Polyimide Resin, Resin Composition Comprising Polyimide Resin and Cured Product Thereof

Patent metadata

Field	Value
Publication number	US-2024343865-A1
Application number	US-202218294340-A
Country	US
Kind code	A1
Filing date	Jun 1, 2022
Priority date	Aug 3, 2021
Publication date	Oct 17, 2024
Grant date	—

Abstract

A polymide resin is the product of a reaction between an imidized compound (P) of a polyamic acid resin with a compound (C) having a functional group, that can react with a phenolic hydroxyl group, and an ethylenically unsaturated double bond group. The polyamic acid resin is a copolymer of amino compounds (A) and a tetrabasic acid dianhydride (B). Amino compounds (A) contain an aminophenol compound (a1) having at least two amino groups per molecule, an aliphatic diamino compound (a2) having 6-36 carbon atoms, and an aromatic diamino compound (a3) having no phenolic hydroxyl group.

First claim

1 . A polyimide resin that is a reaction product of
an imidized compound (P) of a polyamic acid resin,
the polyamic acid resin being a copolymer of
amino compounds (A) containing an aminophenol compound (a1) having at least two amino groups per a molecule, an aliphatic diamino compound (a2) having 6-36 carbon atoms and an aromatic diamino compound (a3) having no phenolic hydroxy group and
a tetrabasic acid dianhydride (B),

with a compound (C) having
a functional group that can react with a phenolic hydroxy group and
an ethylenically unsaturated double bond group

2 . The polyimide resin according to claim 1 , wherein the aminophenol compound (a1) comprises a compound represented by a following formula (1):

wherein in formula (1), R 1 is a hydrogen atom, a methyl group or an ethyl group, and X is C(CH 3 ) 2 , C(CF 3 ) 2 , SO 2 , an oxygen atom, a direct bond or a bivalent linking group represented by a following formula (2):

3 . The polyimide resin according to claim 1 , wherein the tetrabasic acid dianhydride (B) comprises at least one selected from a group consisting of compounds represented by following formulas (3) to (7):

wherein in formula (6), Y is C(CF 3 ) 2 , SO 2 , CO, an oxygen atom, a direct bond or a bivalent linking group represented by following formula (2):

4 . The polyimide resin according to claim 1 , wherein the functional group, of the compound (C) that can react with the phenolic hydroxy group, is an isocyanate group or a carboxylic acid chloride group.

5 . The polyimide resin according to claim 1 , wherein the aromatic diamino compound (a3) comprises at least one selected from a group consisting of compounds represented by following formulas (8) to (11):

wherein in formula (10), R 2 is each independently a methyl group or a trifluoromethyl group, in formula (11), Z is CH(CH 3 ), SO 2 , CH 2 , O—C 6 H 4 —O, an oxygen atom, a direct bond or a bivalent linking group represented by a following formula (2):

6 . A resin composition comprising the polyimide resin according to claim 1 and a thermosetting resin.

7 . The resin composition according to claim 6 , further comprising a curing agent.

8 . The resin composition according to claim 6 , further comprising a silane coupling agent having an acrylic group.

9 . A cured product of the resin composition according to claim 6 .

10 . An article provided with the cured product according to claim 9 .

Assignees

• Nippon Kayaku Kk

Inventors

• Nishimura Kengo
• Sasaki Chie
• Tanaka Ryutaro
• Nagashima Noriyuki

Classifications

• C08L79/085

  Unsaturated polyimide precursors · CPC title

• C08G73/1046

  Polyimides containing oxygen in the form of ether bonds in the main chain · CPC title

• C08G73/1082

  wholly aromatic in the tetracarboxylic moiety · CPC title

• C08G73/1042 Primary

  Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds · CPC title

• C08G73/1039

  comprising halogen-containing substituents · CPC title