Actinic ray-sensitive or radiation-sensitive resin composition, actinic ray-sensitive or radiation-sensitive film, pattern forming method, method for manufacturing electronic device, and compound

Patent metadata

Field	Value
Publication number	US-2024210826-A1
Application number	US-202418586593-A
Country	US
Kind code	A1
Filing date	Feb 26, 2024
Priority date	Aug 31, 2021
Publication date	Jun 27, 2024
Grant date	—

Abstract

The present invention provides an actinic ray-sensitive or radiation-sensitive resin composition including: a resin (A) that is decomposed by the action of an acid and thereby increased in polarity; and a compound (C) that generates an acid upon irradiation with actinic rays or radiation and that is represented by a specific formula. The resin (A) includes a specific repeating unit represented by specific general formula (AI).

First claim

What is claimed is:

1 . An actinic ray-sensitive or radiation-sensitive resin composition comprising:
a resin (A) that is decomposed by the action of an acid and thereby increased in polarity; and a compound (C) that generates an acid upon irradiation with actinic rays or radiation and that is represented by general formula (I) below, wherein the resin (A) has a repeating unit represented by the following general formula (AI):

wherein, in the general formula (AI),
R A , R B , and R C each independently represent a hydrogen atom, an alkyl group, a cycloalkyl group, a halogen atom, a cyano group, or an alkoxycarbonyl group; R C and Ar A may be bonded together to form a ring; when R C and Ar A are bonded together to form a ring, R C represents a single bond or an alkylene group;
L A represents a single bond or a divalent linking group;
Ar A represents an (n+1) valent aromatic ring group; when Ar A and R C are bonded together to form a ring, Ar A represents an (n+2) valent aromatic ring group; and
n represents an integer of 1 to 5:

wherein, in the general formula (I),
R 0 represents a substituent;
p is an integer of 0 to 4, and q is an integer of 0 to 3, provided that p+q≥1;
when q is 0, the sum of the total number of carbon atoms and the total number of oxygen atoms in each R 0 is 3 or more;
when p is an integer of 2 or more, a plurality of R 0 's may be the same or different from each other; and
M + represents a cation.

2 . The actinic ray-sensitive or radiation-sensitive resin composition according to claim 1 , wherein, in the general formula (I), R 0 when p is 1 and at least one of a plurality of R 0 's when p is 2 to 4 each represent an alkyl group, —C(═O)R 1 , or an aryl group, and wherein R 1 represents an organic group.

3 . The actinic ray-sensitive or radiation-sensitive resin composition according to claim 1 , further comprising a compound (B) that, upon irradiation with actinic rays or radiation, generates an acid stronger than the acid generated from the compound (C).

4 . The actinic ray-sensitive or radiation-sensitive resin composition according to claim 1 , wherein the resin (A) has a repeating unit having a group that is decomposed to generate an acid upon irradiation with actinic rays or radiation.

5 . The actinic ray-sensitive or radiation-sensitive resin composition according to claim 4 , wherein the repeating unit having a group that is decomposed to generate an acid upon irradiation with actinic rays or radiation is a repeating unit represented by the following general formula (S-1):

wherein, in the general formula (S-1),
R 21 represents a hydrogen atom, an alkyl group, an aryl group, or a halogen atom;
X 1 represents a single bond or a divalent linking group;
R c1 to R c3 each independently represent an alkyl group, an aryl group, or a heteroaryl group; and two selected from the group consisting of R c1 to R c3 may be bonded together to form a ring structure.

6 . The actinic ray-sensitive or radiation-sensitive resin composition according to claim 1 , wherein, in the general formula (I), p represents 3 or 4.

7 . The actinic ray-sensitive or radiation-sensitive resin composition according to claim 1 , wherein, in the general formula (I), R 0 when p is 1 and at least one of a plurality of R 0 's when p is 2 to 4 each represent —C(═O)R 1 .

8 . The actinic ray-sensitive or radiation-sensitive resin composition according to claim 1 , wherein, in the general formula (I), R 0 when p is 1 and at least one of a plurality of R 0 's when p is 2 to 4 each represent an aryl group.

9 . An actinic ray-sensitive or radiation-sensitive film formed from the actinic ray-sensitive or radiation-sensitive resin composition according to claim 1 .

10 . A pattern forming method comprising:
forming an actinic ray-sensitive or radiation-sensitive film on a substrate from the composition according to claim 1 ; exposing the actinic ray-sensitive or radiation-sensitive film to light; and developing the exposed actinic ray-sensitive or radiation-sensitive film with a developer.

11 . A method for manufacturing an electronic device, the method comprising the pattern forming method according to claim 10 .

12 . A compound represented by the following general formula (IA):

wherein, in the general formula (IA),
R 0 represents an alkyl group, —C(═O)R 1 , or an aryl group; R 1 represents an organic group;
p is an integer of from 0 to 4, and q is an integer of from 0 to 3, provided that p+q≥1;
when q is 0, the sum of the total number of carbon atoms and the total number of oxygen atoms in each R 0 is 3 or more;
when p is an integer of 2 or more, a plurality of R 0 's may be the same or different from each other; and
M + represents a cation.

13 . The compound according to claim 12 , wherein, in the general formula (IA), R 0 when p is 1 and at least one of a plurality of R 0 's when p is 2 to 4 each represent an alkyl group, —C(═O)R 1 , or an aryl group, and R 1 represents an organic group.

14 . The compound according to claim 12 , wherein, in the general formula (IA), p represents 3 or 4.

15 . The compound according to claim 12 , wherein, in the general formula (IA), R 0 when p is 1 and at least one of a plurality of R 0 's when p is 2 to 4 each represent —C(═O)R 1 .

16 . The compound according to claim 12 , wherein, in the general formula (IA), R 0 when p is 1 and at least one of a plurality of R 0 's when p is 2 to 4 each represent an aryl group.

Assignees

• Fujifilm Corp

Inventors

• Miyoshi Taro
• Yamaguchi Shuhei
• Yoshioka Tomoaki
• Fukuzaki Eiji
• KAMINO Yuka

Classifications

• G03F7/0392

  the macromolecular compound being present in a chemically amplified positive photoresist composition · CPC title

• G03F7/0046

  with perfluoro compounds, e.g. for dry lithography (G03F7/0048 takes precedence) · CPC title

• G03F7/325

  Non-aqueous compositions · CPC title

• G03F7/20

  Exposure; Apparatus therefor (photographic printing apparatus for making copies G03B27/00) · CPC title

• G03F7/0397

  the macromolecular compound having an alicyclic moiety in a side chain · CPC title