Semiconductor package structure, method of forming the same and semiconductor package assembly having the same

Patent metadata

Field	Value
Publication number	US-2024274517-A1
Application number	US-202418418419-A
Country	US
Kind code	A1
Filing date	Jan 22, 2024
Priority date	Feb 14, 2023
Publication date	Aug 15, 2024
Grant date	—

Abstract

A semiconductor package structure includes a first component, a bonding structure on the first component, a second component connected to the first component, and a copper connector on the second component. The bonding structure includes a copper base on the first component and copper protruding portions on the copper base. The second component is connected to the first component by bonding the copper protruding portions to the copper connector, and the copper protruding portions are in contact with the copper connector.

First claim

What is claimed is:

1 . A semiconductor package structure, comprising:
a first component; a bonding structure on the first component, the bonding structure comprising:
a copper base disposed on the first component; and
copper protruding portions disposed on the copper base;
a second component connected to the first component; and a copper connector on the second component, wherein the second component is connected to the first component by bonding the copper protruding portions to the copper connector, and the copper protruding portions are in contact with the copper connector.

2 . The semiconductor package structure as claimed in claim 1 , wherein the first component is a die, a chip or a system-on-chip (SOC).

3 . The semiconductor package structure as claimed in claim 1 , wherein the second component is a package substrate, a heat spreader or an interposer substrate, and the copper connector is a copper pad.

4 . The semiconductor package structure as claimed in claim 3 , wherein the copper protruding portions and the copper connector form a fused layer having copper nano-pillars.

5 . The semiconductor package structure as claimed in claim 4 , wherein the fused layer includes voids that are distributed randomly.

6 . The semiconductor package structure as claimed in claim 1 , wherein an average diameter of the copper protruding portions is within a range of about 20 nm to about 200 nm.

7 . The semiconductor package structure as claimed in claim 1 , wherein the bonding structure on the first component is referred to as a first bonding structure and comprises a first copper base and first copper protruding portions, and the copper connector on the second component is a second bonding structure, wherein the second bonding structure comprises:
a second copper base disposed on the second component; and second copper protruding portions disposed on the second copper base.

8 . The semiconductor package structure as claimed in claim 7 , wherein the first copper protruding portions are staggered with respect to the second copper protruding portions and in direct contact with the second copper protruding portions when the first bonding structure is bonded to the second bonding structure.

9 . The semiconductor package structure as claimed in claim 8 , wherein the first copper protruding portions and the second copper protruding portions form a copper fused layer, and the copper fused layer has voids randomly distributed in the copper fused layer.

10 . The semiconductor package structure as claimed in claim 7 , wherein the second component is a semiconductor wafer or a package substrate.

11 . The semiconductor package structure as claimed in claim 7 , wherein the first component is a die, and the bonding structure is formed on a backside of the die, wherein the copper base is in direct contact with the backside of the die.

12 . The semiconductor package structure as claimed in claim 11 , wherein the second component is a heat spreader or an interposer substrate, and the first bonding structure on the die is bonded to the second bonding structure on the second component through direct contact between the first copper protruding portions and the second copper protruding portions.

13 . A method of forming a semiconductor package structure, comprising:
providing a first component; forming a bonding structure on the first component, the bonding structure comprising:
a copper base, disposed on the first component; and
copper protruding portions, disposed on the copper base;
providing a second component with a copper connector formed thereon; and connecting the first component to the second component by bonding the copper protruding portions to the copper connector, wherein the copper protruding portions are in contact with the copper connector.

14 . The method as claimed in claim 13 , wherein the copper protruding portions on the first component are bonded to the copper connector on the second component at room temperature.

15 . The method as claimed in claim 13 , wherein the copper protruding portions on the first component are bonded to the copper connector at a temperature of about 25° C. to about 250° C.

16 . The method as claimed in claim 13 , wherein forming the bonding structure comprises:
forming a patterned photoresist layer over the first component, wherein the patterned photoresist layer has an opening that exposes a pad coupled to the first component; plating copper in the opening to form the copper base; forming a template on the patterned photoresist layer and the copper base, wherein the template comprises penetrating holes that expose the patterned photoresist layer and the copper base; plating copper in the penetrating holes of the template to form the copper protruding portions on the copper base; and removing the template and the patterned photoresist layer.

17 . The method as claimed in claim 13 , wherein the copper protruding portions are arranged in an array of copper nano-pillars that protrude from the copper base before the first component is bonded to the second component.

18 . The method as claimed in claim 13 , wherein after the bonding structure is bonded to the copper connector, the method further comprises:
performing a thermal treatment on the copper protruding portions and the copper connector.

19 . The method as claimed in claim 13 , wherein the copper connector is a copper pad, and the copper protruding portions and the copper pad form a copper fused layer after the bonding structure is bonded to the copper pad.

20 . The method as claimed in claim 19 , wherein the copper fused layer includes fused nano-copper pillars and voids that are randomly formed between the fused nano-copper pillars.

21 . The method as claimed in claim 13 , wherein the bonding structure on the first component is referred to as a first bonding structure and comprises a first copper base and first copper protruding portions, and a second bonding structure on the second component is referred as the copper connector, wherein the second bonding structure comprises:
a second copper base disposed on the second component; and second copper protruding portions disposed on the second copper base.

22 . The method as claimed in claim 21 , wherein the first copper protruding portions are staggered with respect to the second copper protruding portions and in direct contact with the second copper protruding portions when the first bonding structure is bonded to the second bonding structure for electrically connecting the first component to the second component.

23 . The method as claimed in claim 22 , wherein after the first bonding structure is bonded to the second bonding structure, the first copper protruding portions and the second copper protruding portions form a copper fused layer, and the copper fused layer has voids that are randomly distributed in the copper fused layer.

24 . The method as claimed in claim 13 , wherein the first component is a die, the second component is a heat spreader or an interposer substrate, and the bonding structure is formed on a backside of the die, wherein the bonding structure on the die is in direct contact with the copper connector.

25 . A semiconductor package assembly, comprising:
a package substrate; an interposer stacked on the package structure; a first bonding layer between the package structure and the interposer;

Assignees

• Mediatek Inc

Inventors

• Chen Fa-Chuan
• Yu Ta-Jen
• Yang Bo-Jiun
• Pan Tsung-Yu
• Chen Tai-Yu
• Liu Nai-Wei
• Lin Shih-Chin
• Hsu Wen-Sung

Classifications

• H10D64/01328

  by defining the conductor using a sidewall spacer mask, a transformation under a mask or a plating at a sidewall · CPC title

• H10W72/952

  comprising metals or metalloids, e.g. PbSn, Ag or Cu · CPC title

• H10W72/942

  relative to underlying supporting features, e.g. bond pads, RDLs or vias · CPC title

• H10W72/923

  Bond pads having multiple stacked layers · CPC title

• H10W72/252

  comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu · CPC title