Method for manufacturing dielectric layer, resin composition, and laminate comprising dielectric layer

Patent metadata

Field	Value
Publication number	US-2023420156-A1
Application number	US-202318208068-A
Country	US
Kind code	A1
Filing date	Jun 9, 2023
Priority date	Dec 17, 2020
Publication date	Dec 28, 2023
Grant date	—

Abstract

A manufacturing method for manufacturing a dielectric layer included in a reflective electromagnetic wave absorber, the method including the steps of: preparing a resin composition containing at least one dielectric compound and a resin component, and having a relative permittivity higher than 10.0 at a frequency of 3.7 GHz or 90 GHz; and forming a dielectric layer made from this resin composition and having a thickness of 20 to 7000 μm. A resin composition according to the present disclosure is used to form a dielectric layer included in a reflective electromagnetic wave absorber, the resin composition containing at least one dielectric compound and a resin component, and having a relative permittivity higher than 10.0 at a frequency of 3.7 GHz or 90 GHz.

First claim

What is claimed is:

1 . A method for manufacturing a dielectric layer included in a reflective electromagnetic wave absorber, the method comprising the steps of:
preparing a resin composition containing at least one dielectric compound and a resin component, and having a relative permittivity higher than 10.0 at a frequency of 3.7 GHz; and forming a dielectric layer made from the resin composition and having a thickness of 20 to 7000 μm.

2 . A method for manufacturing a dielectric layer included in a reflective electromagnetic wave absorber, the method comprising the steps of:
preparing a resin composition containing at least one dielectric compound and a resin component, and having a relative permittivity higher than 10.0 at a frequency of 90 GHz; and forming a dielectric layer made from the resin composition and having a thickness of 20 to 7000 μm.

3 . A resin composition used to form a dielectric layer included in a reflective electromagnetic wave absorber, the resin composition comprising:
at least one dielectric compound; and a resin component, the resin composition having a relative permittivity higher than 10.0 at a frequency of 3.7 GHz.

4 . A resin composition used to form a dielectric layer included in a reflective electromagnetic wave absorber, the resin composition comprising:
at least one dielectric compound; and a resin component, the resin composition having a relative permittivity higher than 10.0 at a frequency of 90 GHz.

5 . The resin composition of claim 3 , wherein the dielectric compound has a relative permittivity higher than a relative permittivity of the resin component.

6 . The resin composition of claim 3 , having adhesiveness.

7 . The resin composition of claim 6 , having an adhesive strength of 1.0 N/25 mm or more with respect to a stainless 304 steel sheet.

8 . The resin composition of claim 3 , wherein the dielectric compound is a metal compound.

9 . The resin composition of claim 8 , wherein the metal compound is at least one of titanium oxide and barium titanate.

10 . The resin composition of claim 3 , wherein the resin component has a relative permittivity of 2.5 to 9.5 at a frequency of 3.7 GHz.

11 . The resin composition of claim 3 , wherein the resin component has a relative permittivity of 2.5 to 9.5 at a frequency of 90 GHz.

12 . A laminate comprising:
a dielectric layer made from the resin composition of claim 3 ; and an adhesive layer disposed on at least one surface of the dielectric layer.

Assignees

• Toppan Inc

Inventors

• NISHIYAMA Hiroyoshi
• Shoda Ryo

Classifications

• H01B3/002 Primary

  Inhomogeneous material in general · CPC title

• H05K9/0081 Primary

  Electromagnetic shielding materials, e.g. EMI, RFI shielding (H05K9/0003 takes precedence) · CPC title

• H01G4/33 Primary

  Thin- or thick-film capacitors {(thin- or thick-film circuits; capacitors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof, multistep manufacturing processes therefor)} · CPC title

• H01G4/20

  using combinations of dielectrics from more than one of groups H01G4/02 - H01G4/06 (H01G4/12 takes precedence) · CPC title

• H01G4/206

  inorganic and synthetic material · CPC title