Method for shipping resin composition filling container, cooling and thawing method, and shipping system

US2025058920A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2025058920-A1
Application numberUS-202218724362-A
CountryUS
Kind codeA1
Filing dateDec 27, 2022
Priority dateDec 28, 2021
Publication dateFeb 20, 2025
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A shipping method includes: receiving based on instruction from an orderer, a filled container obtained by filling a container with a resin composition; inputting the number of filled containers to a computer; cooling the resin composition in the filled container to a phase transition temperature at a specific cooling rate; storing the resin composition cooled to the phase transition temperature in a cooling box at a temperature equal to or lower than the phase transition temperature; receiving the number of shipping of the filled containers from the orderer; thawing the resin composition in some or all of the filled containers to a conveyance temperature at a specific temperature raising rate, based on the number of shipping; and a step of shipping, to the orderer, the filled container filled with the resin composition thawed to the conveyance temperature while maintaining a temperature equal to or lower than the conveyance temperature.

First claim

Opening claim text (preview).

1 . A shipping method comprising: a step of receiving, based on an instruction from an orderer, a filled container obtained by filling a predetermined container with a resin composition; a step of inputting the number of filled containers to a computer; a step of cooling the resin composition in the filled container to a phase transition temperature at a specific cooling rate by a thermostatic chamber; a step of storing the resin composition cooled to the phase transition temperature in a cooling box at a temperature equal to or lower than the phase transition temperature; a step of receiving the number of shipping of the filled containers from the orderer; a step of thawing the resin composition in some or all of the filled containers stored in the cooling box, based on the number of shipping, to a conveyance temperature at a specific temperature raising rate by the thermostatic chamber; and a step of shipping, to the orderer, the filled container filled with the resin composition thawed to the conveyance temperature while maintaining a temperature equal to or lower than the conveyance temperature, wherein the phase transition temperature is a temperature at which heat absorption is first generated in DSC (μW) when the temperature is raised at a temperature raising rate of 10° C./min from −200° C. by differential scanning calorimetry. 2 . A shipping method comprising: a step of receiving, based on an instruction from an orderer, a filled container obtained by filling a predetermined container with a resin composition; a step of inputting the number of filled containers to a computer; a step of cooling the resin composition in the filled container to a phase transition temperature at a specific cooling rate by a thermostatic chamber; a step of storing the resin composition cooled to the phase transition temperature in a cooling box at a temperature equal to or lower than the phase transition temperature; a step of receiving the number of shipping of the filled containers from the orderer; a step of thawing the resin composition in some or all of the filled containers stored in the cooling box, based on the number of shipping, to a conveyance temperature at a specific temperature raising rate by the thermostatic chamber; and a step of shipping, to the orderer, the filled container filled with the resin composition thawed to the conveyance temperature while maintaining a temperature equal to or lower than the conveyance temperature, wherein the phase transition temperature is a temperature lower by 15° C. than a temperature of a DDSC (μW/min) local maximum when the temperature is raised at a temperature raising rate of 10° C./min from −200° C. by differential scanning calorimetry. 3 . The shipping method according to claim 1 , wherein the specific cooling rate is a rate at which the inside of a chamber in the thermostatic chamber is cooled at a cooling rate of 10° C./min or more. 4 . The shipping method according to claim 1 , wherein the specific cooling rate is a rate at which a resin temperature of the resin composition is reduced at a cooling rate of 2.0° C./min or more. 5 . The shipping method according to claim 1 , wherein the phase transition temperature is −5° C. or lower. 6 . The shipping method according to claim 1 , wherein the resin composition contains a curable resin. 7 . The shipping method according to claim 1 , wherein the specific temperature raising rate is a rate at which the inside of a chamber in the thermostatic chamber is heated at a temperature raising rate of 1.0° C./min or less. 8 . The shipping method according to claim 1 , wherein the resin composition stored for at least one year exists in the cooling box. 9 . A shipping method comprising: a step of receiving, based on an instruction from an orderer, a filled container obtained by filling a predetermined container with a resin composition; a step of inputting the number of filled containers to a computer; a step of cooling the resin composition in the filled container to a temperature of −5° C. or lower at a cooling rate of 10° C./min or more by a thermostatic chamber; a step of storing the resin composition cooled to the temperature of −5° C. or lower in a cooling box at the temperature of −5° C. or lower; a step of receiving the number of shipping of the filled containers from the orderer; a step of thawing the resin composition in some or all of the filled containers stored in the cooling box, based on the number of shipping, to a conveyance temperature at a temperature raising rate of 1.0° C./min or less by the thermostatic chamber; and a step of shipping, to the orderer, the filled container filled with the resin composition thawed to the conveyance temperature while maintaining a temperature equal to or lower than the conveyance temperature. 10 . A cooling and thawing method for a filled container obtained by filling a predetermined container with a resin composition, the cooling and thawing method comprising: a step of cooling the filled container obtained by filling the predetermined container with the resin composition to a temperature of −5° C. or lower at a cooling rate of 10° C./min or more by a thermostatic chamber; a step of storing the resin composition cooled to the temperature of −5° C. or lower in a cooling box at the temperature of −5° C. or lower; and a step of thawing the resin composition in the filled containers stored in the cooling box at a temperature raising rate of 1.0° C./min or less by the thermostatic chamber. 11 - 19 . (canceled)

Assignees

Inventors

Classifications

  • Manufacturing · CPC title

  • Filling containers or receptacles progressively or in stages by introducing successive articles, or layers of articles · CPC title

  • Methods of, or means for, filling the material into the containers or receptacles · CPC title

  • B65B63/08Primary

    for heating or cooling articles or materials to facilitate packaging · CPC title

  • Special goods or special handling procedures, e.g. handling of hazardous or fragile goods · CPC title

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What does patent US2025058920A1 cover?
A shipping method includes: receiving based on instruction from an orderer, a filled container obtained by filling a container with a resin composition; inputting the number of filled containers to a computer; cooling the resin composition in the filled container to a phase transition temperature at a specific cooling rate; storing the resin composition cooled to the phase transition temperatur…
Who is the assignee on this patent?
Three Bond Co Ltd
What technology area does this patent fall under?
Primary CPC classification B65B63/08. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Thu Feb 20 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 6 related publications on this page (citations in our corpus or others sharing the same primary CPC).