPC title

• C08G59/44 Primary

  Amides · CPC title

• C08J5/249

  characterised by the additives used in the prepolymer mixture · CPC title