Over-current protection device

Patent metadata

Field	Value
Publication number	US-2025029755-A1
Application number	US-202418422822-A
Country	US
Kind code	A1
Filing date	Jan 25, 2024
Priority date	Jul 12, 2023
Publication date	Jan 23, 2025
Grant date	—

Abstract

An over-current protection device includes an electrode layer and a heat-sensitive layer. The heat-sensitive layer exhibits a positive temperature coefficient (PTC) characteristic, and is laminated between a top metal layer and a bottom metal layer of the electrode layer. The heat-sensitive layer includes a polymer matrix and a conductive filler. The polymer matrix includes a first fluoropolymer and a second fluoropolymer. The first fluoropolymer has a first volume and a first melt flow index, and the second fluoropolymer has a second volume and a second melt flow index. The second melt flow index ranges from 0.4 g/10 min to 0.7 g/10 min and is lower than the first melt flow index, and a volume ratio by dividing the second volume by the first volume ranges from 0.4 to 0.6.

First claim

What is claimed is:

1 . An over-current protection device, comprising:
an electrode layer having a top metal layer and a bottom metal layer; and a heat-sensitive layer contacting the top metal layer and the bottom metal layer, and being laminated therebetween, wherein the heat-sensitive layer exhibits a positive temperature coefficient (PTC) characteristic and comprises:
a polymer matrix comprising a first fluoropolymer and a second fluoropolymer, wherein:
the first fluoropolymer has a first volume and a first melt flow index;
the second fluoropolymer has a second volume and a second melt flow index, wherein the second melt flow index ranges from 0.4 g/10 min to 0.7 g/10 min and is lower than the first melt flow index, and a volume ratio by dividing the second volume by the first volume ranges from 0.4 to 0.6; and

a conductive filler dispersed in the polymer matrix, thereby forming an electrically conductive path in the heat-sensitive layer.

2 . The over-current protection device of claim 1 , wherein the total volume of the heat-sensitive layer is calculated as 100%, and the second fluoropolymer accounts for 12% to 16% by volume.

3 . The over-current protection device of claim 1 , wherein the total volume of the heat-sensitive layer is calculated as 100%, and the polymer matrix accounts for 32% to 56% by volume.

4 . The over-current protection device of claim 1 , wherein the total volume of the heat-sensitive layer is calculated as 100%, and the conductive filler accounts for 40% to 50% by volume.

5 . The over-current protection device of claim 1 , wherein the conductive filler comprises carbon black and a metal carbide.

6 . The over-current protection device of claim 5 , wherein the metal carbide is selected from the group consisting of tungsten carbide, titanium carbide, vanadium carbide, zirconium carbide, niobium carbide, tantalum carbide, molybdenum carbide, hafnium carbide, and any combination thereof.

7 . The over-current protection device of claim 1 , wherein the over-current protection device has a top-view area ranging from 4 mm 2 to 12 mm 2 .

8 . The over-current protection device of claim 7 , wherein the top-view area of the over-current protection device ranges from 5 mm 2 to 10 mm 2 , and the heat-sensitive layer has a thickness below 0.21 mm.

9 . The over-current protection device of claim 8 , wherein the thickness of the heat-sensitive layer ranges from 0.11 mm to 0.21 mm.

10 . The over-current protection device of claim 1 , wherein the first fluoropolymer is polyvinylidene difluoride, and the second fluoropolymer is represented by a structural formula (I):

wherein:
R 1 and R 2 are selected from the group consisting of CH 2 , CF 2 , CHF, C 2 HF 3 , C 2 H 2 F 2 , C 2 H 3 F, C 2 H 4 , and C 2 F 4 ;
R 1 is different from R 2 ; and
n is at least 9000.

11 . The over-current protection device of claim 1 , wherein an operable power of the over-current protection device is lower than 900 W.

12 . The over-current protection device of claim 11 , wherein the operable power of the over-current protection device ranges from 600 W to 900 W, and wherein:
the over-current protection device is able to withstand an applied power ranging from 600 W to 800 W for 6000 cycles without burnout; and the over-current protection device is able to withstand an applied power of 900 W for 500 cycles without burnout.

13 . The over-current protection device of claim 12 , wherein the over-current protection device has an electrical resistance ranging from 0.05 Ω to 0.2 Ω when cooled back to room temperature after being applied at 600 W for 500 cycles.

14 . The over-current protection device of claim 13 , wherein the over-current protection device has an electrical resistance ranging from 0.09 Ω to 0.7 Ω when cooled back to room temperature after being applied at 800 W for 500 cycles.

15 . The over-current protection device of claim 1 , wherein the over-current protection device has a low-temperature thermal derating ratio of trip current ranging from 0.5 to 0.6, wherein the low-temperature thermal derating ratio of trip current is defined as a ratio of a required trip current of the over-current protection device under 85° C. divided by a required trip current of the over-current protection device under 23° C.

16 . The over-current protection device of claim 1 , wherein the over-current protection device has a high-temperature thermal derating ratio of trip current ranging from 0.2 to 0.3, wherein the high-temperature thermal derating ratio of trip current is defined as a ratio of a required trip current of the over-current protection device under 125° C. divided by a required trip current of the over-current protection device under 23° C.

17 . The over-current protection device of claim 1 , wherein a trip power of the over-current protection device ranges from 60 W to 93 W at 23° C.

18 . The over-current protection device of claim 17 , wherein a trip power per unit area of the over-current protection device ranges from 9 W/mm 2 to 12 W/mm 2 at 23° C.

Assignees

• Polytronics Technology Corp

Inventors

• Chiu Chingting
• Yen Hsiu-Che
• Lee Chia-Yuan
• Liu Chen-Nan
• Tung Cheng-Yu
• Chang Yung-Hsien
• Chang Yao-Te
• Chu Fu-Hua

Classifications

• H01C7/027 Primary

  consisting of conducting or semi-conducting material dispersed in a non-conductive organic material · CPC title

• H01C7/028

  consisting of organic substances · CPC title

• H01C7/021

  formed with two or more layers · CPC title

• H01C7/008 Primary

  Thermistors (H01C7/02 - H01C7/06 take precedence) · CPC title

• H02H9/026

  Current limitation using PTC resistors, i.e. resistors with a large positive temperature coefficient · CPC title