Transformer module and power module
US-2024363282-A1 · Oct 31, 2024 · US
Electronic component
US2024013970A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2024013970-A1 |
| Application number | US-202318345970-A |
| Country | US |
| Kind code | A1 |
| Filing date | Jun 30, 2023 |
| Priority date | Jul 6, 2022 |
| Publication date | Jan 11, 2024 |
| Grant date | — |
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- Title
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- Abstract
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- Assignees and inventors
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- Key dates
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- First independent claim
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- CPC / IPC classifications
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- Citations and related patents
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Abstract
Official abstract text for this publication.
An electronic component capable of improving connection reliability between a via conductor and a circuit pattern. An electronic component includes a circuit pattern; an insulating resin layer covering the circuit pattern; a via conductor provided inside the insulating resin layer and connected to the circuit pattern; and a wiring member connected to the circuit pattern via the via conductor. The via conductor and the wiring member are integrally formed, and in the via conductor, a diameter of an end portion on a side close to the circuit pattern is larger than a diameter of an end portion on a side close to the wiring member.
First claim
Opening claim text (preview).
What is claimed is: 1 . An electronic component comprising: a circuit pattern; an insulating resin layer covering the circuit pattern; a via conductor inside the insulating resin layer and connected to the circuit pattern; and a wiring member connected to the circuit pattern via the via conductor, wherein the via conductor and the wiring member are integrally configured, and a diameter of an end portion of the via conductor which is close to the circuit pattern is larger than a diameter of another end portion of the via conductor which is close to the wiring member. 2 . The electronic component according to claim 1 , wherein the diameter of the via conductor is largest at the end portion of the via conductor on a side close to the circuit pattern. 3 . The electronic component according to claim 1 , wherein a surface of the circuit pattern, to which the via conductor is connected, has a curvature that is convex toward the via conductor. 4 . The electronic component according to claim 3 , wherein when assuming that the curvature is a curvature of a circumference having a radius r, the curvature is expressed by a value of 1/r and a value of r is in a range from 6000 m to 8000 M. 5 . The electronic component according to claim 2 , wherein a surface of the circuit pattern, to which the via conductor is connected, has a curvature that is convex toward the via conductor. 6 . The electronic component according to claim 5 , wherein when assuming that the curvature is a curvature of a circumference having a radius r, the curvature is expressed by a value of 1/r and a value of r is in a range from 6000 m to 8000 M.
Assignees
Inventors
Classifications
- H01F27/292Primary
Surface mounted devices · CPC title
- H01F17/0013Primary
with stacked layers · CPC title
with magnetic core · CPC title
with encapsulating core, e.g. made of resin and magnetic powder · CPC title
Details of via holes for interconnecting the layers · CPC title
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Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US2024013970A1 cover?
- An electronic component capable of improving connection reliability between a via conductor and a circuit pattern. An electronic component includes a circuit pattern; an insulating resin layer covering the circuit pattern; a via conductor provided inside the insulating resin layer and connected to the circuit pattern; and a wiring member connected to the circuit pattern via the via conductor. T…
- Who is the assignee on this patent?
- Murata Manufacturing Co
- What technology area does this patent fall under?
- Primary CPC classification H01F27/292. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Thu Jan 11 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).