Composite material, heat spreader and semiconductor package

Patent metadata

Field	Value
Publication number	US-2023352363-A1
Application number	US-202118017970-A
Country	US
Kind code	A1
Filing date	Jul 13, 2021
Priority date	Aug 6, 2020
Publication date	Nov 2, 2023
Grant date	—

Abstract

A composite material includes a plurality of first layers and a plurality of second layers. The total number of the first and second layers is 5 or more. The first and second layers are stacked alternately in the thickness direction of the composite material, such that the first layer is located at each of the first and second surfaces. The first layers are formed from a metal material containing copper as a main component. The second layer includes a molybdenum plate and a coper filler. The molybdenum plate has first and second faces that are each an end face in the thickness direction, and a plurality of openings extending through the molybdenum plate from the first face to the second face.

First claim

1 . A composite material in a plate shape having a first surface and a second surface that is an opposite surface to the first surface, the composite material comprising:
a plurality of first layers and a plurality of second layers, wherein a total number of the first layers and the second layers is 5 or more, the first layers and the second layers are stacked alternately in a thickness direction of the composite material, the first surface and the second surface are each formed by the first layer, the first layers are formed from a metal material containing copper as a main component, the second layers include a molybdenum plate and a copper filler, the molybdenum plate has a plurality of openings extending in the thickness direction through the molybdenum plate, the copper filler is disposed to fill an inside of the openings, a thickness of the first layer forming the first surface is 0.025 mm or more and 30 percent or less of a thickness of the composite material, a thickness of the second layer abutting on the first layer forming the first surface is 0.05 mm or more and 35 percent or less of the thickness of the composite material, and in any one of the second layers,
the number of the openings is 2 or more and 12 or less per an area of 1 mm 2 of the first surface, and
a value determined by dividing an average equivalent circle diameter of the openings by the thickness of the second layer is 0.3 or more and 5.0 or less.

2 . The composite material according to claim 1 , wherein the value determined by dividing the average equivalent circle diameter of the openings by the thickness of the second layer is 1.6 or more and less than 5.0.

3 . The composite material according to claim 1 , wherein
a thermal conductivity in the thickness direction at room temperature is 290 W/m·K or more, and a linear expansion coefficient in an intra-layer direction orthogonal to the thickness direction, for a temperature change from room temperature to 800° C., is 9.0 ppm/K or less.

4 . The composite material according to claim 3 , wherein an end temperature difference is 50° C. or less.

5 . The composite material according to claim 1 , wherein
the thermal conductivity in the thickness direction at room temperature is 300 W/m·K or more, and a linear expansion coefficient in an intra-layer direction orthogonal to the thickness direction, for a temperature change from room temperature to 800° C., is 8.5 ppm/K or less.

6 . The composite material according to claim 5 , wherein an end temperature difference is 40° C. or less.

7 . The composite material according to claim 1 , wherein
the molybdenum plate has a first face and a second face that are each an end face in the thickness direction, and an average of respective equivalent circle diameters of the openings in the first face and an average of respective equivalent circle diameters of the openings in the second face are each 0.05 mm or more and 0.35 mm or less.

8 . The composite material according to claim 1 , wherein an average of respective minimum opening areas of the opening is 57 percent or more and 100 percent or less, relative to an average of respective maximum opening areas of the openings.

9 . The composite material according to claim 1 , wherein the total number of the first layers and the second layers is 9 or less.

10 . A heat spreader comprising the composite material according to claim 1 , wherein
the first surface is a contact surface to abut on a heat generation source.

11 . A semiconductor package comprising:
the composite material according to claim 1 ; and a semiconductor device disposed on the first surface.

12 . The semiconductor package according to claim 11 , further comprising a case member formed from a ceramic material, wherein
the case member is disposed on the first surface and surrounds the semiconductor device.

13 . A composite material in a plate shape having a first surface and a second surface that is an opposite surface to the first surface, the composite material comprising:
a plurality of first layers and a plurality of second layers, wherein a total number of the first layers and the second layers is 5 or more and 9 or less, the first layers and the second layers are stacked alternately in a thickness direction of the composite material, the first surface and the second surface are each formed by the first layer, the first layers are formed from a metal material containing copper as a main component, the second layers include a molybdenum plate and a copper filler, the molybdenum plate has a plurality of openings extending in the thickness direction through the molybdenum plate, the copper filler is disposed to fill an inside of the openings, a thickness of the first layer forming the first surface is 0.025 mm or more and 30 percent or less of a thickness of the composite material, a thickness of the second layer abutting on the first layer forming the first surface is 0.05 mm or more and 35 percent or less of the thickness of the composite material, in any one of the second layers,
the number of the openings is 2 or more and 12 or less per an area of 1 mm 2 of the first surface, and
a value determined by dividing an average equivalent circle diameter of the openings by the thickness of the second layer is 0.3 or more and 5.0 or less,
a thermal conductivity in the thickness direction at room temperature is 290 W/m·K or more, a linear expansion coefficient in an intra-layer direction orthogonal to the thickness direction, for a temperature change from room temperature to 800° C., is 9.0 ppm/K or less, the molybdenum plate has a first face and a second face that are each an end face in the thickness direction, an average of respective equivalent circle diameters of the openings in the first face and an average of respective equivalent circle diameters of the openings in the second face are each 0.05 mm or more and 0.35 mm or less, and an average of respective minimum opening areas of the opening is 57 percent or more and 100 percent or less, relative to an average of respective maximum opening areas of the openings.

Assignees

• Sumitomo Electric Industries
• Almt Corp

Inventors

• Maeda Toru
• Miyanaga Miki
• Kondo Daisuke
• Ito Masayuki
• Yamagata Shin-Ichi

Classifications

• H10W40/258

  Metallic materials (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence) · CPC title

• H10W40/255 Primary

  having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates · CPC title

• B32B2307/302

  Conductive · CPC title

• B32B2309/105

  Thickness · CPC title

• B32B2250/42

  Alternating layers, e.g. ABAB(C), AABBAABB(C) · CPC title