Wiring board and method for producing wiring board
US-2023203664-A1 · Jun 29, 2023 · US
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Patent family 80631689
This patent family groups 1 related publication across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 80631689 |
| Family type | — |
| Earliest priority | Sep 8, 2020 |
| First filing country | US |
| Member publications | 1 |
| Countries | US |
| Representative publication | US2023203664A1 — Wiring board and method for producing wiring board |
Representative publication
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US2023203664A1 — Wiring board and method for producing wiring board (published Jun 29, 2023)
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