Inductor structure and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-2024161957-A1
Application number	US-202318498128-A
Country	US
Kind code	A1
Filing date	Oct 31, 2023
Priority date	Nov 16, 2022
Publication date	May 16, 2024
Grant date	—

Abstract

Provided is an inductor structure and manufacturing method thereof, including forming an inductance coil in a semiconductor packaging carrier plate and disposing a patterned magnetic conductive layer in the inductance coil. Therefore, a patterned build-up wiring method is used to form a magnetic material in the carrier plate, thereby improving electrical characteristics of the inductor.

First claim

What is claimed is:

1 . An inductor structure, comprising:
a carrier plate having a first side and a second side opposing the first side and a plurality of insulating layers; at least one inductance coil embedded in the carrier plate and comprising a plurality of columnar inductance layers and a plurality of inductance wirings; a conductive wiring structure embedded in the carrier plate, partially electrically connected to the inductance coil and comprising a plurality of first electrode pads provided on the first side and with one surface of each of the plurality of first electrode pads exposed on the first side and a plurality of second electrode pads provided on the second side and with one surface of each of the plurality of second electrode pads exposed on the second side; and a magnetic conductor embedded in a coil of the inductance coil in the carrier plate, wherein the magnetic conductor comprises a magnetic material and at least one patterned magnetic conductive layer.

2 . The inductor structure of claim 1 , wherein the patterned magnetic conductive layer extends to an outside of the inductance coil and has a plurality of openings corresponding to the plurality of columnar inductance layers of the inductance coil, and the plurality of columnar inductance layers pass through the corresponding openings respectively.

3 . The inductor structure of claim 1 , wherein the patterned magnetic conductive layer is divided vertically and arranged at column-like intervals into a plurality of convex strip structures, divided horizontally and arranged at row-like intervals into a plurality of gear strip structures or grid-divided and arranged at matrix intervals into a plurality of bump structures.

4 . The inductor structure of claim 1 , wherein the at least one patterned magnetic conductive layer is a plurality of patterned magnetic conductive layers stacked at intervals in a layered manner.

5 . The inductor structure of claim 4 , wherein the patterned magnetic conductive layer is divided vertically and arranged at column-like intervals into a plurality of convex strip structures, divided horizontally and arranged at row-like intervals into a plurality of gear strip structures or grid-divided and arranged at matrix intervals into a plurality of bump structures.

6 . The inductor structure of claim 1 , wherein the magnetic material comprises at least one of iron, nickel, cobalt, manganese, zinc, molybdenum or an alloy material of a combination thereof, and the alloy material is nickel/iron alloy, nickel/cobalt alloy, nickel/iron/cobalt alloy or zinc/nickel alloy.

7 . The inductor structure of claim 1 , wherein the magnetic conductor is in a flat plate shape, a gear shape, a fin shape or a combination thereof.

8 . The inductor structure of claim 1 , wherein shapes of the plurality of columnar inductance layers of the inductance coil are cylinders, rectangles or triangles.

9 . The inductor structure of claim 1 , wherein the inductance coil is a spiral coil, a solenoid coil or a toroid coil.

10 . The inductor structure of claim 1 , wherein the inductor structure is a single discrete element or a discrete element formed by a plurality of inductance integrals.

11 . The inductor structure of claim 1 , wherein the inductor structure is a part of a packaging carrier plate structure with an embedded inductor.

12 . The inductor structure of claim 1 , wherein the plurality of first electrode pads are electrically connected to at least one active chip and/or a capacitive element.

13 . A method of manufacturing an inductor structure, the method comprising:
providing a carrier board having a metal surface; forming a plurality of insulating layers and a first conductive wiring structure on the carrier board in a patterned build-up manner, wherein the first conductive wiring structure comprises a plurality of first electrode pads; forming a first inductance layer and a columnar inductance layer of an inductance coil on the first conductive wiring structure and one of the insulating layers using a build-up wiring manufacturing method, and covering the first inductance layer and the columnar inductance layer by another insulating layer; forming a magnetic conductor and another columnar inductance layer of the inductance coil on the another insulating layer, wherein the magnetic conductor comprises a magnetic material and at least one patterned magnetic conductive layer; covering the magnetic conductor and the another columnar inductance layer by other insulating layers; forming a second inductance layer of the inductance coil on the other insulating layers by a build-up wiring manufacturing method, and surrounding the magnetic conductor by the inductance coil; forming a second conductive wiring structure on the other insulating layers and the second inductance layer in a patterned build-up manner, wherein the second conductive wiring structure comprises a plurality of second electrode pads; and removing the carrier board to expose one surface of each of the plurality of first electrode pads of the first conductive wiring structure.

14 . The method of claim 13 , wherein the patterned magnetic conductive layer is divided vertically and arranged at column-like intervals into a plurality of convex strip structures, divided horizontally and arranged at row-like intervals into a plurality of gear strip structures or grid-divided and arranged at matrix intervals into a plurality of bump structures.

15 . The method of claim 13 , further comprising repeating processes of the magnetic conductor, the columnar inductance layer and the other insulating layers at least once before forming the second inductance layer to form a plurality of patterned magnetic conductive layers stacked at layered intervals.

16 . The method of claim 15 , wherein the patterned magnetic conductive layer is divided vertically and arranged at column-like intervals into a plurality of convex strip structures, divided horizontally and arranged at row-like intervals into a plurality of gear strip structures or grid-divided and arranged at matrix intervals into a plurality of bump structures.

17 . The method of claim 13 , wherein the columnar inductance layer of the inductance coil is formed by electroplating in any shape.

18 . The method of claim 13 , wherein the magnetic material comprises at least one of iron, nickel, cobalt, manganese, zinc, molybdenum or an alloy material of a combination thereof, and the alloy material is nickel/iron alloy, nickel/cobalt alloy, nickel/iron/cobalt alloy or zinc/nickel alloy.

19 . The method of claim 13 , wherein the inductor structure is completed while preparing a packaging carrier plate.

20 . The method of claim 13 , further comprising after removing the carrier board, electrically combining and packaging at least one active chip and/or a passive element on the plurality of first electrode pads, and correspondingly combining a plurality of conductive elements on the plurality of second electrode pads.

Assignees

• Phoenix Pioneer Technology Co Ltd

Inventors

• Chou Pao-Hung
• Hsu Shih-Ping
• Hu Chu-Chin

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/20

  Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps · CPC title

• H10D1/20

  Inductors · CPC title

• H01F2027/348

  Preventing eddy currents · CPC title

• H01F2027/2809

  on stacked layers · CPC title