Semiconductor processing tool and methods of operation

Patent metadata

Field	Value
Publication number	US-2024379471-A1
Application number	US-202418785577-A
Country	US
Kind code	A1
Filing date	Jul 26, 2024
Priority date	May 13, 2021
Publication date	Nov 14, 2024
Grant date	—

Abstract

A diaphragm position of a valve may be detected and/or determined such that operation of the diaphragm may be monitored. A sensor included in the valve may generate sensor data that may be used to monitor the position of the diaphragm, which in turn may be used to determine a flow of a fluid through the valve. In this way, the sensor may be used to determine whether the diaphragm is properly functioning, may be used to identify and detect failures of the diaphragm, and/or may be used to quickly terminate operation of an associated deposition tool. This may reduce semiconductor substrate scrap, may reduce device failures on semiconductor substrates that are processed by the deposition tool, may increase semiconductor processing quality of the deposition tool, and/or may increase semiconductor processing yields of the deposition tool.

First claim

What is claimed is:

1 . A valve for use in a vapor delivery system associated with a semiconductor processing tool for depositing a thin film on a semiconductor substrate, comprising:
a valve housing; a fluid inlet configured to receive a processing fluid; a fluid outlet configured to provide the processing fluid; a diaphragm configured to deform between two configurations, including:
a closed configuration in which the diaphragm is to block the processing fluid from flowing from the fluid inlet to the fluid outlet, and
an open configuration in which the diaphragm is to permit the processing fluid from flowing from the fluid inlet to the fluid outlet; and
a sensor, included in the valve housing, configured to:
generate sensor data associated with deformation of the diaphragm, and
provide the sensor data to a controller of the vapor delivery system to enable the controller to determine a position of the diaphragm and to determine a flow of the processing fluid through the valve,
wherein the position of the diaphragm and the flow of the processing fluid through the valve are to be used to detect a failure of the diaphragm.

2 . The valve of claim 1 , wherein the sensor includes a distance sensor;
wherein the sensor, to generate the sensor data associated with the diaphragm, is configured to: emit a distance measurement signal toward the diaphragm; and generate the sensor data based on an intensity of a reflected distance measurement signal, wherein the reflected distance measurement signal is reflected off of the diaphragm, and wherein the intensity of the reflected distance measurement signal is based on a distance between the diaphragm and the sensor and an angle of the diaphragm relative to an angle of the distance measurement signal.

3 . The valve of claim 2 , wherein the intensity of the reflected distance measurement signal is greater when the diaphragm is in the open configuration than when the diaphragm is in the closed configuration.

4 . The valve of claim 2 , wherein the sensor, to emit the distance measurement signal toward the diaphragm, is configured to:
emit the distance measurement signal onto a measurement point on the diaphragm, wherein the measurement point is located an offset from a center of the diaphragm so as to prevent a valve stem of the valve from interfering with the distance measurement signal.

5 . The valve of claim 4 , wherein a ratio between the offset and a radius of the diaphragm is in a range of approximately 0.2 to approximately 1.

6 . The valve of claim 1 , wherein the sensor comprises:
a laser sensor, an infrared sensor, or a radar sensor.

7 . The valve of claim 1 , further comprising:
a valve stem configured to selectively actuate the diaphragm between the open configuration and the closed configuration; and a piston configured to actuate the valve stem, wherein the sensor is located between the diaphragm and the piston, wherein the sensor is located adjacent to the valve stem, and wherein the position of the diaphragm and the flow of the processing fluid through the valve are to be used to detect an unopened failure of the diaphragm.

8 . A valve, comprising:
a diaphragm configured to selectively block or open a fluid path in the valve; and a distance sensor configured to:
generate sensor data, associated with a configuration of the diaphragm, based on a distance between the distance sensor and the diaphragm, and
transmit the sensor data to a controller to enable the controller to determine the configuration of the diaphragm.

9 . The valve of claim 8 , wherein the distance sensor is further configured to:
transmit a measurement signal at a measurement point on the diaphragm that is located away from a center of the diaphragm, wherein sensor data is generated based on the measurement point, and the center of the diaphragm corresponds to an offset that is greater than a radius of a valve stem of the valve and that is less than a radius of the diaphragm.

10 . The valve of claim 9 , wherein the measurement signal includes a laser signal, a radar signal, an electromagnetic field signal, an infrared signal, or a magnetic field sensor.

11 . The valve of claim 9 , wherein the measurement signal is transmitted onto the measurement point at an angle of incidence relative to a top surface of the diaphragm.

12 . The valve of claim 11 , wherein the angle of incidence is in a range of approximately 30 degrees to approximately 75 degrees.

13 . The valve of claim 8 , further comprising:
a housing containing the distance sensor and the diaphragm, wherein the distance sensor resides above the diaphragm.

14 . A valve, comprising:
a diaphragm configured to deform between a closed configuration, in which the diaphragm is to block a processing fluid from flowing in the valve, and an open configuration, in which the diaphragm is to permit the processing fluid from flowing in the valve; a valve stem, residing above the diaphragm, configured to selectively actuate the diaphragm between the closed configuration and the open configuration; and a sensor, residing above the diaphragm and adjacent to valve stem, configured to:
generate sensor data, associated with the closed configuration or the open configuration, and
provide the sensor data to a controller.

15 . The valve of claim 14 , wherein the sensor is a laser sensor, an infrared sensor, a radar sensor, a time of flight sensor (ToF) sensor, a proximity sensor, a Hall effect sensor, or an ultrasound sensor.

16 . The valve of claim 14 , wherein the sensor is adjacent to the valve stem such that the valve stem does not obstruct a sensing path between the sensor and the diaphragm.

17 . The valve of claim 14 , wherein the sensor is located a distance away from the diaphragm such that the diaphragm does not physically contact the sensor when the diaphragm is fully deformed in the open configuration.

18 . The valve of claim 14 , further comprising:
a fluid inlet, residing below the diaphragm, configured to receive the processing fluid; and a fluid outlet, residing below the diaphragm, configured to provide the processing fluid.

19 . The valve of claim 14 , further comprising:
a piston, residing above the valve stem, configured to actuate the valve stem.

20 . The valve of claim 19 , further comprising:
a control inlet, residing above the piston, to remove pressurized gas from the piston.

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Cheng Kuang-Wei
• Liu Yung-Tsun
• Lee Chih-Tsung
• Ni Chyi-Tsong

Classifications

• H10P14/69433

  the material being a silicon nitride not containing oxygen, e.g. SixNy or SixByNz · CPC title

• H10P14/6339

  deposition by cyclic CVD, e.g. ALD, ALE or pulsed CVD · CPC title

• H10P74/238 Primary

  comprising acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection or in-situ thickness measurement · CPC title

• H10P72/0616

  Monitoring of warpages, curvatures, damages, defects or the like · CPC title

• H10P72/0402

  Apparatus for fluid treatment (H10P72/0441, H10P72/0448 take precedence) · CPC title