Dual manufacturing process and calibration to achieve high accuracy thermal couple substrates

Patent metadata

Field	Value
Publication number	US-2025072290-A1
Application number	US-202418809681-A
Country	US
Kind code	A1
Filing date	Aug 20, 2024
Priority date	Aug 25, 2023
Publication date	Feb 27, 2025
Grant date	—

Abstract

Embodiments herein are generally directed to a system and process for manufacturing temperature measurement devices for use in semiconductor and display manufacturing. A bifurcated thermocouple substrate is provided and includes a primary substrate with a substrate aperture, a secondary substrate disposed within the substrate aperture, and a thermocouple disposed within a thermocouple aperture of the secondary substrate. A method of calibrating a bifurcated thermocouple substrate includes placing a secondary substrate with an embedded thermocouple of a bifurcated thermocouple substrate into a calibrator, heating the calibrator, the secondary substrate, and the thermocouple to a number “n” of temperature points and recording the temperature readings of the calibrator and the thermocouple The method includes then performing a mathematical conversion using the recorded temperature readings, storing using the stored mathematical conversion to correct thermocouple readings during use in a substrate processing chamber.

First claim

What is claimed is:

1 . A bifurcated thermocouple substrate, comprising:
a primary substrate having a substrate aperture disposed therethrough; a secondary substrate disposed within the substrate aperture; and a thermocouple disposed within a thermocouple aperture of the secondary substrate.

2 . The bifurcated thermocouple substrate of claim 1 , wherein the secondary substrate comprises a thickness that is greater than a thickness of the primary substrate by at least 5%.

3 . The bifurcated thermocouple substrate of claim 1 , wherein the primary substrate and the secondary substrate comprise matching bonding apertures configured to bond the secondary substrate to the primary substrate using wire bonding.

4 . The bifurcated thermocouple substrate of claim 1 , wherein the thermocouple and the secondary substrate comprise a strain relief mechanism.

5 . The bifurcated thermocouple substrate of claim 1 , wherein the secondary substrate has a diameter that is smaller than a diameter of the substrate aperture by about 1% to about 3%.

6 . The bifurcated thermocouple substrate of claim 1 , wherein the thermocouple and the secondary substrate are calibrated such that an accuracy of the bifurcated thermocouple substrate is about +/−0.4° C. or less at 400° C.

7 . The bifurcated thermocouple substrate of claim 6 , wherein the thermocouple and the secondary substrate are calibrated prior to being disposed within the substrate aperture.

8 . A method of producing a thermocouple substrate, comprising:
(a) inserting a thermocouple into a thermocouple aperture of a secondary substrate; (b) calibrating the thermocouple and secondary substrate; and (c) inserting the secondary substrate into a substrate aperture of a primary substrate.

9 . The method of claim 8 , further including;
(d) adding strain relief to the thermocouple and secondary substrate; and (e) performing a thermal cycle test on the thermocouple substrate.

10 . The method of claim 9 , wherein the strain relief is a support structure securing the thermocouple to the secondary substrate.

11 . The method of claim 8 , wherein inserting the secondary substrate into the substrate aperture includes bonding the secondary substrate to the primary substrate via wire bonding.

12 . The method of claim 8 , wherein the secondary substrate comprises a diameter that is less than a diameter of the substrate aperture by about 1% to about 3%.

13 . The method of claim 8 , wherein the secondary substrate comprises a thickness that is thicker than a thickness of the primary substrate by about 5% or more.

14 . The method of claim 8 , wherein calibrating the thermocouple and secondary substrate comprises using a mathematical conversion to correct temperature readings of the thermocouple.

15 . A method of calibrating a bifurcated thermocouple substrate, comprising:
(a) placing a secondary substrate with an embedded thermocouple of a bifurcated thermocouple substrate into a calibrator; (b) validating an accuracy of the calibrator to within a desired range; (c) heating the calibrator, the secondary substrate, and the thermocouple to a number “n” of temperature points and recording the temperature readings of the calibrator and the thermocouple; (d) performing a mathematical conversion, using a controller, using the recorded temperature readings of the calibrator and the thermocouple; (e) storing the mathematical conversion using the controller; and (f) using the stored mathematical conversion to correct thermocouple readings, via the controller, from the bifurcated thermocouple substrate during use in a substrate processing chamber.

16 . The method of claim 15 , wherein the accuracy of the calibrator is validated to within 0.3° C. at 400° C.

17 . The method of claim 15 , wherein the mathematical conversion corrects the temperature readings of the thermocouple to the temperature readings.

18 . The method of claim 15 , wherein the number “n” of temperature points comprises three temperature points.

19 . The method of claim 15 , wherein the thermocouple is a K-type thermocouple.

20 . The method of claim 15 , wherein placing the secondary substrate and the thermocouple into the calibrator includes placing the secondary substrate in a first holder of the calibrator and then placing a second holder containing a calibration sensor on top of the secondary substrate.

Assignees

• Applied Materials Inc

Inventors

• Lu Aaron
• Chang William
• Lin Jacky J
• An Hsiang

Classifications

• G01K7/02

  using thermoelectric elements, e.g. thermocouples · CPC title

• G01K1/14

  Supports; Fastening devices; Arrangements for mounting thermometers in particular locations · CPC title

• G01K15/005 Primary

  Calibration · CPC title

• H10N10/01

  Manufacture or treatment · CPC title

• H10N10/82

  Interconnections · CPC title