Computer system, dimension measurement method, and storage medium

Patent metadata

Field	Value
Publication number	US-2024200939-A1
Application number	US-202117802673-A
Country	US
Kind code	A1
Filing date	Jun 14, 2021
Priority date	Jun 14, 2021
Publication date	Jun 20, 2024
Grant date	—

Abstract

A computer system providing a function for: extracting, from image data of a semiconductor pattern, coordinate information of a base point for measuring a dimension of a desired location of the semiconductor pattern; and measuring the dimension using the coordinate information of the base point. The computer system includes a training device in which a pose estimation model for outputting coordinate information of at least two base points as a training result is implemented. The training device is trained in advance using teacher data having the image data of the semiconductor pattern as an input and the coordinate information of at least two base points as an output, and extracts, for new image data input into the training device, the coordinate information of at least two base points and a dimension.

First claim

1 . A computer system for providing a function for: extracting, from image data of a semiconductor pattern, coordinate information about a base point for measuring a dimension of a desired location of the semiconductor pattern; and measuring the dimension using the coordinate information of the base point,
the computer system comprising a training device in which a pose estimation model for outputting the coordinate information of at least two of the base points as a training result is implemented, wherein the training device is trained in advance using teacher data having image data of the semiconductor pattern as an input and the coordinate information of the at least two base points as an output, the computer system, with respect to new image data input into the training device, extracting the coordinate information of the at least two base points and the dimension.

2 . The computer system according to claim 1 , further comprising a storage medium having installed therein an image analysis tool having a function for calculating, through pixel computation, a distance between predetermined locations of the image data designated on a GUI, and a function for outputting coordinate information of the desired locations.

3 . The computer system according to claim 2 , further comprising a first software module for converting output data of the image analysis tool including the coordinate information, into annotation data constituting the teacher data.

4 . The computer system according to claim 2 , further comprising a second software module for, using output data of the image analysis tool including the coordinate information, and rule information input in advance, generating definition data of a skeleton structure of the pose estimation model.

5 . The computer system according to claim 1 , further comprising a display device functioning as a user interface for displaying the image data,
wherein the display device displays, on the user interface, data in which the image data of the semiconductor pattern and the at least two extracted base points are overlapped.

6 . The computer system according to claim 5 , wherein the display device further displays, in an overlapped manner on the user interface, a skeleton structure of the semiconductor pattern composed of a plurality of connections of a line segment connecting the at least two base points.

7 . The computer system according to claim 1 , wherein the image data of the semiconductor pattern is a cross-sectional image obtained by a charged particle beam apparatus.

8 . A dimension measurement method comprising, using a computer system, extracting, from image data of a semiconductor pattern, coordinate information of a base point for measuring a dimension of a desired location of the semiconductor pattern, and measuring the dimension using the coordinate information of the base point,
the method comprising the computer system inputting, into a pose estimation model trained to automatically design a skeleton including at least two base points on the semiconductor pattern as keypoints, and to output coordinate information of the keypoints, image data of an object to be measured including the semiconductor pattern, and generating coordinate information of the keypoints of the image data that has been input, and the computer system measuring the dimension using the coordinate information of the keypoints of the image data of the object to be measured, the pose estimation model being trained using teacher data having the image data of the semiconductor pattern as an input and the coordinate information of the at least two base points as an output.

9 . The dimension measurement method according to claim 8 , wherein the computer system, using an image analysis tool having a function for calculating, through pixel computation, a distance between predetermined locations of the image data designated on a GUI, measures the dimension with reference to the coordinate information of the at least two base points on the image analysis tool.

10 . The dimension measurement method according to claim 9 , wherein the image analysis tool further comprises a function for outputting the coordinate information of the desired locations, and
the computer system, during training of the pose estimation model, converts output data of the image analysis tool including the coordinate information into annotation data of the teacher data.

11 . The dimension measurement method according to claim 9 , wherein the computer system, during training of the pose estimation model, generates, using output data of the image analysis tool including the coordinate information, and rule information input in advance, definition data of a skeleton structure of the pose estimation model.

12 . The dimension measurement method according to claim 8 , further comprising:
the computer system receiving, via a network, new image data of the object to be measured from an external computer; and the computer system performing measurement of the dimension of the semiconductor pattern included in the new image data of the object to be measured, and transmitting a result of measurement of the dimension to the external computer.

13 . A storage medium storing a program for causing a computer to realize a dimension measurement function for: extracting, from image data of a semiconductor pattern, coordinate information of a base point for measuring a dimension of a desired location of the semiconductor pattern; and measuring the dimension using the coordinate information,
the program including a program code for realizing a training device describing a pose estimation model for outputting coordinate information of at least two of the base points as a training result, wherein the training device has an input layer having the image data of the semiconductor pattern as an input, and an output layer outputting the coordinate information of the at least two base points, and the pose estimation model is capable of being trained using teacher data that has the image data of the semiconductor pattern as an input and the coordinate information of the at least two base points as an output.

14 . The storage medium according to claim 13 , wherein
the program has a program code for converting output data of the image analysis tool including the coordinate information, into annotation data of the teacher data, and the image analysis tool has a function for calculating, through pixel computation, a distance between predetermined locations of the image data designated on a GUI.

15 . The storage medium according to claim 13 , wherein
the program has a program code for generating, using output data of the image analysis tool including the coordinate information and rule information input in advance, definition data of a skeleton structure of the pose estimation model, and the image analysis tool has a function for calculating, through pixel computation, a distance between predetermined locations of the image data designated on a GUI.

Assignees

• Hitachi High Tech Corp

Inventors

• Okuyama Yutaka
• Ohmori Takeshi

Classifications

• H10P74/00

  Testing or measuring during manufacture or treatment of wafers, substrates or devices · CPC title

• H01J2237/2817

  Pattern inspection · CPC title

• H01J37/222

  Image processing arrangements associated with the tube · CPC title

• G06T7/0004

  Industrial image inspection · CPC title

• G06T7/0006

  using a design-rule based approach · CPC title