Flexible sensor and method for manufacturing flexible sensor

Patent metadata

Field	Value
Publication number	US-2024377180-A1
Application number	US-202418779202-A
Country	US
Kind code	A1
Filing date	Jul 22, 2024
Priority date	Jan 25, 2022
Publication date	Nov 14, 2024
Grant date	—

Abstract

A flexible sensor includes a main substrate having flexibility, a transistor over the main substrate, a support substrate over the transistor, wherein the support substrate has flexibility and at least an outer surface of the support substrate comprises a material having electric insulation, and a variable resistance part over a first surface which is an upper surface of the support substrate, in which a resistance value of the variable resistance part changes according to strain of the variable resistance part.

First claim

What is claimed is:

1 . A flexible sensor comprising:
a main substrate having flexibility; a transistor over the main substrate; a support substrate over the transistor, wherein the support substrate has flexibility and at least an outer surface of the support substrate comprises a material having electric insulation; and a variable resistance part over a first surface which is an upper surface of the support substrate, in which a resistance value of the variable resistance part changes according to strain of the variable resistance part.

2 . The flexible sensor according to claim 1 , further comprising,
a through-hole passing through the support substrate, and a wiring electrically connected with the transistor and the variable resistance part, wherein at least a part of the wiring is disposed in the through-hole.

3 . The flexible sensor according to claim 1 , further comprising,
a coating member over the variable resistance part, wherein the coating member covers the variable resistance part, wherein, in a cross sectional secondary moment around an axis along the first surface, a cross sectional secondary moment of the main substrate and cross sectional secondary moments of the support substrate and the coating member are equal to each other.

4 . A method for manufacturing a flexible sensor comprising:
a process of providing a variable resistance part, over a first surface of a support substrate which has flexibility and at least an outer surface of the support substrate comprises a material having electric insulation, which has a resistance value that changes according to strain of the variable resistance part; a process of forming a transistor over a main substrate having flexibility; a process of providing an adhesive layer over a second surface of the support substrate opposite to the first surface after the process of providing the variable resistance part; and a process of attaching the adhesive layer to the main substrate on a side that the transistor is formed after the process of providing the adhesive layer.

5 . The method for manufacturing the flexible sensor according to claim 4 , further comprising:
a process of forming a through-hole, which passes through the support substrate and the adhesive layer, between the process of providing the adhesive layer and the process of attaching the adhesion layer; and a process of electrically connecting the transistor and the variable resistance part using a wiring through the through-hole after the process of attaching the adhesive layer.

6 . The method for manufacturing the flexible sensor according to claim 4 , further comprising:
a process of providing a coating member, which covers the variable resistance part over the first surface of the support substrate, wherein, in a cross sectional secondary moment around an axis along the first surface, a cross sectional secondary moment of the main substrate and a cross sectional secondary moment of the support substrate and the coating member are equal to each other.

Assignees

• Aist
• Nikon Corp

Inventors

• Kanazawa Shusuke
• Itagaki Motoshi
• Koizumi Shohei
• Kito Yoshiaki
• Hatayama Katsuhiro
• Shim Changhoon

Classifications

• G01B7/18 Primary

  using change in resistance · CPC title

• H10N79/00 Primary

  Integrated devices, or assemblies of multiple devices, comprising at least one solid-state element covered by group H10N70/00 (ReRAM devices H10B63/00; PCRAM devices H10B63/10) · CPC title

• G01L5/1627

  of strain gauges (using piezoresistors G01L5/162) · CPC title

• G01L1/2287

  constructional details of the strain gauges (adjustable resistors H01C10/00) · CPC title

• G01L1/2206

  Special supports with preselected places to mount the resistance strain gauges; Mounting of supports · CPC title