Electronic component, coil component, and method for manufacturing electronic component

Patent metadata

Field	Value
Publication number	US-2023411067-A1
Application number	US-202318333356-A
Country	US
Kind code	A1
Filing date	Jun 12, 2023
Priority date	Jun 17, 2022
Publication date	Dec 21, 2023
Grant date	—

Abstract

In an electronic component including a circuit pattern embedded in an insulating layer, connection reliability between the circuit pattern and a wiring conductor outside the insulating layer is improved. An electronic component includes an insulating layer; a circuit pattern embedded in the insulating layer; a wiring conductor formed outside the insulating layer; and an interlayer connection portion that connects a circuit connection portion, which is a part of the circuit pattern, and the wiring conductor with an opening of the insulating layer interposed therebetween. In the circuit pattern, a thickness of a portion immediately below the interlayer connection portion of the circuit connection portion is larger than an average thickness of a portion other than the circuit connection portion.

First claim

What is claimed is:

1 . An electronic component comprising:
an insulating layer; a circuit pattern embedded in the insulating layer; a wiring conductor outside the insulating layer; and an interlayer connection portion that connects a circuit connection portion, which is a part of the circuit pattern, and the wiring conductor via an opening of the insulating layer, wherein a thickness of a portion of the circuit connection portion of the circuit pattern, the portion being located below the interlayer connection portion, is larger than an average thickness of a portion other than the circuit connection portion of the circuit pattern.

2 . The electronic component according to claim 1 , wherein
a width of the circuit connection portion of the circuit pattern is larger than a width of a portion other than the circuit connection portion.

3 . The electronic component according to claim 1 , wherein
a cross-sectional shape of the circuit pattern along a plane orthogonal to an extending direction of the circuit pattern is a trapezoidal shape in which a length of an upper side which is close to the wiring conductor is shorter than a length of a lower side facing the upper side, and a width of the upper side of the trapezoidal shape in the circuit connection portion of the circuit pattern is larger than a width of an upper side of the trapezoidal shape in the portion other than the circuit connection portion of the circuit pattern.

4 . The electronic component according to claim 1 ,
wherein the circuit pattern includes a seed pattern extending along a bottom surface of the circuit pattern which is a surface being far from the wiring conductor, and wherein a width of the seed pattern extending along the bottom surface in the circuit connection portion of the circuit pattern is larger than a width of the seed pattern in the portion other than the circuit connection portion of the circuit pattern.

5 . The electronic component according to claim 1 , further comprising:
at least two of the circuit patterns stacked in a direction orthogonal to a main surface of the insulating layer.

6 . A coil component which is the electronic component according to claim 1 , wherein
the circuit pattern is configured as a coil.

7 . A coil component which is the electronic component according to claim 2 , wherein
the circuit pattern is configured as a coil.

8 . A coil component which is the electronic component according to claim 3 , wherein
the circuit pattern is configured as a coil.

9 . A coil component which is the electronic component according to claim 4 , wherein
the circuit pattern is configured as a coil.

10 . A coil component which is the electronic component according to claim 5 , wherein
the circuit pattern is configured as a coil.

11 . A method for manufacturing an electronic component, the method comprising:
forming a plurality of insulating walls arranged at predetermined intervals on a metal layer; and forming a circuit pattern by plating and growing a metal between the insulating walls by electrolytic plating, wherein the forming of the insulating walls includes forming a wide opening portion by making at least one of the intervals be wider than other intervals, and the forming of the circuit pattern includes forming a circuit pattern having a thickness of the circuit pattern in the wide opening portion that is larger than a thickness of the circuit pattern in the other opening portion by setting a current density in the electrolytic plating to 10 ASD or more.

12 . A method for manufacturing an electronic component, the method comprising:
forming a plurality of insulating walls arranged at predetermined intervals on a metal layer; and forming a circuit pattern by plating and growing a metal between the insulating walls by electrolytic plating, wherein the forming of the insulating walls includes
forming a wide opening portion by making at least one of the intervals be wider than other intervals, and
exposing a photosensitive resin formed on the metal layer with an irradiation light from a projection exposure device, which is set to off-focus with respect to a surface of the photosensitive resin, wherein a cross section of the insulating wall along a plane orthogonal to an extending direction of the circuit pattern is formed in a reverse tapered shape in which a width of the insulating wall decreases toward the metal layer, and
the forming of the circuit pattern includes
forming the circuit pattern having a thickness of the circuit pattern in wide opening portion that is larger than a thickness of the circuit pattern in the other opening portion by making circulation of a plating solution flowing into the opening portion less likely to occur in the other opening portion than the wide opening portion by the insulating wall having the reverse tapered shape.

Assignees

• Murata Manufacturing Co

Inventors

• Kawakami Yuuki
• Tominaga Ryuichiro
• Kunimori Keisuke
• Yoshioka Yoshimasa

Classifications

• H01F27/2804 Primary

  Printed windings · CPC title

• H01F41/043

  by thick film techniques · CPC title

• H01F27/29

  Terminals; Tapping arrangements {for signal inductances} · CPC title

• H01F27/324

  Insulation between coil and core, between different winding sections, around the coil; Other insulation structures · CPC title

• H01F41/125

  Other insulating structures; Insulating between coil and core, between different winding sections, around the coil · CPC title