Wire grid polarization structure for current spreading and polarization control

Patent metadata

Field	Value
Publication number	US-2025081689-A1
Application number	US-202318239145-A
Country	US
Kind code	A1
Filing date	Aug 29, 2023
Priority date	Aug 29, 2023
Publication date	Mar 6, 2025
Grant date	—

Abstract

Solid-state lighting devices, and more particularly, wire grid polarization structure for current spreading and polarization control for light emitting diode (LED) package, and a method for making the same are disclosed. The wire grid polarization structure can be configured to both polarize light emitted by an LED chip of the LED package as well as spread current on a layer of the LED chip, resulting in more even light emission across the LED chip. The wire grid polarization structure can be formed on a top surface of the LED chip, and be electrically coupled to an electrode to spread the current across the top surface of the LED chip. In an embodiment, the wire grid polarization structure can include interdigitated fingers that are coupled to both an anode and an electrode.

First claim

What is claimed is:

1 . A light-emitting diode (LED) package, comprising:
a submount; an LED chip on the submount; a first electrode that delivers current to a top surface of the LED chip; and a wire grid polarization structure, electrically coupled to the first electrode, that is on the top surface of the LED chip, wherein the wire grid polarization structure is configured so that unpolarized light generated by the LED chip is received by the wire grid polarization structure and polarized light exits the wire grid polarization structure.

2 . The LED package of claim 1 , wherein the wire grid polarization structure is configured to be a current spreading layer.

3 . The LED package of claim 1 , further comprising a second electrode that delivers current to the top surface of the LED chip, wherein the first electrode is electrically coupled to a first portion of the wire grid polarization structure, and the second electrode is electrically coupled to a second portion of the wire grid polarization structure.

4 . The LED package of claim 3 , wherein wires of the first portion of the wire grid polarization structure and wires of the second portion of the wire grid polarization structure are interdigitated.

5 . The LED package of claim 1 , wherein the wire grid polarization structure preferentially transmits light emitted from the LED chip that is polarized along a first direction relative to light polarized along other directions, wherein the first direction is based on an orientation of the wire grid polarization structure.

6 . The LED package of claim 1 , wherein the first electrode is electrically coupled to the wire grid polarization structure via a wire bond.

7 . The LED package of claim 1 , wherein the wire grid polarization structure is bonded to the top surface of the LED chip by an adhesion layer that is formed of at least one of chrome or titanium.

8 . The LED package of claim 1 , wherein wires of the wire grid polarization layer comprise at least one of aluminum, silver, or gold.

9 . The LED package of claim 1 , wherein wires of the wire grid polarization layer comprise at least two of aluminum, silver, or gold, wherein a ratio of the metals is predetermined based on a polarization selectivity.

10 . The LED package of claim 1 , wherein wires of the wire grid polarization layer comprise at least two of aluminum, silver, or gold, wherein a ratio of the metals is predetermined based on a wavelength of light emitted by the LED chip.

11 . The LED package of claim 1 , further comprising a passivation layer covering the wire grid polarization structure.

12 . The LED package of claim 1 , wherein wires of the wire grid polarization structure have a cross-sectional diameter less than 1 micron.

13 . A method for forming a light-emitting diode (LED) package, comprising:
attaching an LED chip to a submount; smoothing a top surface of the LED chip; and attaching a wire grid polarization structure to the top surface of the LED chip and electrically coupling the wire grid polarization structure to a first electrode, that is on the top surface of the LED chip, wherein the wire grid polarization structure is configured so that unpolarized light generated by the LED chip is received by the wire grid polarization structure and polarized light exits the wire grid polarization structure.

14 . The method of claim 13 , wherein the wire grid polarization structure is configured to be a current spreading layer.

15 . The method of claim 13 , wherein a first portion of the wire grid polarization structure is electrically coupled to the first electrode, and wherein the method further comprises:
electrically coupling a second portion of the wire grid polarization structure to a second electrode that delivers current to the top surface of the LED chip.

16 . The method of claim 13 , further comprising:
forming the wire grid polarization structure from at least one of aluminum, silver, or gold.

17 . The method of claim 13 , further comprising:
forming the wire grid polarization structure from at least two of aluminum, silver, or gold, wherein a ratio of the metals is predetermined based on a polarization selectivity or a wavelength of light emitted by the LED chip.

18 . The method of claim 13 , further comprising:
applying an adhesion layer of chrome or titanium to the top surface of the LED chip before attaching the wire grid polarization structure.

19 . The method of claim 13 , further comprising:
forming a passivation layer around the wire grid polarization structure.

20 . A light-emitting diode (LED) device, comprising:
an LED chip; a first electrode that delivers current to a top surface of the LED chip; and a wire grid polarization structure, electrically coupled to the first electrode, that is on the top surface of the LED chip, wherein the wire grid polarization structure is configured so that unpolarized light generated by the LED chip is received by the wire grid polarization structure and polarized light exits the wire grid polarization structure.

Assignees

• Creeled Inc

Inventors

• Suich David
• Check Michael
• Spencer Austin
• Blakely Colin

Classifications

• H10H20/036

  of packages · CPC title

• H10H20/832

  characterised by their material · CPC title

• H10H20/831

  characterised by their shape · CPC title

• H10H20/0363

  of optical field-shaping means · CPC title

• H10H20/855 Primary

  Optical field-shaping means, e.g. lenses · CPC title