Coated round wire
US-2024368794-A1 · Nov 7, 2024 · US
US2024376623A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2024376623-A1 |
| Application number | US-202418779578-A |
| Country | US |
| Kind code | A1 |
| Filing date | Jul 22, 2024 |
| Priority date | Dec 21, 2021 |
| Publication date | Nov 14, 2024 |
| Grant date | — |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
A metal coated article includes a platinum-group metal region adjacent a refractory metal region, which is adjacent a substrate comprising an inorganic material. A refractory metal carbide layer is adjacent the substrate and the refractory metal layer is adjacent the refractory metal carbide layer. The platinum-group metal region comprises a refractory metal/platinum-group metal layer and a platinum-group metal layer. Related methods are also disclosed.
Opening claim text (preview).
1 . A method of forming a metal coated article, comprising: forming a refractory metal region on a boron-doped diamond substrate, wherein forming the refractory metal region comprises: depositing a refractory metal from a functional electrolyte in an alkali halide auxiliary electrolyte bath, onto the boron-doped diamond substrate to form a refractory metal layer; and converting a portion of the refractory metal layer to a refractory metal carbide layer, while a portion of the refractory metal layer remains an unreacted refractory metal, the refractory metal layer on the refractory metal carbide layer; forming a platinum-group metal region on the refractory metal region, wherein forming the platinum-group metal region comprises: depositing a platinum-group metal from a functional electrolyte in an alkali halide auxiliary electrolyte bath, onto the refractory metal layer to form a platinum-group metal layer; and converting a portion of the platinum-group metal layer to a platinum-group metal, refractory metal transition layer between the platinum-group metal layer and the refractory metal layer, the platinum-group metal layer comprising an exterior coating of the metal coated article. 2 . The method of claim 1 , wherein forming the refractory metal region comprises depositing from a functional electrolyte, a layer of tungsten, molybdenum, titanium, vanadium, or a combination thereof. 3 . The method of claim 1 , wherein converting a portion of the refractory metal layer to a refractory metal carbide layer comprises annealing the boron-doped diamond substrate and the refractory metal layer at a temperature from about 500° C. to about 600° C., for a time period range from about 1 hour to about 12 hours, and in an inert-gas environment. 4 . The method of claim 1 , wherein converting a portion of the refractory metal layer to a refractory metal carbide layer comprises annealing the boron-doped diamond substrate after forming the platinum-group metal region, wherein a platinum-group metal, refractory metal transition layer forms between the platinum-group metal layer and the refractory metal layer. 5 . The method of claim 1 , wherein forming the refractory metal region comprises depositing the refractory metal layer from the functional electrolyte at a temperature in a range of about 350° C. to about 500° C. 6 . The method of claim 1 , wherein forming the platinum-group metal region comprises depositing the refractory metal layer from the functional electrolyte at a temperature in a range of about 350° C. to about 500° C. 7 . A method of forming an alloy, comprising: dissolving an ilmenite concentrate (FeO·TiO 2 ) in an electroplating system: comprising: a crucible; a metal salt electrolyte in the crucible; a working electrode immersed in the metal salt electrolyte; a reference electrode immersed in the metal salt electrolyte; and a counter electrode immersed in the metal salt electrolyte, the counter electrode comprising: a boron-doped diamond substrate; a refractory metal carbide layer on the boron-doped diamond substrate; a refractory metal layer on the refractory metal carbide layer; and a platinum-group layer on a platinum-group metal/refractory metal layer and on the refractory metal carbide layer; and applying a voltage and a current between the working electrode and the reference electrode, to co-deposit an iron-titanium alloy on a body connected to the working electrode. 8 . The method of claim 7 , wherein the metal salt electrolyte is under an inert atmosphere, and wherein dissolving the ilmenite concentrate releases oxygen into the inert atmosphere and further comprises: supplying make-up inert gas to the crucible; and bleeding a portion of the inert atmosphere that includes oxygen. 9 . The method of claim 1 , wherein forming the platinum-group metal region comprises depositing the platinum-group metal from the functional electrolyte in the alkali halide auxiliary electrolyte bath, onto the refractory metal layer to form two or more layers of the platinum-group metal. 10 . The method of claim 1 , wherein forming the platinum-group metal region comprises depositing the platinum-group metal from the functional electrolyte in the alkali halide auxiliary electrolyte bath, onto the refractory metal layer to form three or more layers of the platinum-group metal. 11 . The method of claim 1 , wherein forming the platinum-group metal region comprises depositing the platinum-group metal from the functional electrolyte in the alkali halide auxiliary electrolyte bath, onto the refractory metal layer to form three or more layers of the platinum-group metal, wherein one or more of the three or more layers of the platinum group metal comprises a different platinum-group metal. 12 . The method of claim 1 , wherein forming the platinum-group metal region comprises depositing the platinum-group metal from the functional electrolyte in the alkali halide auxiliary electrolyte bath, onto the refractory metal layer to form three or more layers of the platinum-group metal, wherein two layers of the three or more layers of the platinum-group metal comprises the same platinum-group metal. 13 . A method of forming a metal coated article, comprising: forming a refractory metal region on a boron-doped diamond substrate, the refractory metal region having a thickness of from about 10 micrometers to about 20 micrometers, wherein forming the refractory metal region comprises: depositing a refractory metal from a functional electrolyte in an alkali halide auxiliary electrolyte bath, onto the boron-doped diamond substrate to form a refractory metal layer; and converting a portion of the refractory metal layer to a refractory metal carbide layer, while a portion of the refractory metal layer remains an unreacted refractory metal, the refractory metal layer on the refractory metal carbide layer; forming a platinum-group metal region on the refractory metal region, wherein forming the platinum-group metal region comprises: depositing a platinum-group metal from a functional electrolyte in an alkali halide auxiliary electrolyte bath, onto the refractory metal layer to form a platinum-group metal layer; and converting a portion of the platinum-group metal layer to a platinum-group metal, refractory metal transition layer between the platinum-group metal layer and the refractory metal layer, the platinum-group metal layer comprising an exterior coating of the metal coated article. 14 . The method of claim 13 , wherein converting the portion of the refractory metal layer to the refractory metal carbide layer, while the portion of the refractory metal layer remains the unreacted refractory metal, comprises: converting the portion of the refractory metal layer to the refractory metal carbide layer wherein the refractory metal carbide layer exhibits a relatively greater thickness than a thickness of the refractory metal layer. 15 . The method of claim 13 , wherein converting the portion of the refractory metal layer to the refractory metal carbide layer, while the portion of the refractory metal layer remains the unreacted refractory metal, comprises: converting the portion of the refractory metal layer to the refractory metal carbide layer wherein the refractory metal carbide layer exhibits a greater thickness by a ratio of about 3:1 than a thickness of the refractory metal layer. 16 . The method of claim 13 , wherein depositing the platinum-group metal from the functional electrolyte in the alkali halide auxiliary electrolyte bath, onto the refractory metal layer to form the pla
Platinum group metal-base component · CPC title
by heat-treatment · CPC title
Electroplating using gases, e.g. pressure influence · CPC title
Current directing devices · CPC title
Suspending or supporting devices for articles to be coated · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.