Processing system, pad transporting apparatus, liquid-receiving apparatus, and polishing apparatus

Patent metadata

Field	Value
Publication number	US-2024082982-A1
Application number	US-202318311421-A
Country	US
Kind code	A1
Filing date	May 3, 2023
Priority date	May 13, 2022
Publication date	Mar 14, 2024
Grant date	—

Abstract

An improved apparatus for use in replacing a polishing pad is disclosed. processing system includes: a polishing device configured to polish a workpiece; a pad break-in device configured to perform a pad break-in process of a polishing pad; and a pad transporting device configured to transport a pad structure from the pad break-in device to the polishing device. The pad structure includes at least the polishing pad. The pad transporting device includes a liquid receiving tray arranged under the holding hand and configured to receive liquid dropped from the pad structure.

First claim

What is claimed is:

1 . A processing system comprising:
a polishing device configured to polish a workpiece; a pad break-in device configured to perform a pad break-in process of a polishing pad; and a pad transporting device configured to transport a pad structure, the pad structure including at least the polishing pad, the polishing device includes a polishing table, a pad chuck configured to fix the pad structure, transported by the pad transporting device, to the polishing table, and a polishing head configured to press the workpiece against the polishing pad, the pad transporting device includes a holding hand configured to hold the pad structure, and a liquid receiving tray arranged under the holding hand and configured to receive liquid dropped from the pad structure.

2 . The processing system according to claim 1 , wherein the pad transporting device further includes a tilting device configured to tilt the liquid receiving tray and the holding hand.

3 . The processing system according to claim 1 , wherein the pad transporting device further includes a hand elevating device configured to vertically move the holding hand.

4 . The processing system according to claim 1 , wherein the pad transporting device further includes a drain line coupled to the liquid receiving tray.

5 . The processing system according to claim 1 , wherein the pad structure includes the polishing pad and a support plate supporting the polishing pad.

6 . The processing system according to claim 1 , wherein the polishing device includes a lifting mechanism configured to receive the pad structure from the pad transporting device and to place the pad structure on the polishing table.

7 . The processing system according to claim 1 , wherein the pad break-in device includes a processing table configured to hold the pad structure, a processing head configured to press a dummy workpiece against the polishing pad of the pad structure on the processing table; and a liquid supply nozzle configured to supply liquid onto the polishing pad of the pad structure on the processing table.

8 . The processing system according to claim 7 , wherein the pad break-in device further includes a pad monitoring device configured to monitor the break-in process of the polishing pad.

9 . A pad transporting apparatus for transporting a pad structure including at least a polishing pad, comprising:
a holding hand configured to hold the pad structure; and a liquid receiving tray arranged under the holding hand and configured to receive liquid dropped from the pad structure.

10 . The pad transporting apparatus according to claim 9 , further comprising a tilting device configured to tilt the liquid receiving tray and the holding hand.

11 . The pad transporting apparatus according to claim 9 , further comprising a hand elevating device configured to vertically move the holding hand.

12 . The pad transporting apparatus according to claim 9 , further comprising a drain line coupled to the liquid receiving tray.

13 . The pad transporting apparatus according to claim 9 , wherein the pad structure includes the polishing pad and a support plate supporting the polishing pad.

14 . A liquid receiving apparatus comprising:
a support plate configured to support a polishing pad; and a liquid receiving tray detachably attached to a side surface of the support plate.

15 . The liquid receiving apparatus according to claim 14 , wherein the liquid receiving tray has a plurality of segments.

16 . A polishing apparatus for polishing a workpiece, comprising:
a support plate configured to support a polishing pad; a liquid receiving tray detachably attached to a side surface of the support plate; a polishing table configured to hold the support plate; and a polishing head configured to press the workpiece against the polishing pad.

17 . The processing system according to claim 1 , wherein the pad transporting device is configured to transport a pad structure from the pad break-in device to the polishing device.

Assignees

• Ebara Corp

Inventors

• Miyakawa Toshiki
• Saito Kenichiro
• Fukushima Makoto

Classifications

• B24B37/20 Primary

  Lapping pads for working plane surfaces · CPC title

• B24B37/005

  Control means for lapping machines or devices · CPC title

• B24B37/345

  Feeding, loading or unloading work specially adapted to lapping · CPC title