Electrostatic Chuck with High Cooling Efficiency

Patent metadata

Field	Value
Publication number	US-2025054737-A1
Application number	US-202318231655-A
Country	US
Kind code	A1
Filing date	Aug 8, 2023
Priority date	Aug 8, 2023
Publication date	Feb 13, 2025
Grant date	—

Abstract

Embodiments of substrate supports having electrostatic chucks (ESCs) for use in substrate process chambers are provided herein. In some embodiments, a substrate support includes: an electrostatic chuck (ESC) having a top surface and a plurality of mesas extending upward from the top surface, wherein an upper surface of the plurality of mesas define a substrate support surface, wherein a total surface area of the substrate support surface is about 18 to about 40 percent a total surface area of the upper surface, and wherein the ESC includes a plurality of backside gas openings extending through the ESC; and one or more chucking electrodes disposed in the ESC.

First claim

1 . A substrate support, comprising:
an electrostatic chuck (ESC) having a top surface and a plurality of mesas extending upward from the top surface, wherein an upper surface of the plurality of mesas define a substrate support surface, wherein a total surface area of the substrate support surface is about 18 to about 40 percent a total surface area of the upper surface, and wherein the ESC includes a plurality of backside gas openings extending through the ESC; and one or more chucking electrodes disposed in the ESC.

2 . The substrate support of claim 1 , wherein the plurality of mesas are substantially arranged in an orthogonal grid.

3 . The substrate support of claim 1 , wherein the plurality of mesas include a plurality of first mesas and a plurality of second mesas, wherein the plurality of first mesas are substantially square shaped and the plurality of second mesas are not square shaped, and wherein substantially all mesas of the plurality of mesas comprise the plurality of first mesas.

4 . The substrate support of claim 3 , wherein the plurality of first mesas are about 0.1 inches to about 0.25 inches wide by about 0.1 inches to about 0.25 inches long.

5 . The substrate support of claim 1 , further comprising one or more heating elements disposed in the ESC between the one or more chucking electrodes and a bottom surface of the ESC.

6 . The substrate support of claim 1 , wherein the plurality of backside gas openings are disposed in the ESC along one or more annular rings and terminate at the top surface of the ESC.

7 . The substrate support of claim 6 , further comprising a porous plug disposed in each of the plurality of backside gas openings.

8 . The substrate support of claim 1 , further comprising a plurality of lift pin openings disposed in the ESC.

9 . The substrate support of claim 8 , wherein a first lift pin of the plurality of lift pin openings extends through a first mesa of the plurality of mesas.

10 . A substrate support, comprising:
an electrostatic chuck (ESC) having a top surface and a plurality of mesas extending upward from the top surface, wherein an upper surface of the plurality of mesas define a substrate support surface, wherein a total surface area of the substrate support surface is 18 percent to about 40 percent of a total surface area of the upper surface, wherein the ESC includes a plurality of lift pin openings, and wherein the ESC includes a plurality of backside gas openings extending through the ESC and terminating on the top surface; and one or more chucking electrodes disposed in the ESC.

11 . The substrate support of claim 10 , further comprising one or more terminals coupled to a bottom surface of the ESC.

12 . The substrate support of claim 10 , wherein the ESC includes an upper peripheral notch disposed about the top surface.

13 . The substrate support of claim 10 , wherein the plurality of lift pin openings are disposed radially inward of the plurality of backside gas openings.

14 . The substrate support of claim 10 , wherein the plurality of mesas comprise a plurality of first mesas, a plurality of edge mesas proximate an outer edge of the ESC, a plurality of lift pin mesas proximate the plurality of lift pin openings, and wherein the plurality of lift pin mesas are larger in size than the plurality of first mesas and the plurality of edge mesas.

15 . The substrate support of claim 14 , wherein the plurality of edge mesas are non-rectangular quadrilaterals.

16 . A process chamber, comprising:
a chamber body defining an interior volume therein; and a substrate support disposed in the interior volume, the substrate support comprising:
an electrostatic chuck (ESC) having a top surface and a plurality of mesas extending upward from the top surface, wherein an upper surface of the plurality of mesas define a substrate support surface, wherein a total surface area of the substrate support surface is 18 percent to about 40 percent of a total surface area of the upper surface, and wherein the ESC includes a plurality of backside gas openings extending through the ESC; and
one or more chucking electrodes disposed in the ESC.

17 . The process chamber of claim 16 , further comprising an RF plasma power source coupled to a lid of the chamber body.

18 . The process chamber of claim 16 , further comprising a backside gas supply coupled to the plurality of backside gas openings.

19 . The process chamber of claim 16 , wherein the substrate support further comprises a base assembly coupled to the ESC and having one or more cooling channels disposed therein.

20 . The process chamber of claim 16 , further comprising a lift mechanism having a plurality of lift pins configured to extend through the ESC.

Assignees

• Applied Materials Inc

Inventors

• Elumalai Karthik
• Jupudi Ananthkrishna
• Tatti Arunkumar
• Sun Cheng
• Liu Ye

Classifications

• H01J37/32724 Primary

  Temperature · CPC title