Heat-curable maleimide resin composition

US2025059312A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2025059312-A1
Application numberUS-202418932752-A
CountryUS
Kind codeA1
Filing dateOct 31, 2024
Priority dateDec 18, 2020
Publication dateFeb 20, 2025
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Provided are a heat-curable maleimide resin composition suitable for use in a substrate, and whose cured product has an excellent high-temperature property due to its high glass-transition temperature, an excellent dielectric property and an excellent dimension stability; and an uncured and cured resin films comprised of such composition, and having an excellent handling property. The heat-curable maleimide resin composition contains:(A) a maleimide resin having a number average molecular weight of not lower than 3,000;(B) an organic compound having, in one molecule, at least one allyl group and at least one isocyanuric ring; and(C) a reaction initiator.

First claim

Opening claim text (preview).

What is claimed is: 1 . A heat-curable maleimide resin composition comprising: (A) a maleimide resin represented by the following formula (3) and having a number average molecular weight of not lower than 3,000; (B) an organic compound having, in one molecule, at least one allyl group and at least one isocyanuric ring; and (C) a reaction initiator, wherein X 1 independently represents a divalent group, k is a number of 1 to 30, l is a number of 0 to 10, each of A 1 and A 2 independently represents a divalent aromatic group, the divalent group represented by X 1 being selected from the following formulae, wherein a is a number of 1 to 6, and the divalent aromatic group represented by A 1 and A 2 being expressed by the following formula (4) or (5), wherein X 1 is as defined in the formula (3), R 2 independently represents a hydrogen atom, a chlorine atom or a substituted or unsubstituted aliphatic hydrocarbon group having 1 to 6 carbon atoms, X 2 independently represents a divalent group selected from the following formulae, wherein a is a number of 1 to 6. 2 . The heat-curable maleimide resin composition according to claim 1 , wherein the organic compound as the component (B) has, in one molecule, two or more allyl groups. 3 . The heat-curable maleimide resin composition according to claim 1 , wherein the reaction initiator as the component (C) is a radical polymerization initiator. 4 . An uncured resin film comprised of the heat-curable maleimide resin composition according to claim 1 . 5 . A cured resin film comprised of a cured product of the heat-curable maleimide resin composition according to claim 1 . 6 . A prepreg comprising the heat-curable maleimide resin composition according to claim 1 ; and a fiber base material. 7 . An adhesive agent comprised of the heat-curable maleimide resin composition according to claim 1 . 8 . A substrate comprising the heat-curable maleimide resin composition according to claim 1 . 9 . The heat-curable maleimide resin composition according to claim 1 , wherein said component (A) is contained in the composition in an amount of from 20 to 90% by mass; said component (B) is contained in the composition in an amount of from 3 to 50 parts by mass per 100 parts by mass of a sum total of the components (A) and (B); and said component (C) is contained in the composition in an amount of from 0.1 to 5 parts by mass per 100 parts by mass of the sum total of the Components (A) and (B). 10 . The heat-curable maleimide resin composition according to claim 1 , wherein X 1 in the formula (3) is —CH 2 — or —C(CH 3 ) 2 —.

Assignees

Inventors

Classifications

  • Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs · CPC title

  • Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors · CPC title

  • Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors · CPC title

  • Reinforcing macromolecular compounds with loose or coherent fibrous material · CPC title

  • characterised by the catalyst used · CPC title

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What does patent US2025059312A1 cover?
Provided are a heat-curable maleimide resin composition suitable for use in a substrate, and whose cured product has an excellent high-temperature property due to its high glass-transition temperature, an excellent dielectric property and an excellent dimension stability; and an uncured and cured resin films comprised of such composition, and having an excellent handling property. The heat-cura…
Who is the assignee on this patent?
Shinetsu Chemical Co
What technology area does this patent fall under?
Primary CPC classification C08F283/04. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Thu Feb 20 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).