Led lighting device

Patent metadata

Field	Value
Publication number	US-2025035289-A1
Application number	US-202418916716-A
Country	US
Kind code	A1
Filing date	Oct 16, 2024
Priority date	Apr 24, 2023
Publication date	Jan 30, 2025
Grant date	—

Abstract

An LED lighting device includes a power supplier, a light cover and a circuit board. The circuit board is disposed in the light cover. The circuit board has a protective layer disposed thereon and a plurality of light sources. The circuit board has a front soldering section, a rear soldering section and a circuit section. The light sources are disposed on the circuit section and electrically connected to the circuit section. The protective layer includes an opening and two coated layers. The opening includes a front section, a rear section and a connecting section. The coated layers are disposed on the two sides of the connecting section respectively. The light sources are within the connecting section. The inner space of the light cover serves as an optical zone, such that the optical zone covers the front soldering section and the rear soldering section.

First claim

What is claimed is:

1 . A light-emitting diode (LED) lighting device, comprising:
a power supplier; a light cover; and a circuit board disposed in the light cover, and having a protective layer disposed thereon and a plurality of light sources, wherein the circuit board has a front soldering section, a rear soldering section and a circuit section, wherein the front soldering section is electrically connected to the rear soldering section via the circuit section, and the front soldering section and the rear soldering section are electrically connected to the power supplier, wherein the light sources are disposed on the circuit section and electrically connected to the circuit section; wherein the protective layer comprises an opening and two coated layers, and the opening comprises a front section, a rear section and a connecting section, wherein the front section is connected to the rear section via the connecting section, and the coated layers are disposed on two sides of the connecting section respectively, and the light sources are within the connecting section to serve as a light-emitting zone, wherein the light-emitting zone makes an inner space of the light cover forms an optical zone, whereby the optical zone simultaneously covers the light-emitting zone, the front soldering section and the rear soldering section.

2 . The LED lighting device as claimed in claim 1 , wherein the front section is connected to the rear section via the connecting section, whereby the opening is H-shaped.

3 . The LED lighting device as claimed in claim 1 , wherein the light sources are LEDs or an LED light strip.

4 . The LED lighting device as claimed in claim 1 , further comprising two end caps, wherein the two end caps are disposed at two ends of the light cover and the power supplier is disposed in one of the end caps.

5 . The LED lighting device as claimed in claim 1 , wherein the connecting section comprises a plurality of bending portions and a plurality of connecting portions connected to each other.

6 . The LED lighting device as claimed in claim 5 , wherein the bending portions and the connecting portions are arranged in an alternating order.

7 . The LED lighting device as claimed in claim 5 , wherein a shape of the bending portion is U-shaped or inverted U-shaped.

8 . The LED lighting device as claimed in claim 5 , wherein each of the bending portions comprises at least one vertical portion and a horizontal portion connected to each other and perpendicular to each other.

9 . The LED lighting device as claimed in claim 8 , wherein a width of the horizontal portion is greater than a width of the connecting portion.

10 . The LED lighting device as claimed in claim 1 , wherein the light cover is made of a transparent material or a semi-transparent material.

Assignees

• Xiamen Pvtech Co Ltd

Inventors

• Lu Fuxing
• Liu Rongtu
• Luo Huibao
• Dai Zehu
• Cao Liangliang
• Liu Chun Ming

Classifications

• H05K2201/0989

  Coating free areas, e.g. areas other than pads or lands free of solder resist · CPC title

• H05K3/3452

  Solder masks · CPC title

• H05K2201/10106

  Light emitting diode [LED] · CPC title

• H05K3/28

  Applying non-metallic protective coatings {(H05K3/0091 takes precedence; methods for intermediate insulating layers for build-up multilayer circuits H05K3/4673)} · CPC title

• F21V31/005

  Sealing arrangements therefor · CPC title