Method for manufacturing electronic device
US-2024258152-A1 · Aug 1, 2024 · US
US2024166917A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2024166917-A1 |
| Application number | US-202318387155-A |
| Country | US |
| Kind code | A1 |
| Filing date | Nov 6, 2023 |
| Priority date | Nov 9, 2022 |
| Publication date | May 23, 2024 |
| Grant date | — |
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A sealant removal composition provided that includes a pyrrolidone solvent, a non-ionic surfactant, and at least one co-solvent. The composition is well suited to removal sulfur-based polymer and silicone-based polymer sealant. A process of removing a sealant from a substrate is provided that includes applying the composition to the sealant. After allowing dwell time for the sealant to swell on the substrate, the sealant is removed.
Opening claim text (preview).
1 . A sealant removal composition comprising: one or more pyrrolidone solvents; a non-ionic surfactant; at least one co-solvent; and optionally at least one additive of solubilizing agents, dyes, fragrances, thickeners, water, and combinations thereof. 2 . The sealant removal composition of claim 1 wherein said one or more pyrrolidone solvent is present up to 45 total weight percent. 3 . The sealant removal composition of claim 1 wherein said pyrrolidone solvent has the cyclic structure (I): where R 1 is hydrogen, or C 1 -C 3 linear alkyl; R 2 is hydrogen, C 1 -C 12 linear alkyl, C 1 -C 12 branched alkyl, C 5 -C 12 cyclic alkyl, or C 1 -C 12 linear alkoxy; and R is hydrogen, or —C 6 R 3 5 ; where R 3 in each occurrence is independently hydrogen, —C 6 H 5 , and substituted C 6 aryl with one or more hydrogen substituted by C 1 -C 12 linear alkyl, C 1 -C 12 branched alkyl, or C 5 -C 12 cyclic alkyl. 4 . The sealant removal composition of claim 1 wherein said pyrrolidone solvent is pyrrolidone, N-methyl-2-pyrrolidone, N-ethyl-2-pyrrolidone, N-n-butyl-2-pyrrolidone, N-tert-butyl-2-pyrrolidone, N-cyclohexyl-2-pyrrolidone, N-n-butylpyrrolidone, N-isobutylpyrrolidone, N-t-butylpyrrolidone, N-n-pentylpyrrolidone, N-(methyl-substituted butyl)pyrrolidones, phenyl-methyl-substituted N-propylpyrrolidone, phenyl-methyl-substituted N-butyl pyrrolidone, N-(methoxypropyl)pyrrolidone, 1,5-dimethyl-pyrrolidone, and mixtures of any of the aforementioned. 5 . The sealant removal composition of claim 1 wherein said pyrrolidone solvent comprises 1-butylpyrrolidin-2-one. 6 . The sealant removal composition of claim 1 wherein said first non-ionic surfactant has a first surfactant HLB value of between 6 and 9 and said second non-ionic surfactant has a second surfactant HLB value of between 12 and 16. 7 . The sealant removal composition of claim 1 wherein said at least one co-solvent is present up to 90 total weight percent. 8 . The sealant removal composition of claim 1 said at least one co-solvent comprises at least one of a glyme, a polyether, an amide, or an acetal. 9 . The sealant removal composition of claim 8 wherein said glyme is present and has the structure (IV): R—(OCHR 1 CHR 1 ) n —OR (IV) where R in each occurrence is independently C 1 -C 3 linear alkyl; R 1 in each occurrence is independently C 1 -C 3 linear alkyl and n is an integer value between 1 and 10. 10 . The sealant removal composition of claim 8 wherein said polyether is present and has the structure (IV): R[—(O—R 1 —O—R 2 —] n (V) where R is C 1 -C 12 linear alkyl; R 1 in each occurrence is independently C 1 -C 12 linear alkyl, C 1 -C 12 branched alkyl, C 5 -C 12 cyclic alkyl; R 2 in each occurrence is independently C 1 -C 12 linear alkyl, C 1 -C 12 branched alkyl, C 5 -C 12 cyclic alkyl; and n is an integer value between 1 and 50. 11 . The sealant removal composition of claim 8 wherein said polyether is present and comprises: tetraoxaundecane, 1,3-dioxacyclopentane, 5-hydroxy-1,3-dioxane, 4-hydroxymethyl-1,3-dioxolane, tetrahydrofurfuryl alcohol, and mixtures of any of the aforementioned. 12 . The sealant removal composition of claim 8 wherein said acetal is present and comprises: diethoxymethane, dimethoxymethane, 1,3-dioxolane and mixtures of any of the aforementioned. 13 . The sealant removal composition of claim 8 wherein said polyether is present and has the general formula (VI): where R is hydrogen, C 1 -C 12 linear alkyl, C 1 -C 12 branched alkyl, C 5 -C 12 cyclic alkyl, or C 1 -C 12 linear alkoxy. 14 . The sealant removal composition of claim 8 wherein said amide is present and comprises: N,N-dimethyl formamide, acetamide, N,N-dimethyl acetamide, N,N-dimethyloctanamide, N,N-dimethyldecanamide, and mixtures of any of the aforementioned. 15 . The sealant removal composition of claim 1 wherein the composition is exclusive of at least one of solvent of d-limonene; acetone, methyl ethyl ketone, methyl isobutyl ketone, mesityl oxide, isophorone; and petroleum distillates or all of the solvents. 16 . The sealant removal composition of claim 1 having a flash point of above >70° C. at 760 torr. 17 . A process of removing a sealant from a substrate comprising: applying the composition of claim 1 to the sealant; and allowing dwell time for sealant to swell on the substrate. 18 . The process of claim 17 further comprising applying mechanical force to the sealant while the sealant is in contact with the composition. 19 . The process of claim 17 wherein the sealant is a silicone or sulfur-containing polymers. 20 . The process of claim 17 wherein the substrate is one of glass, metal, or concrete.
Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers · CPC title
process for debonding adherents · CPC title
Presence of polysiloxane · CPC title
Presence of sulfur containing polymers · CPC title
in the substrate · CPC title
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