Structural adhesive compositions

Patent metadata

Field	Value
Publication number	US-2023279277-A1
Application number	US-202318309236-A
Country	US
Kind code	A1
Filing date	Apr 28, 2023
Priority date	Dec 10, 2015
Publication date	Sep 7, 2023
Grant date	—

Abstract

An adhesive composition comprising an epoxy compound and a compound comprising at least one aminimide functional group is disclosed. The compound comprising the at least one aminimide functional group is present in an amount from 2-8% by weight based on total weight of the adhesive composition and reacts with the epoxy compound upon activation by an external energy source. The adhesive composition also may comprise an amidine salt.

First claim

1 . (canceled)

2 . An adhesive composition comprising:
an epoxy compound; a compound in an amount of two to eight percent by weight based on total weight of the adhesive composition and comprising an aminimide functional group; and a secondary latent curing catalyst comprising an amine, an imidazole, and/or a urea; wherein the compound reacts with the epoxy compound upon activation by an external energy source.

3 . The adhesive composition of claim 2 , wherein the compound comprises a monomeric compound or a polymeric compound.

4 . The adhesive composition of claim 3 , wherein the monomeric compound comprises a reaction product of reactants comprising a monoepoxide, a hydrazine comprising a trivalent nitrogen, and a reactant comprising a carbonyl group.

5 . The adhesive composition of claim 3 , wherein the polymeric compound comprises a reaction product of reactants comprising an epoxy compound, a hydrazine, and an anhydride functional material.

6 . The adhesive composition of claim 2 , wherein the amine comprises a guanidine.

7 . The adhesive composition of claim 2 , wherein the composition comprises the epoxy compound in an amount of 50% to 90% by weight based on total weight of the composition.

8 . The adhesive composition of claim 2 , wherein the epoxy compound comprises an epoxy-capped polyester.

9 . The adhesive composition of claim 2 , wherein the compound further comprises an additional functional group.

10 . The adhesive composition of claim 2 , further comprising an amidine salt.

11 . The adhesive composition of claim 2 , further comprising a reaction product of reactants comprising an amidine and a second component.

12 . The adhesive composition of claim 11 , wherein the second component comprises a phenol.

13 . The adhesive composition of claim 11 , wherein the second component comprises carbonic acid, a salt of carbonic acid, a carbonate, or combinations thereof.

14 . The adhesive composition of claim 2 , further comprising rubber particles having a core/shell structure.

15 . The adhesive composition of claim 2 , wherein the external energy source comprises a temperature of at least 100° C.

16 . A method for forming a bonded substrate comprising:
applying the adhesive composition of claim 2 to a first substrate; contacting a second substrate to the adhesive composition such that the adhesive composition is located between the first substrate and the second substrate; and curing the adhesive composition.

17 . An adhesive comprising the adhesive composition of claim 2 in a cured state.

18 . A substrate comprising the adhesive composition of claim 2 in a cured state.

19 . The substrate of claim 18 , wherein the substrate comprises an automotive frame.

Assignees

• Ppg Ind Ohio Inc

Inventors

• Chao Tien-Chieh
• Nakajima Masayuki
• Zhou Hongying
• Swarup Shanti
• Desai Umesh C

Classifications

• C09J163/00 Primary

  Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins · CPC title

• C08G59/1477

  containing nitrogen · CPC title

• C08G59/4042

  Imines; Imides · CPC title

• C08G59/1455

  Monocarboxylic acids, anhydrides, halides, or low-molecular-weight esters thereof · CPC title

• C08G59/44

  Amides · CPC title