Substrate cleaning method and substrate cleaning apparatus

Patent metadata

Field	Value
Publication number	US-2023234107-A1
Application number	US-202318156399-A
Country	US
Kind code	A1
Filing date	Jan 19, 2023
Priority date	Jan 21, 2022
Publication date	Jul 27, 2023
Grant date	—

Abstract

A substrate cleaning method and a substrate cleaning apparatus are provided. The substrate cleaning method includes a first step of applying a chemical solution to a lower surface of a substrate, and a second step of subsequently applying a bubble-containing liquid to the lower surface of the substrate.

First claim

What is claimed is:

1 . A substrate cleaning method, comprising:
a first step of supplying a chemical solution to a lower surface of a substrate; and a second step of subsequently supplying a bubble-containing liquid to the lower surface of the substrate.

2 . The substrate cleaning method according to claim 1 ,
wherein a solution film of the chemical solution is formed on the lower surface of the substrate by the first step, and the solution film is replaced with the bubble-containing liquid by the second step.

3 . The substrate cleaning method according to claim 1 , comprising a step of generating the bubble-containing liquid before the second step.

4 . The substrate cleaning method according to claim 3 , wherein in the step of generating the bubble-containing liquid, bubbles are generated in a cleaning liquid by ultrasonic waves to generate the bubble-containing liquid.

5 . The substrate cleaning method according to claim 1 , wherein a supply flow rate of the bubble-containing liquid in the second step is higher than a supply flow rate of the chemical solution in the first step.

6 . The substrate cleaning method according to claim 1 ,
wherein in the first step, the chemical solution is supplied from a first nozzle, and in the second step, the bubble-containing liquid is supplied from a second nozzle different from the first nozzle.

7 . The substrate cleaning method according to claim 1 , wherein in the second step, the bubble-containing liquid is supplied from a single tube nozzle.

8 . The substrate cleaning method according to claim 1 , wherein in the second step, the bubble-containing liquid is supplied to near a center of the lower surface of the substrate and to a peripheral portion of the substrate.

9 . The substrate cleaning method according to claim 1 , wherein in the second step, the bubble-containing liquid and an ultrasonic cleaning liquid are supplied to the lower surface of the substrate.

10 . The substrate cleaning method according to claim 1 , wherein in the second step, the bubble-containing liquid and two fluids are supplied to the lower surface of the substrate.

11 . The substrate cleaning method according to claim 1 , wherein the bubble-containing liquid is pure water containing bubbles.

12 . The substrate cleaning method according to claim 1 , wherein bubbles contained in the bubble-containing liquid have a diameter of 1 μm or more and 500 μm or less.

13 . The substrate cleaning method according to claim 1 , wherein bubbles contained in the bubble-containing liquid are bubbles of one or more of nitrogen, hydrogen, ozone, carbon dioxide, and oxygen.

14 . The substrate cleaning method according to claim 13 ,
wherein a metal film is formed on an upper surface of the substrate, and bubbles contained in the bubble-containing liquid include bubbles of nitrogen or hydrogen, or include bubbles of nitrogen and hydrogen.

15 . The substrate cleaning method according to claim 1 , comprising a step of scrub cleaning the lower surface of the substrate before the first step.

16 . The substrate cleaning method according to claim 1 , wherein in the first step, a chemical solution containing bubbles is supplied.

17 . A substrate cleaning apparatus, comprising:
a substrate holding portion that holds a substrate; a first nozzle that supplies a chemical solution to a lower surface of the substrate held; a second nozzle that supplies a bubble-containing liquid to the lower surface of the substrate held; and a control unit that controls the second nozzle to supply the bubble-containing liquid after the first nozzle supplies the chemical solution.

18 . The substrate cleaning apparatus according to claim 17 ,
wherein the second nozzle comprises:
a gas supply unit;
a liquid supply unit;
a bubble-containing liquid generation unit that mixes a gas from the gas supply unit and a liquid from the liquid supply unit so as to generate the bubble-containing liquid;
a housing in which the bubble-containing liquid generation unit is disposed; and
a single tube nozzle that sprays the bubble-containing liquid generated to the lower surface of the substrate.

19 . The substrate cleaning apparatus according to claim 17 ,
wherein the second nozzle comprises:
a gas supply unit;
a liquid supply unit;
a bubble-containing liquid generation unit that mixes a gas from the gas supply unit and a liquid from the liquid supply unit so as to generate the bubble-containing liquid; and
a housing formed with a spray hole through which the bubble-containing liquid generated is sprayed.

20 . The substrate cleaning apparatus according to claim 19 , wherein an inclined surface extending obliquely downward from the spray hole is provided on an upper surface of the housing.

Assignees

• Ebara Corp

Inventors

• Handa Naoyuki
• Hamada Satomi
• Nishi Tomoya

Classifications

• H10P72/0414

  using mainly spraying means, e.g. nozzles · CPC title

• H10P70/20 Primary

  Cleaning during device manufacture · CPC title

• B08B1/32

  using rotary cleaning members · CPC title

• B08B1/10

  characterised by the type of cleaning tool · CPC title

• B08B1/34

  rotating about an axis parallel to the surface · CPC title