Electroplated metal layer on a niobium-titanium substrate

Patent metadata

Field	Value
Publication number	US-2023307812-A1
Application number	US-202318316060-A
Country	US
Kind code	A1
Filing date	May 11, 2023
Priority date	Apr 27, 2020
Publication date	Sep 28, 2023
Grant date	—

Abstract

Devices, systems, and/or methods that can facilitate plating one or more metal layers onto a niobium-titanium substrate are provided. According to an embodiment, a device can comprise a niobium-titanium substrate. The device can further comprise a first metal layer plated on a portion of the niobium-titanium substrate. The device can further comprise a second metal layer plated on the first metal layer. The device can further comprise a third metal layer plated on the second metal layer.

First claim

What is claimed is:

1 . A device, comprising;
a niobium-titanium substrate; a first metal layer plated on a portion of the niobium-titanium substrate; a second metal layer plated on the first metal layer; and a third metal layer plated on the second metal layer.

2 . The device of claim 1 , wherein:
the first metal layer comprises a first electroplated metal layer plated on the portion of the niobium-titanium substrate using a first electroplating process; the second metal layer comprises a second electroplated metal layer plated on the first metal layer using a second electroplating process; and the third metal layer comprises a third electroplated metal layer plated on the second metal layer using a third electroplating process.

3 . The device of claim 1 , wherein:
the first metal layer comprises nickel; the second metal layer comprises copper; and the third metal layer comprises gold.

4 . The device of claim 1 , wherein:
the first metal layer comprises a layer of nickel adhered directly to a surface of the portion of the niobium-titanium substrate; the second metal layer comprises a layer of copper adhered directly to a surface of the first metal layer; and the third metal layer comprises a layer of gold adhered directly to a surface of the second metal layer, thereby facilitating at least one of improved thermal conductivity of the device, reduced oxidation of the device, constant impedance by the device, improved transmission of microwave signals by the device, or improved performance of a quantum system comprising the device.

5 . The device of claim 1 , further comprising:
a metal contact surface soldered to at least one of the first metal layer, the second metal layer, or the third metal layer.

6 . The device of claim 5 , wherein the metal contact surface comprises copper.

7 . The device of claim 5 , wherein the metal contact surface comprises a surface of a coaxial connector.

8 . The device of claim 7 , wherein the coaxial connector comprises a microwave coaxial connector.

9 . The device of claim 7 , wherein the coaxial connector comprises a subminiature version A type connector.

10 . The device of claim 1 , wherein the niobium-titanium substrate comprises at least one of a niobium-titanium sheath or a niobium-titanium wire.

11 . A waveguide device, comprising;
a niobium-titanium substrate; a first metal layer plated on a portion of the niobium-titanium substrate; a second metal layer plated on the first metal layer; and a third metal layer plated on the second metal layer.

12 . The waveguide device of claim 11 , wherein:
the first metal layer comprises a first electroplated metal layer plated on the portion of the niobium-titanium substrate using a first electroplating process; the second metal layer comprises a second electroplated metal layer plated on the first metal layer using a second electroplating process; and the third metal layer comprises a third electroplated metal layer plated on the second metal layer using a third electroplating process.

13 . The waveguide device of claim 11 , wherein:
the first metal layer comprises nickel; the second metal layer comprises copper; and the third metal layer comprises gold.

14 . The waveguide device of claim 11 , wherein:
the first metal layer comprises a layer of nickel adhered directly to a surface of the portion of the niobium-titanium substrate; the second metal layer comprises a layer of copper adhered directly to a surface of the first metal layer; and the third metal layer comprises a layer of gold adhered directly to a surface of the second metal layer, thereby facilitating at least one of improved thermal conductivity of the waveguide device, reduced oxidation of the waveguide device, constant impedance by the waveguide device, improved transmission of microwave signals by the waveguide device, or improved performance of a quantum system comprising the waveguide device.

15 . The waveguide device of claim 11 , further comprising:
a metal contact surface soldered to at least one of the first metal layer, the second metal layer, or the third metal layer.

16 . The waveguide device of claim 15 , wherein the metal contact surface comprises copper.

17 . The waveguide device of claim 15 , wherein the metal contact surface comprises a surface of a coaxial connector.

18 . The waveguide device of claim 17 , wherein the coaxial connector comprises a microwave coaxial connector.

19 . The waveguide device of claim 17 , wherein the coaxial connector comprises a subminiature version A type connector.

20 . The waveguide device of claim 11 , wherein the niobium-titanium substrate comprises at least one of a niobium-titanium sheath or a niobium-titanium wire.

Assignees

• IBM

Inventors

• Gordon Ryan T
• Hall Shawn Anthony
• Luo Yu
• Sandstrom Robert L

Classifications

• G06N10/40

  Physical realisations or architectures of quantum processors or components for manipulating qubits, e.g. qubit coupling or qubit control · CPC title

• H01P3/06 Primary

  Coaxial lines · CPC title

• H01P11/005

  Manufacturing coaxial lines · CPC title

• C25D5/38

  of refractory metals or nickel · CPC title

• G06N10/00

  Quantum computing, i.e. information processing based on quantum-mechanical phenomena · CPC title