Metal dual interface card

Patent metadata

Field	Value
Publication number	US-2024119249-A1
Application number	US-202318535299-A
Country	US
Kind code	A1
Filing date	Dec 11, 2023
Priority date	Jan 11, 2017
Publication date	Apr 11, 2024
Grant date	—

Abstract

A dual interface transaction card includes a metal card body having first and second surfaces. A contact-only transaction module is secured in the card body, the contact-only transaction module including contact pads disposed on the first surface of the card body and including a first transaction circuit. A contactless transaction module is secured in a void in the metal card body. The contactless transaction module includes a second transaction circuit and an antenna. Also disclosed is a process for manufacturing the dual interface transaction card. The process includes the steps of constructing a metal card body having the first and second surfaces, securing the contact-only transaction module in the metal card body, forming the void in the metal card body, and securing the contactless transaction module in the void.

First claim

What is claimed:

1 . A transaction card comprising:
a metal card body having first and second surfaces; a first module secured in the card body and comprising a first circuit; a second module secured in a void in the metal card body, the second module comprising a second circuit and an antenna, wherein (i) the first circuit and the second circuit are not physically electrically connected to one another and (ii) the first circuit and the second transaction circuit are not connected to any shared circuit component, and (iii) at least one of the first module and the second module comprises a transaction module; wherein the void comprises a blind pocket open to the second surface of the card body; and wherein the second module comprises an outer layer disposed flush with the second surface of the card body and the second module further comprises a layer containing the second circuit and the antenna, an RF shielding layer, and an adhesive layer.

2 . The transaction card of claim 1 , wherein the first module and the second module both comprise transaction modules.

3 . The transaction card of claim 1 , wherein the first module comprises a contact-only transaction module and the second module comprises a contactless transaction module.

4 . The transaction card of claim 1 , wherein the second transaction module is adhesively bonded to a bottom of the pocket.

5 . The transaction card of claim 4 , wherein the second transaction module is adhesively bonded to a bottom of the pocket by the adhesive layer of the second transaction module.

6 . The transaction card of claim 1 , wherein the first circuit and the second circuit are independently personalized.

7 . The transaction card of claim 1 , wherein the second module comprises a multi-layer plug or disc that has a first outer layer aligned with the first surface of the card body and a second outer layer aligned with the second surface of the card body.

8 . The transaction card of claim 7 , wherein the layer containing the second circuit and the antenna is located between the first and second outer layers.

9 . The transaction card of claim 8 , wherein the second module comprises an annular RF shielding component disposed at or near an outer periphery of the plug or disc for at least a portion of a dimension from the first surface of the card to the second surface of the card.

10 . A process for manufacturing a transaction card, the process comprising the steps of:
(a) constructing a metal card body having first and second surfaces; (b) securing a first module in the card body, the first module comprising a first circuit; (c) forming a void comprising a blind pocket open to the second surface of the card body; (d) securing a second module in the void, the second module comprising a second circuit and an antenna, wherein (i) the first circuit and the second circuit are not physically electrically connected to one another and (ii) the first circuit and the second transaction circuit are not connected to any shared circuit component, and (iii) at least one of the first module and the second module comprises a transaction module; and wherein the second module comprises an outer layer disposed flush with the second surface of the card body and the second module further comprises a layer containing the second circuit and the antenna, an RF shielding layer, and an adhesive layer.

11 . The process of claim 10 , wherein the step of securing the second module in the void comprises adhesively bonding the contactless transaction portion to a bottom of the pocket with the outer layer of the contactless transaction portion disposed flush with the second surface of the card body.

12 . The process of claim 11 , wherein the step of securing the first module in the card body is performed after bonding the contactless transaction portion to the bottom of the pocket.

13 . The process of claim 10 , further comprising (e) personalizing the first circuit independently from personalizing the second circuit.

Assignees

• Composecure Llc

Inventors

• Lowe Adam

Classifications

• G06K19/0723 Primary

  the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs · CPC title

• G06K19/07773

  Antenna details (antennas for wireless devices, e.g. RFID tags, in general H01Q1/22) · CPC title

• G06K19/07769 Primary

  the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface · CPC title

• G06K19/02

  characterised by the selection of materials, e.g. to avoid wear during transport through the machine · CPC title

• G06K19/07722

  the record carrier being multilayered, e.g. laminated sheets (flat articles in general, see B32B37/00) · CPC title