Transformer module and power module
US-2024363282-A1 · Oct 31, 2024 · US
Signal transmission device
US2024096542A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2024096542-A1 |
| Application number | US-202318181929-A |
| Country | US |
| Kind code | A1 |
| Filing date | Mar 10, 2023 |
| Priority date | Sep 21, 2022 |
| Publication date | Mar 21, 2024 |
| Grant date | — |
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- Title
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- Abstract
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- First independent claim
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Abstract
Official abstract text for this publication.
A signal transmission device according to the embodiment includes: a first integrated circuit chip provided with a first coil that constitutes the isolation transformer; a printed circuit board provided with a second coil that is magnetically coupled with the first coil to form the insulating transformer; a second integrated circuit chip having a first connection terminal and a second connection terminal provided on the upper surface; a first wire that electrically connects between one end of the second coil and the first connection terminal; and a second wire that electrically connects between the other end of the second coil and the second connection terminal, wherein the second coil is provided only in the wiring layer of the printed circuit board, which has a single wiring layer structure.
First claim
Opening claim text (preview).
1 . A signal transmission device provided with an isolation transformer, comprising: a first integrated circuit chip provided with a first coil that constitutes the isolation transformer; a printed circuit board provided with a second coil that is magnetically coupled with the first coil to form the insulating transformer; a second integrated circuit chip having a first connection terminal and a second connection terminal provided on the upper surface; a first wire that electrically connects between one end of the second coil and the first connection terminal; and a second wire that electrically connects between the other end of the second coil and the second connection terminal, wherein the printed circuit board has only one wiring layer, and wherein the second coil is provided only in the wiring layer of the printed circuit board, which has a single wiring layer structure. 2 . The signal transmission device according to claim 1 , wherein the second coil includes a winding wound in the lateral direction in the wiring layer located on the upper surface of the printed circuit board and extending in the lateral direction. 3 . The signal transmission device according to claim 1 , wherein the first integrated circuit chip includes: a signal wiring provided in a lower wiring layer different from the upper wiring layer provided with the first coil and electrically connecting the integrated circuit provided in the first integrated circuit chip and the first coil, and a via-hole wiring provided between the first coil and the signal wiring and electrically connecting the first coil and the signal wiring. 4 . The signal transmission device according to claim 2 , wherein the first integrated circuit chip includes: a signal wiring provided in a lower wiring layer different from the upper wiring layer provided with the first coil and electrically connecting the integrated circuit provided in the first integrated circuit chip and the first coil, and a via-hole wiring provided between the first coil and the signal wiring and electrically connecting the first coil and the signal wiring. 5 . The signal transmission device according to claim 1 , wherein the signal transmission device further comprises an adhesion layer positioned between the top surface of the first integrated circuit chip and the bottom surface of the printed circuit board and adhering the first integrated circuit chip and the printed circuit board. 6 . The signal transmission device according to claim 2 , wherein the signal transmission device further comprises an adhesion layer positioned between the top surface of the first integrated circuit chip and the bottom surface of the printed circuit board and adhering the first integrated circuit chip and the printed circuit board. 7 . The signal transmission device according to claim 1 , wherein the printed circuit board is fixed above the first integrated circuit so that the second coil is arranged above the first coil. 8 . The signal transmission device according to claim 2 , wherein the printed circuit board is fixed above the first integrated circuit so that the second coil is arranged above the first coil. 9 . The signal transmission device according to claim 1 , wherein the printed circuit board has an insulating film substrate, and wherein the second coil is provided on the upper surface of the film substrate. 10 . The signal transmission device according to claim 2 , wherein the printed circuit board has an insulating film substrate, and wherein the second coil is provided on the upper surface of the film substrate.
Assignees
Inventors
Classifications
Mounted components directly electrically connected to each other, i.e. not via the PCB · CPC title
Adjacent components · CPC title
Metal wires as connectors or conductors · CPC title
associated with surface mounted components · CPC title
- H01F27/2804Primary
Printed windings · CPC title
Patent family
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Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US2024096542A1 cover?
- A signal transmission device according to the embodiment includes: a first integrated circuit chip provided with a first coil that constitutes the isolation transformer; a printed circuit board provided with a second coil that is magnetically coupled with the first coil to form the insulating transformer; a second integrated circuit chip having a first connection terminal and a second connectio…
- Who is the assignee on this patent?
- Toshiba Kk, Toshiba Electronic Devices & Storage Corp
- What technology area does this patent fall under?
- Primary CPC classification H01F27/2804. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Thu Mar 21 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).