Heat treatment device and method of manufacturing display panel using the same

Patent metadata

Field	Value
Publication number	US-2023366627-A1
Application number	US-202318132654-A
Country	US
Kind code	A1
Filing date	Apr 10, 2023
Priority date	May 10, 2022
Publication date	Nov 16, 2023
Grant date	—

Abstract

A heat treatment device includes a chamber accommodating a work substrate including a first organic layer, a heater part which is disposed in the chamber and heats the work substrate, an air supply part including a first nozzle which supplies an external air to the chamber, a second nozzle which is disposed in the first nozzle and supplies a process gas to the chamber, and a cover part provided through which an opening overlapping the second nozzle is defined and which is disposed at an end of the first nozzle, which is adjacent to an outlet of the first nozzle, and an air exhaust part exhausting particles in the chamber to an outside of the chamber.

First claim

What is claimed is:

1 . A heat treatment device comprising:
a chamber accommodating a work substrate comprising a first organic layer; a heater part which is disposed in the chamber and heats the work substrate; an air supply part comprising:
a first nozzle which supplies an external air to the chamber;
a second nozzle which is disposed in the first nozzle and supplies a process gas to the chamber; and
a cover part through which an opening overlapping the second nozzle is defined and which is disposed at an end of the first nozzle which is adjacent to an outlet of the first nozzle; and
an air exhaust part which exhausts particles in the chamber to an outside of the chamber.

2 . The heat treatment device of claim 1 , wherein the second nozzle is spaced apart from the cover part at a predetermined distance in a direction in which the second nozzle extends in a cross-section.

3 . The heat treatment device of claim 1 , wherein the second nozzle comprises an outlet disposed in the opening and spaced apart from an inner side surface of the cover part, which defines the opening.

4 . The heat treatment device of claim 1 , wherein the opening has a circular shape or a polygonal shape in a plan view.

5 . The heat treatment device of claim 1 , wherein the cover part comprises:
a first cover part defining the opening; and a second cover part disposed in the opening and having a mesh shape in a plan view.

6 . The heat treatment device of claim 1 , wherein the cover part extends from the end of the first nozzle to a direction inclined with respect to a direction in which the first nozzle extends, and the cover part has a diameter decreasing as a distance from the end of the first nozzle increases.

7 . The heat treatment device of claim 1 , wherein the cover part comprises:
a first sub-portion extending from the end of the first nozzle to a direction substantially perpendicular to a direction in which the first nozzle extends and covering a portion of the outlet of the first nozzle in a cross-section; and a second sub-portion extending from the first sub-portion to a direction away from the outlet of the first nozzle.

8 . The heat treatment device of claim 1 , wherein each of the first nozzle, the second nozzle, and the cover part is provided in plural, and
the air supply part further comprises:
a first connector connected to an inlet of each of first nozzles; and
a second connector connected to an inlet of each of second nozzles and surrounding the first connector.

9 . The heat treatment device of claim 8 , wherein the air supply part further comprises a valve disposed at an end adjacent to an inlet of the first connector.

10 . The heat treatment device of claim 8 , wherein the air supply part further comprises a filter disposed at the inlet of the first connector.

11 . The heat treatment device of claim 8 , wherein the chamber is provided with sidewall openings defined through a sidewall thereof, the first nozzles are respectively inserted into the sidewall openings, and each of the first connector and the second connector is disposed outside the chamber and is disposed adjacent to the sidewall through which the sidewall openings are defined.

12 . The heat treatment device of claim 1 , wherein the process gas comprises an inert gas.

13 . The heat treatment device of claim 1 , wherein the cover part is coupled with the end of the first nozzle by a welding process.

14 . The heat treatment device of claim 1 , wherein the heater part is operated in a first mode, the air supply part supplies the process gas to the chamber in the first mode, the heater part is not operated in a second mode, and the air supply part supplies the process gas and the external air to the chamber in the second mode.

15 . The heat treatment device of claim 14 , wherein the work substrate further comprises a carrier substrate disposed under the first organic layer, and the first organic layer is converted to a second organic layer after the first mode and the second mode are sequentially performed.

16 . The heat treatment device of claim 15 , wherein the second organic layer comprises polyimide.

17 . The heat treatment device of claim 1 , wherein the air supply part further comprises a nozzle supporter disposed in the first nozzle and fixing the second nozzle.

18 . A method of manufacturing a display panel, the method comprising:
providing a work substrate comprising a carrier substrate and a first organic layer formed on the carrier substrate; and forming a second organic layer from the first organic layer using a heat treatment device, wherein the heat treatment device comprises:
a chamber accommodating the work substrate;
a heater part disposed in the chamber;
an air exhaust part exhausting particles in the chamber to an outside of the chamber; and
an air supply part comprising:
a first nozzle;
a second nozzle disposed in the first nozzle to supply a process gas to the chamber; and
a cover part disposed at an end of the first nozzle which is adjacent to an outlet, and

the forming the second organic layer comprises:
operating the heater part to heat the first organic layer; and
supplying an external air to the chamber via the first nozzle to cool the first organic layer.

19 . The method of claim 18 , further comprising:
forming a circuit element layer comprising a transistor and a capacitor on the second organic layer; and forming a light-emitting element layer comprising a light-emitting element on the circuit element layer after the forming the second organic layer.

20 . The method of claim 18 , further comprising:
forming an inorganic layer on the second organic layer; forming a first additional organic layer on the inorganic layer; and forming a second additional organic layer from the first additional organic layer using the heat treatment device after the forming the second organic layer, wherein the forming the second additional organic layer comprises:
operating the heater part to heat the first additional organic layer; and
supplying the external air to the chamber via the first nozzle to cool the first additional organic layer.

Assignees

• Samsung Display Co Ltd

Inventors

• Kim Minsu
• Song Dong-Wook
• Jang Hongrok

Classifications

• H10P72/0432

  mainly by conduction · CPC title

• H10P72/0434

  mainly by convection · CPC title

• F27B2005/162

  through closable or non-closable openings of the chamber walls · CPC title

• F27B2005/164

  Air supply through a set of tubes with openings · CPC title

• F27B5/16

  Arrangements of air or gas supply devices · CPC title