Methods for depositing metal on a reactive metal film
US-2015348836-A1 · Dec 3, 2015 · US
Wiring board and method for producing wiring board
US2023203664A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2023203664-A1 |
| Application number | US-202318178596-A |
| Country | US |
| Kind code | A1 |
| Filing date | Mar 6, 2023 |
| Priority date | Sep 8, 2020 |
| Publication date | Jun 29, 2023 |
| Grant date | — |
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- Title
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Abstract
Official abstract text for this publication.
A wiring board includes a substrate having main surfaces and an electrode containing Cu or Ag as a main component on at least one main surface of the substrate, wherein the electrode protrudes from the substrate, a surface of the electrode is covered by a first Ni film containing crystalline Ni as a main component, a surface of the first Ni film is covered by a second Ni film containing amorphous Ni as a main component, and the first Ni film covers a part of a first corner where a side surface of the electrode is in contact with the substrate.
First claim
Opening claim text (preview).
1 . A wiring board comprising: a substrate having main surfaces; and an electrode containing Cu or Ag as a main component on at least one of the main surfaces of the substrate, wherein the electrode protrudes from the substrate, a surface of the electrode is covered by a first Ni film containing crystalline Ni as a main component, a surface of the first Ni film is covered by a second Ni film containing amorphous Ni as a main component, and the first Ni film covers a part of a first corner where a side surface of the electrode is in contact with the substrate. 2 . The wiring board according to claim 1 , wherein the first Ni film contains Ni—B, Ni—N, or pure Ni as a main component, and the second Ni film contains Ni—P as a main component. 3 . A wiring board comprising: a substrate having main surfaces; and an electrode containing Cu or Ag as a main component on at least one of the main surfaces of the substrate, wherein the electrode protrudes from the substrate, a surface of the electrode is covered by a first Ni film, a surface of the first Ni film is covered by a second Ni film, the first Ni film contains Ni—B, Ni—N, or pure Ni as a main component, the second Ni film contains Ni—P as a main component, and the first Ni film covers a part of a first corner where a side surface of the electrode is in contact with the substrate. 4 . The wiring board according to claim 1 , wherein the second Ni film covers a part of a second corner where a side surface of the first Ni film is in contact with the substrate. 5 . The wiring board according to claim 1 , wherein the second Ni film is thicker than the first Ni film. 6 . The wiring board according to claim 1 , wherein a total thickness of the first Ni film and the second Ni film is 3 μm or more and 10 μm or less. 7 . A method of producing the wiring board as defined in claim 1 , the method comprising: forming the first Ni film by an electroless nickel plating treatment using a N-containing reducing agent or a B-containing reducing agent as a reducing agent; and forming the second Ni film by an electroless nickel plating treatment using a P-containing reducing agent as a reducing agent. 8 . The wiring board according to claim 2 , wherein the second Ni film covers a part of a second corner where a side surface of the first Ni film is in contact with the substrate. 9 . The wiring board according to claim 3 , wherein the second Ni film covers a part of a second corner where a side surface of the first Ni film is in contact with the substrate. 10 . The wiring board according to claim 2 , wherein the second Ni film is thicker than the first Ni film. 11 . The wiring board according to claim 3 , wherein the second Ni film is thicker than the first Ni film. 12 . The wiring board according to claim 4 , wherein the second Ni film is thicker than the first Ni film. 13 . The wiring board according to claim 2 , wherein a total thickness of the first Ni film and the second Ni film is 3 μm or more and 10 μm or less. 14 . The wiring board according to claim 3 , wherein a total thickness of the first Ni film and the second Ni film is 3 μm or more and 10 μm or less. 15 . The wiring board according to claim 4 , wherein a total thickness of the first Ni film and the second Ni film is 3 μm or more and 10 μm or less. 16 . The wiring board according to claim 5 , wherein a total thickness of the first Ni film and the second Ni film is 3 μm or more and 10 μm or less. 17 . A method of producing the wiring board as defined in claim 2 , the method comprising: forming the first Ni film by an electroless nickel plating treatment using a N-containing reducing agent or a B-containing reducing agent as a reducing agent; and forming the second Ni film by an electroless nickel plating treatment using a P-containing reducing agent as a reducing agent. 18 . A method of producing the wiring board as defined in claim 3 , the method comprising: forming the first Ni film by an electroless nickel plating treatment using a N-containing reducing agent or a B-containing reducing agent as a reducing agent; and forming the second Ni film by an electroless nickel plating treatment using a P-containing reducing agent as a reducing agent. 19 . A method of producing the wiring board as defined in claim 4 , the method comprising: forming the first Ni film by an electroless nickel plating treatment using a N-containing reducing agent or a B-containing reducing agent as a reducing agent; and forming the second Ni film by an electroless nickel plating treatment using a P-containing reducing agent as a reducing agent. 20 . A method of producing the wiring board as defined in claim 5 , the method comprising: forming the first Ni film by an electroless nickel plating treatment using a N-containing reducing agent or a B-containing reducing agent as a reducing agent; and forming the second Ni film by an electroless nickel plating treatment using a P-containing reducing agent as a reducing agent.
Assignees
Inventors
Classifications
using a liquid · CPC title
of conductive or resistive materials · CPC title
Insulating materials thereof · CPC title
Manufacture or treatment · CPC title
on hard metal substrates · CPC title
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Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US2023203664A1 cover?
- A wiring board includes a substrate having main surfaces and an electrode containing Cu or Ag as a main component on at least one main surface of the substrate, wherein the electrode protrudes from the substrate, a surface of the electrode is covered by a first Ni film containing crystalline Ni as a main component, a surface of the first Ni film is covered by a second Ni film containing amorpho…
- Who is the assignee on this patent?
- Murata Manufacturing Co
- What technology area does this patent fall under?
- Primary CPC classification C23C18/1651. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Thu Jun 29 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).