Correction amount specifying apparatus, method, program, and jig

Patent metadata

Field	Value
Publication number	US-2023152248-A1
Application number	US-202217988867-A
Country	US
Kind code	A1
Filing date	Nov 17, 2022
Priority date	Nov 18, 2021
Publication date	May 18, 2023
Grant date	—

Abstract

A correction amount specifying apparatus comprises circuitry for storing diffraction data including a combination of the diffraction angle of the irradiation X-rays with respect to the sample rotation angle and the sample surface height, the diffraction data being acquired by irradiating X-rays to a standard sample that is an aggregate of isotropic and stress free crystal particles, determining a first correspondence relationship based on the diffraction data, and specifying a correction amount of the sample surface height with respect to a desired sample rotation angle and a desired diffraction angle based on the first correspondence relationship.

First claim

What is claimed is:

1 . A correction amount specifying apparatus for specifying a correction amount for a deviation of an X-ray irradiation position caused by rotation of a sample with respect to a measurement system, comprising:
processing circuitry configured to
store diffraction data including a combination of a diffraction angle of the irradiated X-rays with respect to the sample rotation angle and the sample surface height, the diffraction data being acquired by irradiating X-rays to a standard sample that is an aggregate of isotropic and stress free crystal particles,
determine a first correspondence relationship based on the diffraction data, and
specify a correction amount of the sample surface height with respect to a desired sample rotation angle and a desired diffraction angle based on the first correspondence relationship.

2 . The correction amount specifying apparatus according to claim 1 ,
wherein the sample rotation angle is at least one of an angle χ around an axis in a X-rays progressing direction perpendicular to a scattering vector and an angle ω around an axis in a direction perpendicular to an optical path surface.

3 . The correction amount specifying apparatus according to claim 1 ,
wherein the first correspondence relationship is a polynomial formula of the diffraction angle representing the correction amount of the sample surface height, the polynomial formula having a polynomial formula of the sample rotation angle as a coefficient.

4 . The correction amount specifying apparatus according to claim 1 , wherein the processing circuitry is further configured to
control a relative position of the sample with the correction amount of the sample surface height with respect to the desired sample rotation angle and the desired diffraction angle.

5 . The correction amount specifying apparatus according to claim 4 , wherein the processing circuitry is further configured to
store a reference position data in a direction parallel to the sample surface measured using a jig whose position is controlled to be corrected in the sample surface height direction with respect to the desired sample rotation angle and the diffraction angle, and specify a correction amount in a direction parallel to the sample surface based on the reference position data with a second correspondence relationship.

6 . The correction amount specifying apparatus according to claim 5 ,
wherein the second correspondence relationship is a polynomial formula of the diffraction angle representing a correction amount in a direction parallel to the sample surface, the polynomial formula having a polynomial formula of the sample rotation angle as a coefficient.

7 . A jig with a flat-plate shape for correcting a deviation of an X-ray irradiation position caused by rotation of a sample with respect to a measurement system, comprising:
a first region and a second region provided adjacent each other on the receiving surface and respectively formed of materials whose intensity of the scattered X-rays are different, wherein the jig is mounted on the X-ray diffraction apparatus so as to be able to measure the scattered X-ray intensity by scanning the irradiation position to cross the boundary between the first region and the second region.

8 . The jig according to claim 7 ,
wherein the boundaries between the first region and the second region are straight lines perpendicular to each other.

9 . The jig according to claim 7 ,
wherein the first region is formed of stainless steel and the second region is formed of Si.

10 . The jig according to claim 7 , wherein the second region is formed of an aggregate of crystal particles.

11 . A correction amount specifying method for specifying a correction amount for a deviation of an X-ray irradiation position caused by rotation of a sample with respect to a measurement system, comprising the steps of:
acquiring diffraction data including a combination of a diffraction angle of the irradiated X-rays with respect to the sample rotation angle and the sample surface height, the diffraction data being acquired by irradiating X-rays to a standard sample that is an aggregate of isotropic and stress free crystal particles, determining a first correspondence relationship based on the diffraction data, and specifying a correction amount of the sample surface height with respect to a desired sample rotation angle and a desired diffraction angle based on the first correspondence relationship.

12 . A non-transitory computer readable recording medium having recorded thereon a correction amount specifying program for specifying a correction amount for a deviation of an X-ray irradiation position caused by rotation of a sample with respect to a measurement system, causing a computer to execute the processes of:
determining a first correspondence relationship based on a diffraction data including a combination of a diffraction angle of the irradiated X-rays with respect to the sample rotation angle and the sample surface height, the diffraction data being acquired by irradiating X-rays to a standard sample that is an aggregate of isotropic and stress free crystal particles, and specifying a correction amount of the sample surface height with respect to a desired sample rotation angle and a desired diffraction angle based on the first correspondence relationship.

Assignees

• Rigaku Denki Co Ltd

Inventors

• Kikuchi Takuya
• Ozawa Tetsuya
• Matsuo Ryuji

Classifications

• G01N2223/32

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• G01N2223/304

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• G01N2223/611

  patterned objects; electronic devices · CPC title

• G01N23/207 Primary

  Diffractometry using detectors, e.g. using a probe in a central position and one or more displaceable detectors in circumferential positions · CPC title