Smart dynamic load simulator for rf power delivery control system

Patent metadata

Field	Value
Publication number	US-2023411119-A1
Application number	US-202217843830-A
Country	US
Kind code	A1
Filing date	Jun 17, 2022
Priority date	Jun 17, 2022
Publication date	Dec 21, 2023
Grant date	—

Abstract

Embodiments disclosed herein include a dynamic load simulator. In an embodiment, the dynamic load simulator comprises an impedance load, a reverse match network, and a smart RF controller. In an embodiment, the smart RF controller comprises a dynamic load generator, and a reverse match controller.

First claim

What is claimed is:

1 . A dynamic load simulator, comprising:
an impedance load; a reverse match network; and a smart RF controller, wherein the smart RF controller comprises:
a dynamic load generator; and
a reverse match controller.

2 . The dynamic load simulator of claim 1 , wherein the reverse match network further comprises a sensor.

3 . The dynamic load simulator of claim 2 , wherein the sensor is a voltage sensor and a current sensor.

4 . The dynamic load simulator of claim 1 , wherein the impedance load is a fixed dummy load.

5 . The dynamic load simulator of claim 4 , wherein the reverse match network is configured to tune the fixed dummy load to a desired impedance load different from the fixed dummy load.

6 . The dynamic load simulator of claim 1 , wherein the impedance load is thermally controlled with a cooling system.

7 . The dynamic load simulator of claim 1 , wherein the dynamic load generator is configured to generate a load impedance output based on inputs comprising the impedance load, RF delivery system parameters, and other measured process parameters.

8 . The dynamic load simulator of claim 7 , wherein the reverse match controller is configured to ensure a fidelity of the load impedance output generated by the dynamic load generator.

9 . The dynamic load simulator of claim 1 , wherein the impedance load, the reverse match network, and the RF controller are components within a single housing.

10 . The dynamic load simulator of claim 1 , wherein the impedance load, the reverse match network, and the smart RF controller are discrete components in different housings.

11 . The dynamic load simulator of claim 1 , wherein the dynamic load simulator is selectively coupled to an RF delivery system.

12 . The dynamic load simulator of claim 11 , wherein the RF delivery system is configured to be switched between a processing chamber and the dynamic load simulator.

13 . A smart RF controller, comprising:
a dynamic load generator configured to provide a load impedance trace on a reverse match network that is coupled to a fixed dummy load; and a reverse match controller.

14 . The smart RF controller of claim 13 , wherein its hardware is implemented as a computer system.

15 . The smart RF controller of claim 13 , wherein the impedance trace is a pre-recorded trace of an impedance of a plasma chamber.

16 . The smart RF controller of claim 13 , wherein load impedance trace is generated by a dynamic model of a plasma chamber.

17 . The smart RF controller of claim 13 , wherein the reverse match controller is an open loop controller, a closed loop controller, or is configured to use iterative learning.

18 . A processing tool, comprising:
an RF delivery system, comprising:
an RF generator; and
an RF match network; and
a switch to selectively coupled the RF delivery system to a plasma chamber or a dynamic load simulator, wherein the dynamic load simulator comprises:
a dummy load;
a reverse match network; and
an RF controller, wherein the RF controller comprises:
a dynamic load generator; and
a reverse match controller.

19 . The processing tool of claim 18 , wherein the dynamic load generator is configured to generate a simulated impedance trace that matches an impedance trace of the plasma chamber during operation.

20 . The processing tool of claim 19 , wherein the simulated impedance trace is a pre-recorded trace of the impedance of the plasma chamber during operation or wherein the simulated impedance trace is generated by a dynamic model of a plasma chamber.

Assignees

• Applied Materials Inc

Inventors

• Yu Jie
• Guo Yue
• Ramaswamy Kartik
• Zhang Tao
• Rauf Shahid
• Forster John
• Bhatia Sidharth
• Zheng Rong Gang

Classifications

• H01J37/32183 Primary

  Matching circuits · CPC title

• H01J37/32926 Primary

  Software, data control or modelling · CPC title