Cutting method for display panel, display panel and display device

Patent metadata

Field	Value
Publication number	US-2023191770-A1
Application number	US-202318108650-A
Country	US
Kind code	A1
Filing date	Feb 12, 2023
Priority date	Jul 31, 2020
Publication date	Jun 22, 2023
Grant date	—

Abstract

The present application discloses a cutting method for a display panel, a display panel and a display device, the cutting method for a display panel including a cutting stage of a side edge of a binding area and a cutting stage of a side edge of a non-binding area, the cutting stage of a side edge of a non-binding area includes steps of: aligning a cutter according to an alignment mark preset on the side edge of the non-binding area on the display panel, so that a cutter on a second substrate side is closer to a display area of the display panel than a cutter on a first substrate side, and cutting the first substrate and the second substrate by the cutter on the second substrate side and the cutter on the first substrate side respectively.

First claim

What is claimed is:

1 . A display panel, comprising:
a first substrate, a second substrate, the second substrate disposed opposite to the first substrate, and at least one chip on film bound to at least one side edge of the first substrate, wherein the display panel is divided into a display area and a non-display area, an edge of the first substrate exceeds an edge of the corresponding second substrate at a side edge where the first substrate is not bound to the chip on film, and the edge of the second substrate is closer to the display area of the display panel than the edge of the first substrate.

2 . The display panel according to claim 1 , wherein the edge of the first substrate also exceeds the edge of the corresponding second substrate at a side edge where the first substrate is bound to the chip on film, and the edge of the second substrate is closer to the display area of the display panel than the edge of the first substrate.

3 . The display panel according to claim 2 , wherein the side edge of the first substrate bound to the chip on film is a side edge of a binding area, and the side edge of the first substrate not bound to the chip on film is a side edge of a non-binding area,
a relative distance between the side edge of the non-binding area of the second substrate and the side edge of the non-binding area of the first substrate is X in the direction parallel to the first substrate and the second substrate, wherein 10 μm≤X≤50 μm.

4 . The display panel according to claim 3 , wherein a relative distance between the side edge of the binding area of the second substrate and the side edge of the binding area of the first substrate is Y in the direction parallel to the first substrate and the second substrate,
wherein 200 μm≤Y≤500 μm.

5 . The display panel according to claim 4 , wherein the value of X is greater than 0 and less than one tenth of the value of Y.

6 . The display panel according to claim 3 , wherein the non-binding area comprises a first non-binding area and a second non-binding area perpendicular to each other.

7 . The display panel according to claim 6 , wherein the first non-binding area has a length equal to the length of the first substrate, the second non-binding area has a length equal to the width of the first substrate, a relative distance between the side edge of the first non-binding area of the second substrate and the side edge of the first non-binding area of the first substrate is X 1 , and a relative distance between the side edge of the second non-binding area of the second substrate and the side edge of the second non-binding area of the first substrate is X 2 , wherein X 1 <X 2 .

8 . The display panel according to claim 4 , wherein the glass thickness of the display panel is 0.5 mm.

9 . A display device, comprising a display panel,
wherein the display panel comprising a first substrate, a second substrate disposed opposite to the first substrate, and at least one chip on film bound to at least one side edge of the first substrate, and wherein the display panel divided into a display area and a non-display area, an edge of the first substrate exceeds an edge of the corresponding second substrate at a side edge where the first substrate is not bound to the chip on film, and the edge of the second substrate is closer to the display area of the display panel than the edge of the first substrate; the edge of the first substrate also exceeds the edge of the corresponding second substrate at the side edge where the first substrate is bound to the chip on film, and the edge of the second substrate is closer to the display area of the display panel than the edge of the first substrate.

10 . The display device according to claim 9 , wherein the side edge of the first substrate bound to the chip on film is a side edge of a binding area, and the side edge of the first substrate not bound to the chip on film is a side edge of a non-binding area,
a relative distance between the side edge of the non-binding area of the second substrate and the side edge of the non-binding area of the first substrate is X in the direction parallel to the first substrate and the second substrate, a relative distance between the side edge of the binding area of the second substrate and the side edge of the binding area of the first substrate is Y in the direction parallel to the first substrate and the second substrate, wherein 10 μm≤X≤50 μm, 200 μm≤Y≤500 μm, and 0<X<0.1Y.

Assignees

• Chuzhou Hkc Optoelectronics Tech Co Ltd
• Hkc Corp Ltd

Inventors

• Yang Qianqian
• Huang Shishuai
• Han Bing
• Yuan Haijiang

Classifications

• B32B2457/20

  Displays, e.g. liquid crystal displays, plasma displays · CPC title

• B32B17/10 Primary

  of synthetic resin · CPC title

• B32B38/185 Primary

  combined with the cutting of one or more layers · CPC title

• H10P72/0428

  Apparatus for mechanical treatment or grinding or cutting · CPC title

• H10P54/00 Primary

  Cutting or separating of wafers, substrates or parts of devices · CPC title