Composite material, heat spreader and semiconductor package
US-12525503-B2 · Jan 13, 2026 · US
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Patent family 80117968
This patent family groups 2 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 80117968 |
| Family type | — |
| Earliest priority | Aug 6, 2020 |
| First filing country | US |
| Member publications | 2 |
| Countries | US |
| Representative publication | US12525503B2 — Composite material, heat spreader and semiconductor package |
Representative publication
Best representative member for this family based on priority and filing country.
US12525503B2 — Composite material, heat spreader and semiconductor package (published Jan 13, 2026)
Member publications
Related publications in this family.
Composite material, heat spreader and semiconductor package
US-2023352363-A1 · Nov 2, 2023 · US