Semiconductor device manufacturing method and semiconductor device manufactured using the same
US-2024395745-A1 · Nov 28, 2024 · US
US2024243150A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2024243150-A1 |
| Application number | US-202318488078-A |
| Country | US |
| Kind code | A1 |
| Filing date | Oct 17, 2023 |
| Priority date | Jan 13, 2023 |
| Publication date | Jul 18, 2024 |
| Grant date | — |
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An image sensor includes a substrate including a first region and a second region disposed in a periphery of the first region. The first region includes a plurality of unit pixels and a color filter structure, and the second region includes a dummy structure including a second color filter and a plurality of dummy lenses on the second color filter. The color filter structure includes a first extension portion extending in a first direction and a second extension portion extending in a second direction, and the dummy structure includes a third extension portion extending in the first direction and a fourth extension portion extending in the second direction. A first micro-lens, a second micro-lens, and a third micro-lens are in a first corner portion, and a first dummy lens, a second dummy lens, and a third dummy lens are in the second corner portion.
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What is claimed is: 1 . An image sensor comprising: a substrate including a first region and a second region in a periphery of the first region; wherein the first region includes a plurality of unit pixels and a color filter structure, each unit pixel of the plurality of unit pixel includes a photoelectric conversion layer, the color filter structure includes a plurality of first color filters and a plurality of micro-lenses on the plurality of first color filters; wherein the second region includes a dummy structure including a second color filter and a plurality of dummy lenses on the second color filter, wherein a size of each of the plurality of dummy lenses is larger than a size of each of the plurality of micro-lenses; wherein, in a region adjacent to the dummy structure, the color filter structure includes a first extension portion extending in a first direction and a second extension portion extending in a second direction, wherein the first direction and the second direction intersect, and wherein the first extension portion and the second extension portion are connected by a first corner portion; wherein, in a region adjacent to the color filter structure, the dummy structure includes a third extension portion extending in the first direction and a fourth extension portion extending in the second direction, wherein the third extension portion and the fourth extension portion are connected by a second corner portion; wherein a first micro-lens, a second micro-lens, and a third micro-lens among the plurality of micro-lenses are in the first corner portion, and wherein a slope of each virtual line connecting outermost sidewalls of each of the first-micro lens, the second micro-lens, and the third micro-lens is different; and wherein a first dummy lens, a second dummy lens, and a third dummy lens from among the plurality of dummy lenses are in the second corner portion, wherein a slope of each virtual line connecting outermost sidewalls of each of the first dummy lens, the second dummy lens, and the third dummy lens is different. 2 . The image sensor of claim 1 , wherein the slope of each virtual line connecting the outermost sidewalls of each of the first micro-lens, the second micro-lens, and the third micro-lens and a slope of each virtual line connecting the outermost sidewalls of each additional micro-lens from among the plurality of micro-lenses is increased or reduced as the virtual line approaches the first extension portion. 3 . The image sensor of claim 1 , wherein a slope formed by the virtual line connecting the outermost sidewalls of each of the plurality of micro-lenses in the first corner portion and the virtual line connecting the outermost sidewalls of each of the plurality of micro-lenses in the first extension portion is an acute angle. 4 . The image sensor of claim 1 , wherein the slope of each virtual line connecting the outermost sidewalls of the first dummy lens, the second dummy lens, and the third dummy lens and a slope of each virtual line connecting the outermost sidewalls of each additional dummy lens from among the plurality of dummy lenses is increased or reduced as the virtual line approaches the third extension portion. 5 . The image sensor of claim 1 , wherein a slope formed by the virtual line connecting the outermost sidewalls of each of the plurality of dummy lenses in the second corner portion and the virtual line connecting the outermost sidewalls of each of the plurality of dummy lenses in the third extension portion is an acute angle. 6 . The image sensor of claim 1 , wherein the substrate further includes a third region between the first and second regions, wherein the third region includes the second color filter. 7 . The image sensor of claim 6 , wherein the color filter structure further includes a grid pattern between the plurality of first color filters, and wherein the grid pattern is not between the third region and the first region. 8 . The image sensor of claim 1 , further comprising a first passivation layer formed on the plurality of micro-lenses along a surface of each of the plurality of micro-lenses. 9 . The image sensor of claim 8 , further comprising a second passivation layer formed on the first passivation layer, wherein a thickness of the second passivation layer is less than a thickness of the first passivation layer. 10 . The image sensor of claim 9 , wherein the first passivation layer is not in a region between the plurality of micro-lenses to partially expose the plurality of micro-lenses, and wherein the second passivation layer is formed on the first passivation layer to cover exposed micro-lenses from among the plurality of micro-lenses. 11 . The image sensor of claim 9 , wherein the second passivation layer contacts the partially exposed micro-lenses. 12 . An image sensor comprising: a substrate including a first region, a second region in a periphery of the first region, and a third region between the first region and the second region; wherein the first region includes a plurality of unit pixels and a color filter structure, wherein the plurality of unit pixels include including a photoelectric conversion layer, and wherein the color filter structure includes a plurality of first color filters, a plurality of micro-lenses on the plurality of first color filters, and a grid pattern between the plurality of first color filters and the plurality of micro-lenses; wherein the second region includes a first dummy structure that includes a second color filter and a plurality of dummy lenses on the second color filter, wherein a size of each of the plurality of dummy lenses is larger than a size of each of the plurality of micro-lenses; wherein the third region includes a second dummy structure that includes the second color filter, wherein, in a region adjacent to the first dummy structure, the color filter structure includes a first extension portion extending in a first direction and a second extension portion extending in a second direction, wherein the first direction and second direction intersect, and wherein the first extension portion and the second extension portion are connected by a first corner portion; wherein, in a region adjacent to the color filter structure, the first dummy structure includes a third extension portion extending in the first direction and a fourth extension portion extending in the second direction, wherein the third extension portion and the fourth extension portion are connected by a second corner portion; and wherein the grid pattern is not disposed in the first corner portion. 13 . The image sensor of claim 12 , wherein the plurality of micro-lenses includes a first micro-lens, a second micro-lens, and a third micro-lens that are disposed in the first corner portion, and a slope of each virtual line connecting outermost sidewalls of each of the first micro-lens, the second micro-lens, and the third micro-lens is different. 14 . The image sensor of claim 12 , wherein the plurality of dummy lenses includes a first dummy lens, a second dummy lens, and a third dummy lens that are disposed in the second corner portion, and a slope of each virtual line connecting outermost sidewalls of each of the first dummy lens, the second dummy lens, and the third dummy lens is different. 15 . The image sensor of claim 12 , wherein a slope of each virtual line connecting outermost sidewalls of each of the plurality of first color filters is different. 16 . The image sensor of claim 12 , wherein a slope of each virtual line connecting outermost sidewalls of the second color filter
Interconnections · CPC title
Colour image sensors · CPC title
Microlenses · CPC title
Geometry or disposition of elements in pixels, e.g. address-lines or gate electrodes · CPC title
Colour filters · CPC title
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