Electrically conductive adhesive, sintered body of electrically conductive adhesive, method for producing sintered body, electronic component, and method for producing electronic component
US-12534651-B2 · Jan 27, 2026 · US
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Patent family 82930543
This patent family groups 2 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 82930543 |
| Family type | — |
| Earliest priority | Feb 18, 2021 |
| First filing country | US |
| Member publications | 2 |
| Countries | US |
| Representative publication | US12534651B2 — Electrically conductive adhesive, sintered body of electrically conductive adhesive, method for producing sintered body, electronic component, and method for producing electronic component |
Representative publication
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US12534651B2 — Electrically conductive adhesive, sintered body of electrically conductive adhesive, method for producing sintered body, electronic component, and method for producing electronic component (published Jan 27, 2026)
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