Circuit board having composite magnetic components mounted thereon

Patent metadata

Field	Value
Publication number	US-2024237217-A9
Application number	US-202218546796-A
Country	US
Kind code	A9
Filing date	Mar 8, 2022
Priority date	Mar 10, 2021
Publication date	Jul 11, 2024
Grant date	—

Abstract

The present invention relates to a main magnetic component applicable to a core module of an electric vehicle. A composite magnetic component according to one embodiment of the present invention comprises: a transformer that converts power on an input side to transmit same to an output side, and has a first core and a first coil disposed in the first core; a ZVS inductor that refluxes a residual current to the input side without FET operation loss, and has a second core and a second coil disposed within the second core; an output inductor that removes the ripple of a current on the output side, and has a third core and a third coil disposed in the third core; and an EMI inductor that reduces electric noise of the current on the output side, and has a fourth core and a fourth coil disposed in the fourth core. Here, the second core, the third core, and the fourth core are made of different materials, and the first core and the second core are made of the same material.

First claim

1 . A circuit board, comprising:
a board including a circuit unit formed thereon; a first module disposed on the board; and a second module disposed on the board adjacent to the first module and configured to be electrically connected to the first module via the circuit unit, wherein the first module includes: a transformer including a first core and a first coil disposed in the first core and including primary and secondary coils configured to convert power on an input side and to transmit the converted power to an output side; and a ZVS inductor disposed adjacent to the transformer, the ZVS inductor including a second core and a second coil disposed in the second core and configured to return a residual current to the input side, wherein the second module includes: an output inductor including a third core and a third coil disposed in the third core and configured to remove ripple components included in a current on the output side; and an EMI inductor disposed adjacent to the output inductor, the EMI inductor including a fourth core and a fourth coil disposed in the fourth core and configured to reduce electrical noise included in the current on the output side, wherein the first coil and the second coil are configured to be electrically connected to each other, and at least partially overlap each other in a first direction from the first core toward the second core, wherein the third coil and the fourth coil are configured to be electrically connected to each other via the circuit unit, and the third core and the fourth core at least partially overlap each other in a second direction perpendicular to the first direction, and wherein the first core includes a material identical to a material of the second core, and the second core includes a material different from a material of at least one of the third core and the fourth core.

2 . The circuit board according to claim 1 , wherein the first and second cores include ferrite, and
wherein the third and fourth cores include iron (Fe) and silicon (Si).

3 . The circuit board according to claim 1 , comprising:
a first base at least partially disposed in the third core, the first base being configured to receive the third coil; and a second base configured to receive the fourth core.

4 . The circuit board according to claim 3 , wherein the first base includes:
a third-coil-seating portion including a through-hole formed therein to allow a center leg of the third core to pass therethrough, the third-coil-seating portion being configured to allow the third coil to be seated thereon; an inner side wall formed on the third-coil-seating portion so as to surround the through-hole; and an outer side wall formed on an outer circumference of the third-coil-seating portion, the outer side wall including a coil path slot formed therein to allow a flat wire coil escaping from the third core to pass therethrough.

5 . The circuit board according to claim 4 , wherein the first base includes a pair of third-core-outer-leg-slot portions formed in both sides of the third-coil-seating portion to allow a pair of outer legs of the third core to be inserted thereinto and located therein.

6 . The circuit board according to claim 5 , wherein each of the third-core-outer-leg-slot portions includes a pair of first extension walls extending from the outer side wall in an outward direction, with a corresponding one of the outer legs interposed therebetween.

7 . The circuit board according to claim 5 , wherein the first base includes a first coil hole formed in one side of the third-coil-seating portion, and
wherein the third coil is disposed so as to be inserted into the first coil hole.

8 . The circuit board according to claim 5 , wherein the first base includes a fastening portion extending outside the third core from the third-coil-seating portion and including at least one fastening hole formed therein.

9 . The circuit board according to claim 3 , wherein the second base includes:
a fourth-core-seating portion configured to allow the fourth core to be seated and supported thereon; and a fourth-coil-seating portion configured to allow the fourth coil to be seated thereon, wherein the fourth-core-seating portion includes a pair of vertical walls disposed with the fourth core interposed therebetween, and a seating protrusion protruding from a lower end of each of the vertical walls to support the fourth core seated thereon, and wherein the fourth-coil-seating portion is formed so as to interconnect the pair of vertical walls in the fourth core.

10 . The circuit board according to claim 9 , wherein the second base includes a pin portion extending from the fourth-coil-seating portion and including a pin hole formed therein.

11 . The circuit board according to claim 3 , wherein the first base and the second base are integrally formed with each other.

12 . The circuit board according to claim 3 , wherein the first base includes a third-coil-seating portion including a through-hole formed therein to allow a center leg of the third core to pass therethrough, the third-coil-seating portion being configured to allow the third coil to be seated thereon, and a protruding portion protruding from one side of the third-coil-seating portion to a height lower than a thickness of a coil wire of the third coil and including a coil path slot formed therein to allow the third coil escaping from the third core to pass therethrough.

13 . The circuit board according to claim 12 , wherein one end portion of the third coil is disposed above the fourth core, and
wherein the circuit board comprises a bracket configured to surround an upper surface and both side surfaces of the fourth core in a state in which the third coil is disposed above the fourth core.

14 . The circuit board according to claim 1 , wherein the third coil and the fourth coil are continuously formed using a single flat wire coil disposed so as to enter the third core, to be spirally wound around a center leg of the third core in a downward direction, to escape from the third core, and to be bent upward to penetrate the fourth core.

15 . The circuit board according to claim 2 , wherein the third core includes nickel (Ni), and
wherein the fourth core further includes boron (B).

Assignees

• Lg Innotek Co Ltd

Inventors

• Jeong Jong Sun
• Lee Jung Ki
• Lee Sang Won

Classifications

• H02M3/003

  Constructional details, e.g. physical layout, assembly, wiring or busbar connections · CPC title

• H05K2201/1003

  Non-printed inductor · CPC title

• H05K1/0233

  Filters, inductors or a magnetic substance · CPC title

• H01F27/28

  Coils; Windings; Conductive connections · CPC title

• H01F27/24

  Magnetic cores · CPC title