Thermally and electrically conductive adhesive composition
US-2017210951-A1 · Jul 27, 2017 · US
Electrically conductive adhesive, sintered body of electrically conductive adhesive, method for producing sintered body, electronic component, and method for producing electronic component
US2024052213A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2024052213-A1 |
| Application number | US-202218546658-A |
| Country | US |
| Kind code | A1 |
| Filing date | Feb 14, 2022 |
| Priority date | Feb 18, 2021 |
| Publication date | Feb 15, 2024 |
| Grant date | — |
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Abstract
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Provided is a novel electrically conductive adhesive which can yield a sintered body having low resistivity despite containing a thermosetting resin in addition to silver particles. This electrically conductive adhesive contains silver particles and a thermosetting resin. The silver particles are provided with a protective layer that contains a compound represented by general formula (1).[In general formula (1), R1 is an alkyl group having 1-5 carbon atoms, and R2 is a hydrogen atom or an alkyl group having 1-5 carbon atoms.]
First claim
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1 . An electrically conductive adhesive comprising: a silver particle; and a thermosetting resin, wherein the silver particle has a protective layer containing a compound represented by the following general formula (1): wherein R 1 represents an alkyl group having 1 to 5 carbon atoms; and R 2 represents a hydrogen atom or an alkyl group having 1 to 5 carbon atoms. 2 . The electrically conductive adhesive according to claim 1 , wherein the thermosetting resin is an epoxy resin. 3 . The electrically conductive adhesive according to claim 1 , wherein the silver particle is contained in a content ratio of 70 mass % or more. 4 . The electrically conductive adhesive according to claim 1 , further comprising a solvent. 5 . The electrically conductive adhesive according to claim 4 , wherein the solvent has an octanol/water partition coefficient (Log Pow) of −2 or more and 4 or less. 6 . A sintered body of the electrically conductive adhesive according to claim 1 . 7 . An electronic component in which members are bonded with each other by the sintered body according to claim 6 . 8 . A method for manufacturing a sintered body, the method comprising a step of sintering the electrically conductive adhesive according to claim 1 at a temperature of 100° C. or more and 250° C. or less. 9 . A method for manufacturing an electronic component in which members are bonded with each other by a sintered body, the method comprising: a step of disposing the electrically conductive adhesive according to claim 1 between the members; and a step of sintering the electrically conductive adhesive at a temperature of 100° C. or more and 250° C. or less.
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- What does patent US2024052213A1 cover?
- Provided is a novel electrically conductive adhesive which can yield a sintered body having low resistivity despite containing a thermosetting resin in addition to silver particles. This electrically conductive adhesive contains silver particles and a thermosetting resin. The silver particles are provided with a protective layer that contains a compound represented by general formula (1).[In ge…
- Who is the assignee on this patent?
- The School Corporation Kansai Univ, Osaka Soda Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification C09J9/02. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Thu Feb 15 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).