Semiconductor package structure, method of forming the same and semiconductor package assembly having the same
US-2024274517-A1 · Aug 15, 2024 · US
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Chen Fa-Chuan patents
Chen Fa-Chuan is listed as an inventor on 2 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Chen Fa-Chuan |
| Total patents | 2 |
| First publication | Jan 12, 2023 |
| Latest publication | Aug 15, 2024 |
Notable patents
Publications ranked by popularity score, then publication date.
Semiconductor package structure
US-2023011666-A1 · Jan 12, 2023 · US
Recent patents
Latest publications not already listed above.
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Mediatek Inc | 1 |
| Mediatek Singapore Pte Ltd | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/00 | 2 |
| H10W90/701 | 2 |
| H10D64/01328 | 1 |
| H10W72/952 | 1 |
| H10W72/942 | 1 |