Composite component

Patent metadata

Field	Value
Publication number	US-2024136268-A1
Application number	US-202318399324-A
Country	US
Kind code	A1
Filing date	Dec 28, 2023
Priority date	Feb 9, 2022
Publication date	Apr 25, 2024
Grant date	—

Abstract

A composite component includes an Si base layer that has first and second main surfaces that are opposite to each other, a rerouting layer on the first main surface, a through-silicon via that is electrically connected to the rerouting layer, and that extends through the Si base layer, and an electronic component layer on the second main surface of the Si base layer, and that includes electronic components each including an electronic component body and a component electrode on the electronic component body. The component electrode is connected to the through-silicon via. One or more of the electronic components have a curved shape that is curved to protrude in a mount direction in a cross-sectional view. A mount surface of the composite component corresponds to the curved shape in a cross-sectional view, and includes one or more first curved surfaces that are curved to protrude in the mount direction.

First claim

What is claimed is:

1 . A composite component, comprising:
an Si base layer that has a first main surface and a second main surface that are opposite to each other, a rerouting layer that is on the first main surface, a through-silicon via that is electrically connected to the rerouting layer, and that extends through the Si base layer, and an electronic component layer that is on the second main surface of the Si base layer, and that includes a plurality of electronic components each including an electronic component body and a component electrode on the electronic component body, wherein the component electrode is connected to the through-silicon via, and one or more of the plurality of electronic components have a curved shape that is curved to protrude in a mount direction in a cross-sectional view, and a mount surface of the composite component corresponds to the curved shape in a cross-sectional view, and includes one or more first curved surfaces that are curved to protrude in the mount direction.

2 . The composite component according to claim 1 , comprising:
an interposer structure including the Si base layer, the rerouting layer, the through-silicon via, and an interposer electrode that faces the second main surface, wherein the electronic component layer is between the interposer electrode and the Si base layer.

3 . The composite component according to claim 1 , wherein
the plurality of electronic components are bonded to the second main surface of the Si base layer with an adhesive layer, in a cross-sectional view, a region of the adhesive layer located between the one or more electronic components and the second main surface of the Si base layer has a smaller thickness at a center portion than at an end portion.

4 . The composite component according to claim 3 , wherein
in a cross-sectional view, the center portion has a thickness smaller than or equal to 10 μm.

5 . The composite component according to claim 1 , wherein
the one or more electronic components further include a resin layer between the component electrodes.

6 . The composite component according to claim 5 , wherein
a coefficient of linear expansion of the resin layer is greater than a coefficient of linear expansion of the electronic component body.

7 . The composite component according to claim 5 , wherein
the resin layer includes resin, and the electronic component body includes ceramic or a semiconducting material.

8 . The composite component according to claim 1 , wherein
the Si base layer has a thickness smaller than a thickness of the plurality of electronic components.

9 . The composite component according to claim 1 , wherein
the electronic component layer further includes a resin seal portion that seals the plurality of electronic components, and an entirety of the composite component is curved to protrude in the mount direction.

10 . The composite component according to claim 1 , wherein
the mount surface of the composite component includes the first curved surfaces in a cross-sectional view.

11 . The composite component according to claim 10 , wherein
in a cross-sectional view, at least two of the first curved surfaces are adjacent to each other with a bend interposed therebetween.

12 . The composite component according to claim 1 , wherein
the one or more first curved surfaces in the mount surface of the composite component make up equal to or more than 70% of a total area of the mount surface in a plan view.

13 . The composite component according to claim 1 , wherein
the plurality of electronic components are in the electronic component layer while the component electrodes are electrically connected to the rerouting layer with the through-silicon via linearly extending in a cross-sectional view interposed therebetween.

14 . The composite component according to claim 2 , wherein
the plurality of electronic components are bonded to the second main surface of the Si base layer with an adhesive layer, in a cross-sectional view, a region of the adhesive layer located between the one or more electronic components and the second main surface of the Si base layer has a smaller thickness at a center portion than at an end portion.

15 . The composite component according to claim 2 , wherein
the one or more electronic components further include a resin layer between the component electrodes.

16 . The composite component according to claim 6 , wherein
the resin layer includes resin, and the electronic component body includes ceramic or a semiconducting material.

17 . The composite component according to claim 2 , wherein
the Si base layer has a thickness smaller than a thickness of the plurality of electronic components.

18 . The composite component according to claim 2 , wherein
the electronic component layer further includes a resin seal portion that seals the plurality of electronic components, and an entirety of the composite component is curved to protrude in the mount direction.

19 . The composite component according to claim 2 , wherein
the mount surface of the composite component includes the first curved surfaces in a cross-sectional view.

20 . The composite component according to claim 2 , wherein
the one or more first curved surfaces in the mount surface of the composite component make up equal to or more than 70% of a total area of the mount surface in a plan view.

Assignees

• Murata Manufacturing Co

Inventors

• Satake Yoshiaki
• Funaki Tatsuya
• Arai Kei

Classifications

• H10W90/00

  Package configurations · CPC title

• H10W72/073

  of die-attach connectors · CPC title

• H10W72/30

  Die-attach connectors · CPC title

• H10W72/012

  of bump connectors, dummy bumps or thermal bumps · CPC title

• H10W72/20

  Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps · CPC title