Diamond-containing adhesive for joining reaction-bonded silicon-carbide parts

Patent metadata

Field	Value
Publication number	US-2024141212-A1
Application number	US-202218051756-A
Country	US
Kind code	A1
Filing date	Nov 1, 2022
Priority date	Nov 1, 2022
Publication date	May 2, 2024
Grant date	—

Abstract

An epoxy-based glue includes an epoxy material, and a solids component including diamond powder and silicon-carbide particles. The adhesive material may be used to form reaction-bonded silicon-carbide bonding reaction-bonded silicon-carbide parts together. The present disclosure also relates to a method of assembling a product from preforms, including locating an adhesive layer, containing diamond powder, between opposed preform surfaces, carbonizing the layer, and infiltrating molten silicon into the preforms and the carbonized layer to convert the preforms into corresponding reaction-bonded silicon-carbide parts, and to convert the carbonized layer into a reaction-bonded silicon-carbide bonding region with a reduced amount of residual silicon. An assembled product, including at least two reaction-bonded silicon-carbide parts bonded together by processing a diamond-containing adhesive, is also disclosed.

First claim

1 . An epoxy-based glue, comprising:
a liquid component including an epoxy material; a solids component including diamond powder and silicon-carbide particles.

2 . The glue of claim 1 , wherein the epoxy material includes epoxy resin and epoxy hardener.

3 . The glue of claim 1 , wherein the diamond powder is not less than about 1% by weight of the solids component and not more than about 10% by weight of the solids component.

4 . The glue of claim 1 , wherein the diamond powder consists of diamond particles, and wherein sizes of the diamond particles are in a range of from about 1 μm to about 5 μm.

5 . The glue of claim 1 , wherein the solids component contains more of the silicon-carbide particles than the diamond powder.

6 . A method of assembling a product from at least two preforms, the method comprising:
locating an adhesive layer between opposed surfaces of the preforms, the adhesive layer including an epoxy material and diamond powder; subsequently, carbonizing the adhesive layer to produce a carbonized layer; subsequently, infiltrating molten silicon into the preforms and the carbonized layer to convert the preforms into corresponding parts including reaction-bonded silicon-carbide, and to convert the carbonized layer into a joint region bonding the parts together and including reaction-bonded silicon-carbide.

7 . The method of claim 6 , wherein the adhesive layer includes silicon-carbide particles.

8 . The method of claim 6 , wherein the carbonizing of the adhesive layer includes raising the temperature of the adhesive layer to a temperature in the range of from about 560° C. to about 840° C.

9 . The method of claim 6 , wherein the carbonizing of the adhesive layer includes using an inert gas to displace an atmosphere surrounding the adhesive layer.

10 . The method of claim 6 , wherein the infiltration occurs in a vacuum or inert atmosphere.

11 . The method of claim 6 , wherein the molten silicon expands as it solidifies in the parts and the joint region.

12 . An assembled product made by a method including:
locating an adhesive layer between opposed surfaces of preforms, the adhesive layer including an epoxy material and diamond powder; subsequently, carbonizing the adhesive layer to produce a carbonized layer; and subsequently, infiltrating molten silicon into the preforms and the carbonized layer to convert the preforms into corresponding parts including reaction-bonded silicon-carbide, and to convert the carbonized layer into a joint region bonding the parts together and including reaction-bonded silicon-carbide.

13 . The product of claim 12 , wherein the epoxy material includes epoxy resin and epoxy hardener.

14 . The product of claim 12 , wherein the adhesive layer has a solids component, and wherein the diamond powder is not less than about 1% by weight of the solids component and not more than about 10% by weight of the solids component.

15 . The product of claim 12 , wherein the diamond powder consists of diamond particles, and wherein sizes of the diamond particles are in a range of from about 1 μm to about 5 μm.

16 . The product of claim 12 , wherein the solids component contains more of the silicon-carbide particles than the diamond powder.

Assignees

• Ii Vi Delaware Inc

Inventors

• Salamone Sam
• Mcanany Sean
• Evans Glenn

Classifications

• C04B2235/5436

  micrometer sized, i.e. from 1 to 100 micron · CPC title

• C04B2235/427

  Diamond · CPC title

• C04B2235/48

  Organic compounds becoming part of a ceramic after heat treatment, e.g. carbonising phenol resins · CPC title

• C04B2235/428

  Silicon · CPC title

• C04B2235/3826

  Silicon carbides · CPC title