Acoustic Measurement of Fabrication Equipment Clearance

Patent metadata

Field	Value
Publication number	US-2023366857-A1
Application number	US-202318354786-A
Country	US
Kind code	A1
Filing date	Jul 19, 2023
Priority date	Nov 16, 2015
Publication date	Nov 16, 2023
Grant date	—

Abstract

Methods and systems disclosed herein use acoustic energy to determine a gap between a wafer and an integrated circuit (IC) processing system and/or determine a thickness of a material layer of the wafer during IC processing implemented by the IC processing system. An exemplary method includes emitting acoustic energy through a substrate and a material layer disposed thereover. The substrate is positioned within an IC processing system. The method further includes receiving reflected acoustic energy from a surface of the substrate and a surface of the material layer disposed thereover and converting the reflected acoustic energy into electrical signals. The electrical signals indicate a thickness of the material layer.

First claim

What is claimed is:

1 . A system comprising:
a chuck configured to retain a substrate; a nozzle configured to deliver fluid to the substrate; an acoustic transducer configured to receive reflected acoustic energy from the substrate and the nozzle and convert the reflected acoustic energy into electrical signals, wherein the acoustic transducer is physically separate from the nozzle; a signal processor connected to the acoustic transducer, wherein the signal processor is configured to receive the electrical signals and determine an alignment between the nozzle and the substrate based on the electrical signals; and wherein, during delivering of the fluid to the substrate, the system is configured to:
when a tip of the nozzle is aligned with the acoustic transducer at a first time, measure a first width of a first gap between the substrate and the tip of the nozzle, wherein the first width is measured based on first reflected acoustic energy received by the acoustic transducer from the substrate and the tip of the nozzle and the first time corresponds with the tip of the nozzle delivering the fluid to a first location of the substrate,
when the tip of the nozzle is aligned with the acoustic transducer at a second time, measure a second width of a second gap between the substrate and the tip of the nozzle, wherein the second width is measured based on second reflected acoustic energy received by the acoustic transducer from the substrate and the tip of the nozzle and the second time corresponds with the tip of the nozzle delivering the fluid to a second location of the substrate, and
determine whether to adjust the alignment between the substrate and the nozzle based on the first width of the first gap at the first time and the second width of the second gap at the second time, wherein the alignment prevents physical contact between the nozzle and the substrate.

2 . The system of claim 1 , further configured to facilitate the acoustic transducer tracking the nozzle during the delivering of the fluid to the substrate.

3 . The system of claim 1 , wherein the signal processor is configured to identify first order echo responses from the electrical signals to determine the first gap and the second gap.

4 . The system of claim 1 , further comprising an armature connected to the acoustic transducer, wherein the armature is configured to move the acoustic transducer, such that the acoustic transducer and the tip of the nozzle are aligned at the first time and the second time.

5 . The system of claim 1 , wherein the chuck, the substrate, and the acoustic transducer are arranged, such that the chuck is not disposed between the acoustic transducer and the substrate.

6 . The system of claim 1 , wherein the substrate and the acoustic transducer are arranged, such that the acoustic transducer is positioned to directly contact the substrate.

7 . The system of claim 1 , wherein:
the fluid includes a liquid and a gas; the nozzle includes a first nozzle and a second nozzle, wherein the first nozzle is configured to deliver the gas and the second nozzle is configured to deliver the liquid; and wherein the tip of the nozzle is the tip of the first nozzle or the tip of the second nozzle.

8 . The system of claim 1 , wherein the chuck is configured to rotate the substrate, the first time corresponds with a first rotation of the substrate, and the second time corresponds with a second rotation of the substrate.

9 . A cleaning system comprising:
a chuck configured to retain and rotate a substrate during a cleaning process; a movable armature having a nozzle mounted thereto, wherein the movable armature is configured to move the nozzle over a first surface of the substrate during the cleaning process and the nozzle is configured to deliver a cleaning fluid to the substrate during the cleaning process; an acoustic transducer positioned along a second surface of the substrate, wherein the second surface is opposite the first surface and the acoustic transducer is configured to receive reflected acoustic energy from the substrate and the nozzle and convert the reflected acoustic energy into electrical signals, wherein the acoustic transducer is physically separate from the nozzle; a signal processor connected to the acoustic transducer, wherein the signal processor is configured to receive the electrical signals and determine an alignment between the nozzle and the substrate based on the electrical signals; and wherein, during delivering of the cleaning fluid to the substrate during the cleaning process, the cleaning system is configured to:
when the nozzle is aligned with the acoustic transducer at a first time, measure a first width of a first gap between the substrate and the nozzle, wherein the first width is measured based on first reflected acoustic energy received by the acoustic transducer from the substrate and the nozzle, the acoustic transducer is physically separate from the nozzle, and the first time corresponds with the delivering the cleaning fluid to a first location of the substrate,
when the nozzle is aligned with the acoustic transducer at a second time, measure a second width of a second gap between the substrate and the nozzle, wherein the second width is measured based on second reflected acoustic energy received by the acoustic transducer from the substrate and the nozzle and the second time corresponds with the nozzle delivering the cleaning fluid to a second location of the substrate, and
adjust the alignment between the substrate and the nozzle based on the first width of the first gap at the first time and the second width of the second gap at the second time, wherein the alignment is adjusted to maintain physical separation of the nozzle and the substrate.

10 . The cleaning system of claim 9 , wherein the first reflected acoustic energy and the second reflected acoustic energy each include acoustic energy reflected from more than one material interface.

11 . The cleaning system of claim 9 , wherein the first time corresponds with a first rotation of the substrate and the second time corresponds with a second rotation of the substrate.

12 . The cleaning system of claim 9 , further configured to heat the cleaning fluid delivered by the nozzle to control a viscosity and evaporation of the cleaning fluid.

13 . The cleaning system of claim 9 , wherein the first surface is a topside surface of the substrate and the second surface is a backside surface of the substrate, the nozzle delivers the cleaning fluid to the topside surface of the substrate, and the chuck is not disposed between the acoustic transducer and the backside surface of the substrate.

14 . The cleaning system of claim 13 , wherein the acoustic transducer directly contacts the backside surface of the substrate.

15 . The cleaning system of claim 9 , further comprising an acoustic transducer armature configured to move the acoustic transducer relative to the nozzle, such that the acoustic transducer tracks the nozzle during the delivering of the cleaning fluid.

16 . A spin-coating system comprising:
a chuck configured to retain a substrate; a nozzle positioned over a first surface of the substrate, wherein the nozzle is configured to deliver a liquid to the first surface of the substrate during a spin-coating process, wherein the chuck is configured to rotate the substrate during the spin-coating process, such that the liquid is distributed across the substrate to form a material layer over the first surface of the substrate; an acoustic transducer positioned over a second surface of the substrat

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Deng jun-hao
• Lin Kuan-Wen
• Chin Sheng-Chi
• Lee Yu-Ching

Classifications

• H10P74/20

  characterised by the properties tested or measured, e.g. structural or electrical properties · CPC title

• H10P72/0604

  Process monitoring, e.g. flow or thickness monitoring · CPC title

• H10P70/00

  Cleaning of wafers, substrates or parts of devices · CPC title

• H10P14/6342

  Liquid deposition, e.g. spin-coating, sol-gel techniques or spray coating · CPC title

• H10P14/46

  using a liquid · CPC title