Circuit module

Patent metadata

Field	Value
Publication number	US-2024284591-A1
Application number	US-202418650918-A
Country	US
Kind code	A1
Filing date	Apr 30, 2024
Priority date	Nov 1, 2021
Publication date	Aug 22, 2024
Grant date	—

Abstract

A circuit module includes: a substrate including a first main surface and a second main surface; a resin layer on the first main surface of the substrate; an electronic component; a penetrating portion penetrating the resin layer in a thickness direction; a first conductor that is a pillar conductor present in the penetrating portion, the first conductor including a first bottom closer to the substrate and a second bottom inward of an outer surface of the resin layer; a second conductor that is a metal film covering at least a portion of a side surface of the first conductor, the second conductor including a portion extending continuously from the side surface of the first conductor to the same plane with the outer surface of the resin layer.

First claim

1 . A circuit module comprising:
a substrate including a first main surface and a second main surface; a resin layer on the first main surface of the substrate; an electronic component on the first main surface or the second main surface of the substrate; a penetrating portion penetrating the resin layer in a thickness direction; a first conductor being a pillar conductor present in the penetrating portion, the first conductor including a first bottom closer to the substrate and a second bottom inward of an outer surface of the resin layer; a second conductor being a metal film covering at least a portion of a side surface of the first conductor, the second conductor including a portion extending continuously from the side surface of the first conductor to a same plane with the outer surface of the resin layer; and a solder bump covering an opening of the penetrating portion adjacent to the outer surface of the resin layer, the solder bump including a portion present in the penetrating portion and electrically connected to the second bottom of the first conductor in the penetrating portion.

2 . The circuit module according to claim 1 ,
wherein the second bottom of the first conductor is in direct contact with the solder bump.

3 . The circuit module according to claim 2 ,
wherein the second conductor comprises a metal material harder than the first conductor.

4 . The circuit module according to claim 2 , further comprising a third conductor being a metal film covering at least a portion of a side surface of the second conductor.

5 . The circuit module according to claim 4 ,
wherein the third conductor comprises a metal material having a higher ductility than a first intermetallic compound provided at a boundary surface between the first conductor and the solder bump.

6 . The circuit module according to claim 1 , further comprising a fourth conductor being a metal film present in the penetrating portion and covering the second bottom of the first conductor,
wherein a first surface of the fourth conductor is in contact with the second bottom of the first conductor, a second surface opposite to the first surface is in contact with the solder bump at a position inward of the outer surface of the resin layer, and the first conductor is electrically connected to the solder bump via the fourth conductor.

7 . The circuit module according to claim 6 ,
wherein the fourth conductor covers the portion of the second conductor extending to a same plane with the outer surface of the resin layer.

8 . The circuit module according to claim 6 ,
wherein the second conductor and the fourth conductor have a same composition.

9 . The circuit module according to claim 6 ,
wherein the second conductor comprises a metal material harder than the first conductor.

10 . The circuit module according to claim 6 , further comprising a third conductor being a metal film covering at least a portion of the side surface of the second conductor.

11 . The circuit module according to claim 10 ,
wherein the third conductor comprises a metal material having a higher ductility than a second intermetallic compound provided at a boundary surface between the fourth conductor and the solder bump.

12 . The circuit module according to claim 3 , further comprising a third conductor being a metal film covering at least a portion of a side surface of the second conductor.

13 . The circuit module according to claim 7 ,
wherein the second conductor and the fourth conductor have a same composition.

14 . The circuit module according to claim 7 ,
wherein the second conductor comprises a metal material harder than the first conductor.

15 . The circuit module according to claim 8 ,
wherein the second conductor comprises a metal material harder than the first conductor.

16 . The circuit module according to claim 7 , further comprising a third conductor being a metal film covering at least a portion of the side surface of the second conductor.

17 . The circuit module according to claim 8 , further comprising a third conductor being a metal film covering at least a portion of the side surface of the second conductor.

18 . The circuit module according to claim 9 , further comprising a third conductor being a metal film covering at least a portion of the side surface of the second conductor.

Assignees

• Murata Manufacturing Co

Inventors

• Takakura Tsuyoshi
• Mizushiro Masaaki
• Izumi Satoshi
• Wada Ryuichiro
• Yoshimori Hiroki
• Otsubo Yoshihito
• Nomura Tadashi

Classifications

• H10W72/823

  Interconnections through encapsulations, e.g. pillars through molded resin on a lateral side a chip · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W70/611

  for connecting multiple chips together · CPC title

• H10W70/685

  comprising multiple insulating layers · CPC title

• H10W90/701

  characterised by the relative positions of pads or connectors relative to package parts · CPC title