Metal dual interface card

Patent metadata

Field	Value
Publication number	US-11842240-B2
Application number	US-202117502790-A
Country	US
Kind code	B2
Filing date	Oct 15, 2021
Priority date	Jan 11, 2017
Publication date	Dec 12, 2023
Grant date	Dec 12, 2023

Abstract

A dual interface transaction card includes a metal card body having first and second surfaces. A contact-only transaction module is secured in the card body, the contact-only transaction module including contact pads disposed on the first surface of the card body and including a first transaction circuit. A contactless transaction module is secured in a void in the metal card body. The contactless transaction module includes a second transaction circuit and an antenna. Also disclosed is a process for manufacturing the dual interface transaction card. The process includes the steps of constructing a metal card body having the first and second surfaces, securing the contact-only transaction module in the metal card body, forming the void in the metal card body, and securing the contactless transaction module in the void.

First claim

What is claimed:

1. A dual interface transaction card, the card comprising:
a metal card body having first and second surfaces;
a contact-only transaction module secured in the card body, the contact-only transaction module comprising contact pads disposed on the first surface of the card body and comprising a first transaction circuit;
a contactless transaction module secured in a void in the metal card body, the contactless transaction module comprising a second transaction circuit and an antenna, wherein (i) the first transaction circuit and the second transaction circuit are not physically electrically connected to one another and (ii) the first transaction circuit and the second transaction circuit are not connected to any shared circuit component;
wherein the void comprises a blind pocket open to the second surface of the card body; and wherein the contactless transaction module comprises an outer layer disposed flush with the second surface of the card body and the contactless transaction module further comprises a layer containing the second transaction circuit and the antenna, an RF shielding layer, and an adhesive layer.

2. The dual interface transaction card of claim 1 , wherein the first transaction circuit and the second transaction circuit are independently personalized.

3. The dual interface transaction card of claim 1 , wherein the contactless transaction module is adhesively bonded to a bottom of the pocket.

4. A dual interface transaction card, the card comprising:
a metal card body having first and second surfaces;
a contact-only transaction module secured in the card body, the contact-only transaction module comprising contact pads disposed on the first surface of the card body and comprising a first transaction circuit;
a contactless transaction module secured in a void in the metal card body, the contactless transaction module comprising a second transaction circuit and an antenna, wherein (i) the first transaction circuit and the second transaction circuit are not physically electrically connected to one another and (ii) the first transaction circuit and the second transaction circuit are not connected to any shared circuit component;
wherein the void comprises a blind pocket open to the second surface of the card body;
wherein the contactless transaction module comprises an outer layer disposed flush with the second surface of the card body; and
wherein the contactless transaction module further comprises a filler layer.

5. The dual interface transaction card of claim 4 , wherein the contactless transaction portion is adhesively bonded to a bottom of the pocket.

6. The dual interface transaction card of claim 4 , wherein the contactless transaction portion further comprises a layer containing an antenna, an RF shielding layer, and an adhesive layer.

7. A dual interface transaction card, the card comprising:
a metal card body having first and second surfaces;
a hole in the card body open to the first surface;
a void comprising a pocket in the card body open to the second surface, the void sharing a common boundary with the hole;
a contact-only transaction module secured in the card body, the contact-only transaction module comprising contact pads aligned with the first surface of the card body and comprising a first transaction circuit;
a contactless transaction module secured in the void in the metal card body, the contactless transaction module comprising a second transaction circuit and an antenna, wherein (i) the first transaction circuit and the second transaction circuit are not physically electrically connected to one another and (ii) the first transaction circuit and the second transaction circuit are not connected to any shared circuit component;
wherein the contactless transaction module comprises a multi-layer plug or disc that has a first outer layer aligned with the first surface of the card body and a second outer layer aligned with the second surface of the card body;
wherein the contactless transaction module further comprises an antenna layer is located between the first and second outer layers, the antenna layer comprising the second transaction circuit and the antenna; and
wherein the contactless transaction module does not include an RF shielding layer.

8. The dual interface transaction card of claim 7 , wherein the contactless transaction module further comprises at least one filler layer located between the first and second outer layers.

9. A dual interface transaction card, the card comprising:
a metal card body having first and second surfaces;
a hole in the card body open to the first surface;
a void comprising a pocket in the card body open to the second surface, the void sharing a common boundary with the hole;
a contact-only transaction module secured in the card body, the contact-only transaction module comprising contact pads aligned with the first surface of the card body and comprising a first transaction circuit;
a contactless transaction module secured in the void in the metal card body, the contactless transaction module comprising a second transaction circuit and an antenna, wherein (i) the first transaction circuit and the second transaction circuit are not physically electrically connected to one another and (ii) the first transaction circuit and the second transaction circuit are not connected to any shared circuit component;
wherein the contactless transaction module comprises a multi-layer plug or disc that has a first outer layer aligned with the first surface of the card body and a second outer layer aligned with the second surface of the card body;
wherein the contactless transaction module further comprises an antenna layer is located between the first and second outer layers, the antenna layer comprising the second transaction circuit and the antenna; and
wherein the contactless transaction module comprises an annular RF shielding component disposed at or near an outer periphery of the plug or disc for at least a portion of a dimension from the first surface of the card to the second surface of the card.

10. A process for manufacturing a dual interface transaction card, the process comprising the steps of:
(a) constructing a metal card body having first and second surfaces;
(b) securing a contact-only transaction module in the metal card body, the contact-only transaction module having contact pads disposed on the first surface of the card body and comprising a first transaction circuit;
(c) forming a void in the metal card body, the void comprising a blind pocket open to the second surface of the card body and having a bottom adjacent the first surface of the card body; and
(d) securing a contactless transaction module in the void, the contactless transaction module comprising a second transaction circuit and an antenna, wherein (i) the first transaction circuit and the second transaction circuit are not physically electrically connected to one another and (ii) the first transaction circuit and the second transaction circuit are not connected to any shared circuit component, and wherein the contactless transaction module comprises a filler layer and an outer layer disposed flush with the second surface of the card body.

11. The process of claim 10 , further comprising the step of:
(e) personalizing the first transaction circuit independently from personalizing the second transaction circuit.

12. The process of claim 10 , wherein step (a) comprises constructing a metal card body have a two-piece construction, including a first piece embodying the first surface and a second piece embodying the second surface, and step (b) comprises providing a pocket or hole in the first piece t

Assignees

• Composecure Llc

Inventors

• Lowe Adam

Classifications

• G06K19/0723 Primary

  the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs · CPC title

• G06K19/07773

  Antenna details (antennas for wireless devices, e.g. RFID tags, in general H01Q1/22) · CPC title

• G06K19/07769 Primary

  the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface · CPC title

• G06K19/02

  characterised by the selection of materials, e.g. to avoid wear during transport through the machine · CPC title

• G06K19/07722

  the record carrier being multilayered, e.g. laminated sheets (flat articles in general, see B32B37/00) · CPC title