Laser processing apparatus, laser processing method, and electronic device manufacturing method

Patent metadata

Field	Value
Publication number	US-2024173796-A1
Application number	US-202318399043-A
Country	US
Kind code	A1
Filing date	Dec 28, 2023
Priority date	Aug 31, 2021
Publication date	May 30, 2024
Grant date	—

Abstract

A laser processing apparatus forms a hole in a workpiece having a resin layer on a processing surface by irradiating the workpiece with a laser beam discharge-excited between a pair of discharge electrodes, and includes a laser apparatus that outputs the laser beam having a first divergence angle in a discharge direction between the pair of discharge electrodes larger than a second divergence angle in a direction perpendicular to the discharge direction and a laser beam traveling direction, a transfer mask that forms a transfer pattern, an introducing optical system for guiding the laser beam to the transfer mask, a projection optical system that images the transfer pattern on the resin layer, and a divergence angle adjusting optical system that is disposed on an optical path of the laser beam and adjusts a difference between the first divergence angle and the second divergence angle to be reduced.

First claim

What is claimed is:

1 . A laser processing apparatus which forms a hole in a workpiece having a resin layer disposed on a processing surface by irradiating the workpiece with a laser beam discharge-excited between a pair of discharge electrodes and then output, the laser processing apparatus comprising:
a laser apparatus configured to output the laser beam having a first divergence angle in a discharge direction between the pair of discharge electrodes larger than a second divergence angle in a direction perpendicular to the discharge direction and a traveling direction of the laser beam; a transfer mask configured to form a transfer pattern; an introducing optical system for guiding the laser beam to the transfer mask; a projection optical system configured to image the transfer pattern on the resin layer; and a divergence angle adjusting optical system disposed on an optical path of the laser beam and configured to adjust a difference between the first divergence angle and the second divergence angle to be reduced.

2 . The laser processing apparatus according to claim 1 , wherein
the resin layer is made of a polyimide or a fluorine-based polymer material, and the workpiece is a glass substrate.

3 . The laser processing apparatus according to claim 1 , wherein
the divergence angle adjusting optical system includes a circular opening, and is disposed on an optical path between the transfer mask and the workpiece so that the laser beam passes through the opening.

4 . The laser processing apparatus according to claim 1 , wherein
the divergence angle adjusting optical system includes a rectangular opening, and is disposed on an optical path between the transfer mask and the workpiece so that the laser beam passes through the opening.

5 . The laser processing apparatus according to claim 1 , wherein
the divergence angle adjusting optical system is a beam expander configured to expand a beam width of the laser beam relating to the first divergence angle.

6 . The laser processing apparatus according to claim 1 , wherein
the divergence angle adjusting optical system is a beam expander configured to reduce a beam width of the laser beam relating to the second divergence angle.

7 . The laser processing apparatus according to claim 1 , wherein
the transfer mask is a multipoint transfer mask.

8 . The laser processing apparatus according to claim 7 , wherein
the transfer mask includes a plurality of transmission holes, the divergence angle adjusting optical system is a fly-eye lens, and a beam expander for guiding the laser beam to the fly-eye lens is provided.

9 . The laser processing apparatus according to claim 1 , wherein
the laser beam is an ArF laser beam.

10 . A laser processing method for forming a hole in a workpiece having a resin layer disposed on a processing surface by irradiating the workpiece with a laser beam discharge-excited between a pair of discharge electrodes and then output, the laser processing method comprising:
a workpiece setting step of setting the workpiece on which the resin layer is disposed on a table of a moving stage; a transfer positioning step of performing relative positioning between a transfer position and the workpiece such that the transfer position and a surface of the resin layer coincide; a laser outputting step of outputting the laser beam, having a first divergence angle in a discharge direction between a pair of discharge electrodes larger than a second divergence angle in a direction perpendicular to the discharge direction and a traveling direction of the laser beam, to the workpiece on which the resin layer is disposed; an introducing optical step of guiding the laser beam to a transfer mask; a transfer pattern forming step of forming a transfer pattern; a transfer imaging step of imaging the transfer pattern on the resin layer; and a divergence angle adjusting step of adjusting a difference between the first divergence angle and the second divergence angle to be reduced.

11 . The laser processing method according to claim 10 , wherein
in the divergence angle adjusting step, the laser beam passes through a circular opening of a divergence angle adjusting optical system disposed on an optical path between the transfer mask and the workpiece.

12 . The laser processing method according to claim 10 , wherein
in the divergence angle adjusting step, the laser beam passes through a rectangular opening of a divergence angle adjusting optical system disposed on an optical path between the transfer mask and the workpiece.

13 . The laser processing method according to claim 10 , wherein
in the divergence angle adjusting step, a beam width of the laser beam relating to the first divergence angle is expanded.

14 . The laser processing method according to claim 10 , wherein
the transfer mask is a multipoint transfer mask.

15 . An electronic device manufacturing method comprising:
a first coupling step of coupling and electrically connecting an interposer and an integrated circuit chip to each other; and a second coupling step of coupling and electrically connecting the interposer and a circuit board to each other, the interposer including an insulating substrate in which a plurality of through-holes are formed and conductors provided in the through-holes, the through-holes being formed by a laser processing method of forming a hole at each irradiation position of a plurality of laser beams with which the insulating substrate having a processing surface with a resin layer disposed thereon is irradiated, and the laser processing method including generating the laser beam having a first divergence angle in a discharge direction between a pair of discharge electrodes larger than a second divergence angle in a direction perpendicular to the discharge direction and a traveling direction of the laser beam, reducing a difference between the first divergence angle and the second divergence angle of the laser beam, and then imaging the laser beam on the resin layer to form the through-holes in the insulating substrate.

16 . The electronic device manufacturing method according to claim 15 , wherein
the laser processing method further includes reducing the difference between the first divergence angle and the second divergence angle by having the laser beam pass through a circular opening of a divergence angle adjusting optical system disposed on an optical path between a transfer mask and a workpiece.

17 . The electronic device manufacturing method according to claim 15 , wherein
the laser processing method further includes reducing the difference between the first divergence angle and the second divergence angle by having the laser beam pass through a rectangular opening of a divergence angle adjusting optical system disposed on an optical path between a transfer mask and a workpiece.

18 . The electronic device manufacturing method according to claim 15 , wherein
the laser processing method further includes reducing the difference between the first divergence angle and the second divergence angle by expanding a beam width of the laser beam relating to the first divergence angle.

19 . The electronic device manufacturing method according to claim 15 , wherein
the laser processing method further includes guiding the laser beam to a multipoint transfer mask.

Assignees

• Gigaphoton Inc

Inventors

• Kawasuji Yasufumi
• Adachi Yasuhiro
• Suwa Akira

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W99/00

  Subject matter not provided for in other groups of this subclass · CPC title

• H10W70/095

  of vias therein · CPC title

• B23K26/402

  involving non-metallic material, e.g. isolators · CPC title

• B23K26/0648

  comprising lenses · CPC title