Method of surface treatment

Patent metadata

Field	Value
Publication number	US-2024392426-A1
Application number	US-202418430308-A
Country	US
Kind code	A1
Filing date	Feb 1, 2024
Priority date	May 24, 2023
Publication date	Nov 28, 2024
Grant date	—

Abstract

A method of surface treatment, includes: providing a component in a first process chamber; generating fluorine plasma with a remote plasma source connected to the first process chamber; and forming a protective layer on a surface of the component by providing the fluorine plasma to the first process chamber, wherein the protective layer comprises magnesium fluoride, wherein a magnesium content of the component is about 0.5 wt % to about 5.5 wt %, and wherein a thickness of the protective layer is about 100 nm to about 300 nm.

First claim

What is claimed is:

1 . A method of surface treatment, comprising:
providing a component in a first process chamber; generating fluorine plasma with a remote plasma source connected to the first process chamber; and forming a protective layer on a surface of the component by providing the fluorine plasma to the first process chamber, wherein the protective layer comprises magnesium fluoride, wherein a magnesium content of the component is about 0.5 wt % to about 5.5 wt %, and wherein a thickness of the protective layer is about 100 nm to about 300 nm.

2 . The method of surface treatment of claim 1 , wherein the forming of the protective layer comprises heating the component at a temperature of about 380° C. to about 500° C.

3 . The method of surface treatment of claim 1 , wherein the forming of the protective layer comprises maintaining a pressure of the first process chamber as about 0.5 Torr to about 10 Torr.

4 . The method of surface treatment of claim 1 , wherein, before the providing of the fluorine plasma to the first process chamber, further comprising heating the component by an annealing process.

5 . The method of surface treatment of claim 4 , further comprising increasing the magnesium content of the surface of the component by the annealing process.

6 . The method of surface treatment of claim 4 , further comprising performing the annealing process about 1 hour to about 5 hours.

7 . The method of surface treatment of claim 4 , further comprising performing the annealing process at a pressure of about 5 mTorr to about 50 mTorr.

8 . The method of surface treatment of claim 1 , wherein the component comprises a bulk layer comprising aluminum and magnesium, and
wherein the protective layer is disposed on the bulk layer.

9 . The method of surface treatment of claim 8 , wherein the protective layer does not include aluminum fluoride.

10 . The method of surface treatment of claim 1 , further comprising providing a source gas to the remote plasma source,
wherein the fluorine plasma is generated from the source gas.

11 . The method of surface treatment of claim 10 , wherein the source gas comprises at least one of NF 3 , SF 6 , CF 4 , CHF 3 , CH 3 F, CH 2 F 2 , C 2 F 6 , C 4 F 8 , HF, C 2 F 4 , C 3 F 6 and C 4 F 5 .

12 . The method of surface treatment of claim 1 , further comprising installing the component on which the protective layer is formed, in a second process chamber.

13 . The method of surface treatment of claim 1 , wherein a porosity of the protective layer is about 0.1% to about 1%.

14 . The method of surface treatment of claim 1 , further comprising operating a power source connected to the remote plasma source at a power of about 1000 W to about 30000 W.

15 . The method of surface treatment of claim 1 , wherein the first process chamber comprises a support comprising a heater, and
wherein the component is disposed on the support.

16 . A method of surface treatment, comprising:
installing a component in a process chamber; generating fluorine plasma with a remote plasma source connected to the process chamber; and forming a protective layer on a surface of the component by providing the fluorine plasma to the process chamber, wherein the protective layer comprises magnesium fluoride, wherein a magnesium content of the component is about 0.5 wt % to about 5.5 wt %, and wherein a thickness of the protective layer is about 100 nm to about 300 nm.

17 . The method of surface treatment of claim 16 , wherein the installing of the component in the process chamber comprises installing the component in the process chamber that comprises a housing; a support on a lower portion of the housing; a ring structure surrounding a side surface of the support, and an isolator provided below the support; a shower head on an upper portion of the housing and facing the support; and an outlet on a sidewall of the housing,
wherein the component comprises at least one of a first internal wall of the housing, a second internal wall of the outlet, the ring structure, the isolator, and the shower head.

18 . The method of surface treatment of claim 16 , wherein the protective layer is a single layer comprising the magnesium fluoride that does not include aluminum fluoride.

19 . A method of surface treatment, comprising:
providing a component comprising a bulk layer including aluminum and magnesium in a process chamber; annealing the component to form, on the bulk layer, a surface region comprising a higher magnesium content than that of the bulk layer; generating fluorine plasma with a remote plasma source connected to the process chamber; and forming a protective layer on the surface region by providing the fluorine plasma to the process chamber, wherein the protective layer comprises magnesium fluoride, wherein a magnesium content of the component is about 0.5 wt % to about 5.5 wt %, and wherein a thickness of the protective layer is about 100 nm to about 300 nm.

20 . The method of surface treatment of claim 19 , wherein the protective layer is disposed on the bulk layer and does not include aluminum fluoride.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Wang Younseon
• Nam Jeonghoon
• Kim Youngkwon
• Choi Hyunseo
• Kim Keonwoo
• Sung Dougyong
• Im Junho

Classifications

• H10P72/0471 Primary

  comprising at least one ion or electron beam chamber · CPC title

• C23C26/00

  Coating not provided for in groups C23C2/00 - C23C24/00 · CPC title

• C23C16/4404

  Coatings or surface treatment on the inside of the reaction chamber or on parts thereof · CPC title

• H01J37/32495

  Means for protecting the vessel against plasma · CPC title

• C23C16/45565

  Shower nozzles · CPC title