Systems and methods for managing seismic forces

Patent metadata

Field	Value
Publication number	US-2024404857-A1
Application number	US-202418412310-A
Country	US
Kind code	A1
Filing date	Jan 12, 2024
Priority date	May 31, 2023
Publication date	Dec 5, 2024
Grant date	—

Abstract

Base plates of a substrate retainer transportation mechanism are provided with damping members to assist elastic members in damping and limiting movement of the substrate retainer transportation mechanism when the substrate transportation mechanism is subjected to unwanted external forces, e.g., seismic forces. By damping and limiting movement of the substrate retainer transportation mechanism, undesirable damage to substrates contained in a substrate retainer being carried by the substrate retainer transport mechanism can be minimized.

First claim

1 . A method of processing a substrate, comprising:
supporting a substrate in a substrate retainer; activating a substrate retainer transport mechanism and moving the substrate retainer, the substrate retainer transport mechanism including:
a transport mechanism track;
a substrate retainer support base;
a substrate retainer support cap;
a plurality of elastic members between the substrate retainer support base and the substrate retainer support cap; and
a plurality of damping members between the substrate retainer support base and the substrate retainer support cap; and thermally processing the substrate in the substrate retainer.

2 . The method of claim 1 , wherein the supporting a substrate in a substrate retainer includes supporting a substrate in a substrate boat.

3 . The method of claim 1 , wherein the thermally processing the substrate in the substrate retainer includes forming a film on the substrate.

4 . The method of claim 1 , further comprising absorbing, by the plurality of elastic members and plurality of damping members, abnormal movement of the transport mechanism cap relative to the transport mechanism base.

5 . The method of claim 4 , wherein absorbing the abnormal movement of the transport mechanism cap relative to the transport mechanism base further includes damping the abnormal movement of the transport mechanism cap relative to the transport mechanism base.

6 . The method of claim 5 , wherein the damping the abnormal movement of the transport mechanism cap relative to the transport mechanism base includes maintaining the position of the damping members relative to the transport mechanism base.

7 . The method of claim 4 , wherein the absorbing the abnormal movement of the transport mechanism cap relative to the transport mechanism base further includes compressing one or more of the plurality of elastic members and contacting one or more of the plurality of damping members with the transport mechanism cap.

8 . The method of claim 4 , wherein the compressing one or more of the plurality of elastic members includes compressing one or more of a plurality of springs between the transport mechanism base and the transport mechanism cap.

9 . A substrate processing apparatus, comprising:
a substrate retainer; and a substrate retainer transport mechanism, the substrate retainer transport mechanism including:
a transport mechanism track;
a substrate retainer support base;
a substrate retainer support cap;
a plurality of elastic members between the substrate retainer support base and the substrate retainer support cap; and
a plurality of damping members between the substrate retainer support base and the substrate retainer support cap.

10 . The substrate processing apparatus of claim 9 , wherein each of the plurality of elastic members has a spring constant that is greater than a spring constant of each of the damping members.

11 . The substrate processing apparatus of claim 9 , wherein the plurality of elastic members is a plurality of springs.

12 . The substrate processing apparatus of claim 9 , wherein the substrate retainer is a substrate boat.

13 . The substrate processing apparatus of claim 12 , wherein the substrate retainer transport mechanism is a boat elevator.

14 . The substrate processing apparatus of claim 9 , wherein the substrate is a semiconductor wafer.

15 . The substrate processing apparatus of claim 9 , wherein the plurality of damping members includes at least one damping member including an upper member spaced apart from a lower member by a distance, the distance being adjustable.

16 . The substrate processing apparatus of claim 15 , wherein a threaded member extends between the upper member and the lower member.

17 . A thermal processing system, comprising:
a substrate boat; a substrate boat elevator, the substrate boat elevator including:
a boat elevator track;
a boat elevator arm base connected to the boat elevator track;
a boat elevator arm cap;
a three springs between an upper surface of the boat elevator arm base and a lower surface of the boat elevator arm cap; and
a plurality of adjustable damping members between the upper surface of the boat elevator arm base and the lower surface of the boat elevator arm cap, each of the adjustable damping members including an upper portion and a lower portion connected by a threaded member, each of the upper portion and the lower portion including a damping material segment attached to a connector segment; and
a thermal processing chamber.

18 . The thermal processing system of claim. 17 , wherein the connector segment includes a threaded bore.

19 . The thermal processing system of claim. 17 , wherein the threaded member is a threaded rod.

20 . The thermal processing system of claim 17 , wherein a coefficient of static friction greater than 0.14 exists between the damping material segment and the upper surface of the boat elevator arm base.

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Liao Chen-Hao
• Lee Pei-Yu
• Lee Chih-Tsung
• Wu Cheng-Lung
• Pai Jiun-Rong

Classifications

• H10P95/90

  Thermal treatments, e.g. annealing or sintering · CPC title

• H10P72/12

  Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements · CPC title

• H10P72/3302 Primary

  Mechanical parts of transfer devices · CPC title

• H10P72/0434

  mainly by convection · CPC title

• H01L21/67303

  Electricity · mapped topic